Digi ConnectCore 8X Kurzanleitung

ConnectCore® 8X

System-on-Module

Hardware Reference Manual

ConnectCore® 8X System-on-Module Hardware Reference Manual 2

Revision history—90002295

Revision Date Description

1P December

2018

Initial release

2P January

2019

Added backdrive caution.

3P May 2019 Updated entire manual, including entire MCAsection, some pin data, block

diagram, and assembly information.

Trademarks and copyright

Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United

States and other countries worldwide. All other trademarks mentioned in this document are the

property of their respective owners.

Disclaimers

Information in this document is subject to change without notice and does not represent a

commitment on the part of Digi International. Digi provides this document “as is,” without warranty of

any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or

merchantability for a particular purpose. Digi may make improvements and/or changes in this manual

or in the product(s) and/or the program(s) described in this manual at any time.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

Customer support

Gather support information: Before contacting Digi technical support for help, gather the following

information:

Product name and model

Product serial number (s)

Firmware version

Operating system/browser (if applicable)

Logs (from time of reported issue)

Trace (if possible)

Description of issue

Steps to reproduce

Contact Digi technical support: Digi offers multiple technical support plans and service packages.

ConnectCore® 8X System-on-Module Hardware Reference Manual 3

Feedback

To provide feedback on this document, email your comments to

techcomm@digi.com

Include the document title and part number (ConnectCore® 8X System-on-Module Hardware

Reference Manual, 90002295 3P) in the subject line of your email.

Contents

About the ConnectCore® 8X

Features and functionality 6

Module variants 9

Block diagrams 9

ConnectCore 8X module 10

NXP i.MX 8X application processor 11

The ConnectCore 8X System-on-module

Power interfaces 11

Reference power architecture scheme 11

System-on-module power rails distribution 12

Electrical characteristics 15

System power-up sequence 18

RTC power and coin cell charger 18

Bootstrap 19

Wireless interfaces 20

WLAN IEEE 802.11a/b/g/n/ac 20

Bluetooth 26

PCI Express 26

CryptoAuthentication device 27

The Micro Controller Assist™ hardware 28

About the Micro Controller Assist 28

Reset control 29

IOs 29

Watchdog 31

Real-time clock 32

Pulse width modulation 32

Power management 33

MCA firmware update 36

IOMUX

Module pinout 38

IOMUX table 39

Extended LGAversion 57

ConnectCore® 8X System-on-Module Hardware Reference Manual 4

ConnectCore® 8X System-on-Module Hardware Reference Manual 5

Module specifications

Environmental specifications 94

Assembly instructions

Moisture sensitivity and shelf life 96

Mounting 96

Coplanarity 96

Solder paste print 96

Stencil 96

SMT pick and place 97

SMT process parameter reference 97

Reflow profile 97

About the ConnectCore® 8X

The ConnectCore 8X is a secure and extremely cost-effective connected System-on-Module platform.

Its innovative Digi SMTplus™ (patent-pending) surface mount form factor allows you to choose

simplified design integration leveraging proven and easy-to-use edge-castellated SMT technology, or a

versatile LGA option for ultimate design flexibility with access to virtually all interfaces.

Built on the NXP i.MX 8X application processor, the module is the intelligent communication engine for

today’s secure connected devices. It integrates dual-Ethernet and pre-certified dual-band Wi-Fi

(802.11a/b/g/n/ac) with dual mode Bluetooth 4.2 connectivity.

Features and functionality

The ConnectCore 8X System-on-module is based on the i.MX 8X processor from NXP. This processor

offers a number of interfaces, some of them multiplexed and not available simultaneously. The module

has the following features:

ni.MX 8X dual/quad Arm Cortex-A35 and single Cortex-M4F cores:

lCortex-A35 cores operate up to 1.2 GHz and support Arm virtualization extensions.

lCortex-M4F core operates up to 266 MHz.

lAArch64 for 64-bit support.

lAArch32 for backward compatibility with Armv7.

nSystem Control Unit (SCU):

lPower control, clocks, and reset.

lBoot ROMs.

lPMIC interface.

lResource Domain Controller.

nGraphics Processing Unit (GPU):

l4x Vec4 shaders with 16 execution units.

lSupports OpenGL 3.0, 2.0; OpenGL EX 3.1, 3.0, 2.0 and 1.1: OpenCL 1.2 FP and 1.1; OpenVG

1.1; and Vulkan.

lHigh-performance 2D Blit Engine.

ConnectCore® 8X System-on-Module Hardware Reference Manual 6

About the ConnectCore® 8X Features and functionality

ConnectCore® 8X System-on-Module Hardware Reference Manual 7

nVideo Processing Unit (VPU):

lH.265 decode (4Kp30).

lH.264 decode (1080p60).

lVP6/VP8 decode (1080p60).

lMPEG-2 decode (1080p60).

lMPEG4, H263, Sorenson Spark decode (1080p).

lRealVideo decode (1080p).

lJPEG dec (64Kx64K image size).

lH.264 encode (1080p30).

nUp to 4 GB, 32-bit LPDDR4-1200 memory.

n16 GB, 8-bit eMMC memory. Higher density available depending on product variant.

nNXP PF8100 Power Management IC (PMIC):

l7x DC/DC buck converters.

l4x LDO regulators.

lOTP (one-time-programmable) memory.

lCoin cell charger.

nCryptoAuthentication device.

nSecurity accelerators:

lEnhanced High Assurance Boot (HAB) secure and encrypted boot.

lRandom Number Generator with a high-quality entropy source generator and NIST

certifiable HMAC-based DRBG.

lRSA up to 4096, Elliptic Curve up to 1023.

lAES-128/192/256, DES, 3DES, ARC4, MD5, SHA-1, SHA-224/256/384/512.

lDedicated Security Controller for Flashless SHE and HSM support, Trustzone, RTIC.

lBuilt-in ECDSA/DSA protocol support.

l10x tamper pins: up to 5 active or 10 passive.

lVoltage and temperature tamper detection to help prevent against side-channel style

attacks.

l64 kB Secure RAM (can be erased via tamper detection).

n2x2 MIMO IEEE802.11 a/b/g/n/ac.

nBluetooth 4.2.

nDebug interfaces:

lSystem JTAG controller.

lSingle Wired Debug (SWD) interface for the MCA.

About the ConnectCore® 8X Features and functionality

ConnectCore® 8X System-on-Module Hardware Reference Manual 8

ni.MX 8X interfaces:

lPCIe 3.0 with L1 substate support. In wireless modules, this interface is used by the

Wireless MAC and is not available for general purposes.

l1x USBOTG 3.0 with PHY - USB 3.0 can be used as USB 2.0.

l1x USBOTG 2.0 (with PHY).

l2x Gb Ethernet with AVB.

l3x CAN/CAN-FD.

lMedia Local Bus (MLB25/50).

l6x UARTs:

o4x UARTs, three of which support hardware flow control. (One of the UARTs with

hardware flow control is used by the Bluetooth and is not available for general purposes

in wireless variants.)

o1x UART tightly coupled with Cortex-M4F cores.

o1x SCU (not available for general use).

l10x I2C. Note that I2C ports associated with a specific PHY (e.g. MIPI DSI) can be used

generally but require the PHY to be powered on even if the PHY itself is not used:

o4x I2C: High Speed, DMA support. One of them (I2C0) is used internally in the SoM and is

not available for general purposes.

o4x I2C: Low Speed, no DMA support.

o1x I2C: PMIC control (dedicated).

o1x I2C: Cortex M4F (dedicated).

l4x SAI:

oSAI0 and SAI1 are transmit/receive.

oSAI2 and SAI3 are receive-only.

l2x Quad SPI or 1x Octal SPI (FlexSPI).

l1x SD 3.0 card interface.

lDisplays:

o2x MIPI-DSI/LVDS.

o1x 24-bit parallel display up to WVGA.

lCameras:

o1x MIPI-CSI camera with 4 lanes.

o1x 8-bit parallel CSI.

l1x Enhanced Serial Audio Interface (ESAI).

l2x ASRC (Asynchronous Sample Rate Converter).

l1x SPDIF.

lMPEG-2 Transport Stream.

l1x 12-bit, 6 channel ADC converter.

l3.3 V/1.8 V GPIO.

l4x PWM channels.

l1x 4x4 KPP (Key Pad Port).

About the ConnectCore® 8X Module variants

ConnectCore® 8X System-on-Module Hardware Reference Manual 9

l1x MQS (Medium Quality Sound).

l4x SPI.

nArm Cortex-M0+ Micro Controller AssistTM (MCA) subsystem:

lCortex-M0+ core operates up to 48MHz.

lPower and reset control.

lReal time clock (RTC).

l19 general purpose IOs (GPIOs), all IRQ capable with debouncing configuration.

l9 analog to digital converters (ADCs), all with comparator capabilities.

lWatchdog.

lTamper detection, both digital and analog.

l8 bytes of non volatile storage (NVRAM).

l3 UARTs, with optional hardware handshake.

l10 pulse width modulators (PWMs).

Module variants

Part number Variant Description CPU1eMMC LDPDR4

WiFi+

Bluetooth

CC-WMX-JM8E-NN 0x02 ConnectCore 8X

QuadXPlus 1.2GHz,

16GB eMMC, 2GB

LPDDR4, -40/+85C,

Wireless, Bluetooth

QuadXPlus

Quad-core

Automotive with

Cortex-M4, VPU,

GPU -

40ºC/125ºC

1.2GHz

16 GB 2 GB YES

CC-MX-JM8D-ZN 0x03 ConnectCore 8X

QuadXPlus 1.2GHz,

8GB eMMC, 2GB

LPDDR4, -40/+85C

QuadXPlus

Quad-core

Automotive with

Cortex-M4, VPU,

GPU -

40ºC/125ºC

1.2GHz

8 GB 2 GB NO

1CPU temperature is Tj (junction)

Note Contact your Digi salesperson for information on other variant configurations.

Block diagrams

The following figures show block diagrams of the ConnectCore 8X module and of the NXP i.MX 8X

application processor.

About the ConnectCore® 8X Block diagrams

ConnectCore® 8X System-on-Module Hardware Reference Manual 10

ConnectCore 8X module

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