EMC CLARiiON DAE2P Anwendungshandbuch
EMC Corporation
Corporate Headquarters:
Hopkinton, MA 01748-9103
1
-508-435-1000
www.EMC.com
EMC CLARiiON
DAE2P and DAE3P Disk-Array Enclosures
HARDWARE REFERENCE
P/N 300-002-407
REV A04
DAE2P/DAE3P Hardware Reference
ii
Copyright © 2005 - 2006 EMC Corporation. All rights reserved.
Published August, 2006
EMC believes the information in this publication is accurate as of its publication date. The
information is subject to change without notice.
THE INFORMATION IN THIS PUBLICATION IS PROVIDED “AS IS.” EMC CORPORATION
MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WITH RESPECT TO THE
INFORMATION IN THIS PUBLICATION, AND SPECIFICALLY DISCLAIMS IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Use, copying, and distribution of any EMC software described in this publication requires an
applicable software license.
For the most up-to-date listing of EMC product names, see EMC Corporation Trademarks on
EMC.com.
All other trademarks used herein are the property of their respective owners.
DAE2P/DAE3P Hardware Reference iii
Regulatory Notices Product Type(s) KTN-STL, KTN-STL4
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Testing was done with shielded cables. Therefore, in order to comply with the FCC regulations, you must use shielded
cables with your installation. Changes or modifications to this unit not expressly approved by the party responsible
for compliance could void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense.
This Class A digital apparatus complies with Canadian ICES-003
Cet appareil numérique de la classe A est conforme à la norme NMB-003 du Canada
Manufacturer’s Declaration of Conformity - CE mark
This equipment has been tested and found to comply with the requirements of European Community Council
Directives 89/336/EEC, 73/23/EEC, and 98/68/EEC relating to electromagnetic compatibility and product safety
respectively.
This product complies with EN55022, CISPR22 and AS/NZS CISPR22 Class A.
This is a Class A product. In a domestic environment this product may cause radio interference in which case the user
may be required to take adequate measures.
DAE2P/DAE3P Hardware Reference
iv
Standards Certification and Compliance
Rackmount disk enclosures are tested and certified for compliance with the international environmental and safety
specifications listed below and marked to indicate such compliance and certification as required.
EMI Standards
Standard Description
CSA 22.2 60950 3rd
Edition
Safety of Information Technology Equipment including Electrical
Business Equipment
TUV GS EN 60950-2000
UL 60950 3rd Edition
GOST
CE Mark European EMC Directive & Low Voltage Directive Requirements
Standard Description
FCC Part 15 Class A, Radio Frequency Device Requirements
ICES-003 Class A, Interference-Causing Equipment Standard - Digital
Apparatus
CE Mark European EMC Directive & Low Voltage Directive Requirements.
VCCI Class A, Voluntary Control Council for Interference
AS/NZS CISPR22 Class A, Electromagnetic Interference - Limits & Methods of
Measurement of ITE
CNS13438 BSMI EMC Requirements
DAE2P/DAE3P Hardware Reference v
Preface............................................................................................................................. ix
Warnings and cautions.......................................................................................... xiii
Chapter 1 About DAE2P and DAE3P disk enclosures
Introduction...................................................................................... 1-2
Link Control Cards (LCCs)............................................................. 1-8
Disk modules.................................................................................... 1-9
Power supply/system cooling modules .................................... 1-11
Chapter 2 Installing a DAE2P/DAE3P
Requirements.................................................................................... 2-2
Installing a disk enclosure in a cabinet......................................... 2-3
Setting up an installed disk enclosure .......................................... 2-4
Connecting AC Power..................................................................... 2-5
Setting the enclosure address....................................................... 2-10
Connecting the DAE2P/DAE3P to the back end bus............... 2-12
Binding disk modules into RAID groups................................... 2-15
Chapter 3 Servicing a DAE2P/DAE3P
Monitoring disk enclosure status .................................................. 3-2
Handling FRUs................................................................................. 3-6
Replacing or adding a disk module............................................ 3-10
Replacing an LCC module............................................................ 3-17
Replacing a power supply/system cooling module................. 3-20
Contents
DAE2P/DAE3P Hardware Reference
vi
Contents
Appendix A Technical specifications
Enclosure specifications ................................................................ A-2
Operating limits ............................................................................. A-5
Index................................................................................................................................ i-1
DAE2P/DAE3P Hardware Reference vii
1-1 DAE2P/DAE3P ............................................................................................. 1-2
1-2 DAE2P/DAE3P front LED display ............................................................ 1-4
1-3 DAE2P/DAE3P rear components .............................................................. 1-5
1-4 Disk enclosure rear view — LEDs and connectors .................................. 1-5
1-5 Disk enclosure bus and address indicators ............................................... 1-6
1-6 Disk enclosure front bezel ............................................................................ 1-7
1-7 LCC connectors and status LEDs ................................................................ 1-8
1-8 Disk modules ............................................................................................... 1-10
1-9 Power/cooling module LEDs .................................................................... 1-12
2-1 Plugging in the AC line cords ..................................................................... 2-5
2-2 Connecting DAE2P power cords (CX300/CX500 storage system) ........ 2-7
2-3 Connecting DAE3P power cords (CX3-80 storage system) .................... 2-8
2-4 Setting the enclosure address (EA) ........................................................... 2-11
2-5 Connecting a disk enclosure to another FC device ................................ 2-12
2-6 Cabling disk enclosures together — two Fibre Channel buses ............ 2-13
2-7 Cabling DAE2Ps/DAE3Ps together — four Fibre Channel buses ....... 2-14
3-1 Front disk enclosure and disk module status lights (bezel removed) ... 3-2
3-2 Enclosure address and bus ID indicators .................................................. 3-4
3-3 Power/cooling module status indicators .................................................. 3-5
3-4 LCC status LEDs ............................................................................................ 3-5
3-5 Disk module comparison ........................................................................... 3-10
3-6 Unlocking and removing the front bezel ................................................. 3-12
3-7 Removing a disk filler module .................................................................. 3-13
3-8 Removing a disk module ........................................................................... 3-14
3-9 Installing a disk or filler module ............................................................... 3-15
3-10 Installing and locking the front bezel ....................................................... 3-16
3-11 Removing a copper cable from an LCC ................................................... 3-17
3-12 Removing an LCC ....................................................................................... 3-18
Figures
DAE2P/DAE3P Hardware Reference
viii
Contents
3-13 Installing an LCC ........................................................................................ 3-18
3-14 Reconnecting a copper cable to an LCC .................................................. 3-19
3-15 Unplugging the AC power cord ............................................................... 3-20
3-16 Removing a power/cooling module ........................................................ 3-21
3-17 Installing a power/cooling module ......................................................... 3-21
3-18 Plugging in the power cord ....................................................................... 3-22
DAE2P/DAE3P Hardware Reference ix
Preface
This manual is your primary source of information about EMC
CLARiiON 2- and 4-gigabit UltraPoint disk-array enclosure (DAE2P
and DAE3P) hardware.
The DAE2P/DAE3P is often called a disk enclosure.
Audience This guide is part of the DAE2P and DAE3P documentation set, and
is intended for use by system administrators and others responsible
for the installation, setup, and maintenance of the product.
Readers of this guide are expected to be familiar with the following
topics:
◆Storage-system operation
◆Basic computer hardware safety and maintenance procedures.
Organization The information in this guide is organized as follows:
Chapter 1, “About DAE2P and DAE3P disk enclosures,” provides a
descriptive overview of the disk enclosure.
Chapter 2, “Installing a DAE2P/DAE3P,” describes how to set up and
power up the enclosure(s) in your cabinet.
Chapter 3, “Servicing a DAE2P/DAE3P,” provides instructions and
procedures for recognizing and replacing failed components.
Appendix A, “Technical specifications,” lists operating limits,
shipping and storage requirements, and technical specifications.
xDAE2P/DAE3P Hardware Reference
Preface
Related
documentation EMC Rails and Enclosures (CX-Series Storage Systems) Field Installation
Guide (P/N 300-001-799)
EMC Rails and Enclosures (CX3-Series Storage Systems) Field Installation
Guide (P/N 300-003-630)
EMC Navisphere Manager Administrator’s Guide (P/N 300-003-511)
Planning your CX3-Series Fibre Channel Storage System Configuration
Available on EMC Powerlink
EMC Navisphere Security Administrator’s Guide (P/N 069001124)
EMC Installation Roadmap for CX3-Series, CX-Series, AX-Series, and
FC-Series Storage Systems (P/N 069001166)
EMC Storage Systems CX-Series Disk and FLARE OE Matrix
(P/N 014003111)
Conventions used in
this guide EMC uses the following conventions for notes, cautions, warnings,
and danger notices.
A note presents information that is important, but not hazard-related.
CAUTION
!
A caution contains information essential to avoid data loss or
damage to the system or equipment. The caution may apply to
hardware or software.
WARNING
A warning contains information essential to avoid a hazard that can
cause severe personal injury, death, or substantial property damage
if you ignore the warning.
DANGER
A danger notice contains information essential to avoid a hazard
that will cause severe personal injury, death, or substantial property
damage if you ignore the message.
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