Digi ConnectCore 6 Plus Kurzanleitung

ConnectCore 6 Plus

Hardware Reference Manual

Revision history—90002278

Revision Date Description

G August 2020 Revised MCA pinout comments, added MCA

functionality note.

H October 2021 Added safety instructions and UKCA labeling

requirements.

J December 2021 Listed new Bluetooth IDs.

K January 2022 Added Japan certifications.

L July 2022 Added additional FCC-approved antennas.

M November 2023 Added Heatsink topic with maximum perpendicular

pressure value.

Trademarks and copyright

Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United

States and other countries worldwide. All other trademarks mentioned in this document are the

property of their respective owners.

Disclaimers

Information in this document is subject to change without notice and does not represent a

commitment on the part of Digi International. Digi provides this document “as is,” without warranty

of any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or

merchantability for a particular purpose. Digi may make improvements and/or changes in this

manual or in the product(s) and/or the program(s) described in this manual at any time.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

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ConnectCore 6 Plus Hardware Reference Manual

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ConnectCore 6 Plus Hardware Reference Manual

Contents

About the ConnectCore 6 Plus

Features and functionality 7

Safety instructions 8

Block diagram 9

Power supply architecture 9

Bootstrap 13

Wireless interfaces 15

WLAN IEEE 802.11a/b/g/n/ac 16

Modulation and data rates 16

RF channels 18

Receive sensitivity 21

Transmit power 21

Bluetooth 22

MCA hardware 22

Supported devices 22

MCA pinout 23

Shared I2C bus 31

Shared SPI bus 32

CryptoAuthentication device 33

Module pinout 34

Pinout differences between ConnectCore 6 and ConnectCore 6 Plus 85

Signal use limitations 86

Specifications for the ConnectCore 6 Plus

Electrical characteristics 89

Voltage supplies 89

Power consumption 89

Power consumption use cases 89

Global power consumption 90

Environmental specifications 90

Heatsink 91

Linux - Android users 91

Assembly instructions

Moisture sensitivity and shelf life 93

Mounting 93

Coplanarity 93

Solder paste print 93

ConnectCore 6 Plus Hardware Reference Manual

Stencil 93

SMT pick and place 94

SMT process parameter reference 94

Reflow profile 94

Regulatory information and certifications

United States FCC 97

Labeling requirements 97

Maximum power and frequency specifications (FCC) 98

FCC notices 99

FCC-approved antennas 99

RF exposure 100

Canada (ISED) 100

Maximum power and frequency specifications 100

Labeling requirements 101

Transmitters with detachable antennas 101

Europe ETSI and UKCA 101

Maximum power and frequency specifications (Europe ETSI) 102

CE and UKCA OEM labeling requirements 104

Declarations of Conformity 105

Approved antennas 105

Bluetooth SIG-qualified hardware and firmware 105

Japan 106

Approval Label (MIC Marking) 107

About the ConnectCore 6 Plus

The ConnectCore 6 Plus is an integrated platform solution with processor speed up to 1.2 GHz and

pre-certified dual-band Wi-Fi (802.11a/b/g/n/ac) with Bluetooth 5.0 dual mode connectivity.

Cloud Connector integration, as part of the Digi Linux and Android software platform support, offers

secure remote management and web services capabilities through Digi Remote Manager. Digi

also offers custom Remote Manager hardware and wireless design services as well as end-to-end

solutions for cloud integration and app development.

Features and functionality 7

Safety instructions 8

Block diagram 9

Power supply architecture 9

Bootstrap 13

Wireless interfaces 15

MCA hardware 22

CryptoAuthentication device 33

Module pinout 34

Signal use limitations 86

ConnectCore 6 Plus Hardware Reference Manual

About the ConnectCore 6 Plus Features and functionality

ConnectCore 6 Plus Hardware Reference Manual

Note To serve our customers most effectively, Digi International Inc. is consolidating its cloud

services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This

phased process does not affect device functionality or the functionality of the web services and

other features. However, you will find instances of both Device Cloud and Digi Remote Manager in

some documentation, firmware, and user interfaces.

Features and functionality

The ConnectCore 6 Plus module is based on the i.MX6QP processor from NXP. This processor

offers a high number of interfaces. Most of these interfaces are multiplexed and are not available

simultaneously. The module has the following features:

ni.MX6QP ARM Cortex-A9 cores operating at speed up to 1.0 GHz

l32 Kbytes L1 instruction cache

l32 Kbytes L1 data cache

lUp to 1 MB unified instruction/data L2 cache

lNEON MPE (Media Processing Engine) co-processor

nGraphical hardware accelerators:

lIPU (Image Processing Unit)

lVPU (Video Processing Unit)

l3D GPU (Graphics Processing Unit) version 6

l2D GPU (Graphics Processing Unit) version 3

lGPU (OpenVG 1.1 Graphics Processing Unit)

lPrefetch and resolve engine

lPrefetch and resolve gasket

lASRC (Asynchronous Sample Rate Converter)

n64-bit DDR3-1066 memory interface with a density up to 2 GBytes

n8-bit eMMC support

nDialog DA9063 power management IC (PMIC)

l6x DC/DC buck converters

l11x LDO regulators

lRTC with rechargeable coin cell battery support

l10-bit ADC channels

lGPIO pins

nIEEE 802.11 a/b/g/n/ac WLAN interface

nBluetooth version 4.2 dual mode

nCortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

nDebug interfaces:

lStandard JTAG controller IEEE 1149.1

lETM/ETB support

About the ConnectCore 6 Plus Safety instructions

ConnectCore 6 Plus Hardware Reference Manual

nSupport of i.MX6QP typical interfaces:

l16/32-bit data/address bus

lSATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)

lDisplay support

oHDMI

o24-bit parallel bus

oDual LVDS

oMIPI/DSI

l2x camera (20-bit parallel bus, MIPI/CSI)

lMMC/SD/SDIO

l1x USB OTG with integrated PHY

l3x USB Host

lPCI Express Gen 2.0 lane

l10/100/1000 M Ethernet MAC

lUART, SPI, I2C, PWM, CAN, I2S and GPIO

nUltra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads

nSecurity accelerators:

lARMTrustZone

lCAAM (Cryptographic Acceleration and Assurance Module)

lSNVS (Secure Non-volatile Storage)

lCSU (Central Security Unit)

lA-HABv4 (Advanced High-assurance Boot)

Safety instructions

nThe ConnectCore 6 Plus module cannot be guaranteed operation due to the radio link and

so should not be used for interlocks in safety critical devices such as machines or

automotive applications.

nThe ConnectCore 6 Plus module has not been approved for use in (this list is not

exhaustive):

lnuclear applications

lexplosive or flammable atmospheres

nThere are no user serviceable components inside the ConnectCore 6 Plus module. Do not

remove the shield or modify the ConnectCore 6 Plus in any way. Modifications may exclude

the module from any warranty and can cause the ConnectCore 6 Plus to operate outside of

regulatory compliance for a given country, leading to the possible illegal operation of the

radio.

nUse industry standard ESD protection when handling the ConnectCore 6 Plus module.

nTake care while handling to avoid electrical damage to the PCB and components.

nDo not expose ConnectCore 6 Plus modules to water or moisture.

nUse this product with the antennas specified in the ConnectCore 6 Plus module user guides.

About the ConnectCore 6 Plus Block diagram

ConnectCore 6 Plus Hardware Reference Manual

nThe end user must be told how to remove power from the ConnectCore 6 Plus module or to

locate the antennas 20 cm from humans or animals.

Block diagram

The figure below shows the block diagram of the NXP i.MX6QP application processor.

Power supply architecture

The ConnectCore 6 Plus provides a primary 5 V power supply input. This supply is the main power

domain to the on-module Dialog DA9063 power management IC (PMIC), which generates all

required supply voltages for the module components as well as the carrier board.

The module provides support for a backup battery (coin-cell or super cap) powering the real-time

clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also

supported.

The PMIC generates the following power domains that are available on the module pads:

nOne PMIC switching regulator:

lVGEN_3V3

nFive PMIC LDO:

lVLDO2

lVLDO3_MCA

About the ConnectCore 6 Plus Power supply architecture

ConnectCore 6 Plus Hardware Reference Manual

lVLDO4

lVLDO6

lVLDO8

lVDD_SD2

lVDD_WLAN_SD1

Signal

name

PMIC

regulator

Output

voltage

Output

accuracy

Maximum

current

Dropout

voltage

(MAX)

Turn

time

(MAX)

Turn

off

time

(MAX)

Quiescent

current in

OFF

mode

(TYP)

VGEN_

3V3

BUCKPER

3.3 V +/-3% 1500 mA - 1 µA 1.2 ms -

Note The maximum current consumption mentioned in the previous table is a combination of the

current consumed by the module (max 500 mA) and by the carrier board for external use (1000

mA).

The table below provides the characteristics of the optional LDO outputs:

Signal

name

PMIC

regulator

Output

voltage

Output

accuracy

Default

voltage

Maximum

current

Drop

output

voltage

(MAX)

Quiescent

current in

OFF mode

(TYP)

VLDO2 LDO2 0.6-1.86

+/-3% 1.8 V 200 mA 150 mV 1 µA

VLDO3_

MCA

LDO3 0.9-3.44

+/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO4 LDO4 0.9-3.44

+/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO6 LDO6 0.9-3.6 V +/-3% 3.3 V 200 mA 150 mV 1 µA

VLDO8 LDO8 0.9-3.6 V +/-3% 3.3 V 200 mA 150 mV 1 µA

VDD_

SD2

LDO9 0.95 -

3.6 V

+/-1% 3.3 V 200 mA 150 mV 1 µA

VDD_

WLAN_

SD1

LDO10 0.9 - 3.6

+/-3% 3.3 V 300 mA 150 mV 1 µA

Signal name Turn on time (MAX) Turn off time (MAX)

VLDO2 150 µs 1 ms

VLDO3_MCA 300 µs 1 ms

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