EMC HD400 Montageanleitung
Abstract
This document provides clear guidance for end-of-life recyclers on how
to identify and disassemble reportable materials in compliance with the
Waste Electrical and Electronic Equipment (WEEE) directive. The
document does not replace disposal instructions in EMC contracts, or
those included in EMC Product and Residuals Disposal Guidelines.
September 2015
WEEE DISASSEMBLY INSTRUCTIONS
For the HD400 Disk Processor Enclosure
2
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
Copyright © 2015 EMC Corporation. All Rights Reserved.
EMC believes the information in this publication is accurate as of its
publication date. The information is subject to change without notice.
The information in this publication is provided “as is.” EMC Corporation
makes no representations or warranties of any kind with respect to the
information in this publication, and specifically disclaims implied
warranties of merchantability or fitness for a particular purpose.
Use, copying, and distribution of any EMC software described in this
publication requires an applicable software license.
For the most up-to-date listing of EMC product names, see EMC
Corporation Trademarks on EMC.com.
Part Number: 302-001-461
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WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
Table of Contents
1.0 Document Purpose............................................................................................................... 4
2.0 Important Notice................................................................................................................... 4
3.0 How to Use these Instructions............................................................................................. 4
4.0 Related Documentation........................................................................................................ 4
5.0 Brand Owner Identification.................................................................................................. 4
6.0 Acronyms ............................................................................................................................. 5
7.0 Product Identification........................................................................................................... 7
7.0.1 HD400 DPE.......................................................................................................................... 7
8.0 Product Photos..................................................................................................................... 8
9.0 Locating Main Assemblies with Reportable Materials........................................................ 9
9.0.2.1 Locating materials on a Fan Module............................................................................... 10
9.0.2.2 Locating Materials on a Power Supply ........................................................................... 12
9.0.2.3 Locating Materials on the Suitcase ............................................................................. 13
9.0.2.3.1 HD400 PCBs............................................................................................................... 15
9.0.2.4 Locating Materials on the Base Board PCB ................................................................ 19
10.0 HD400 Accessories and Optional Equipment ................................................................. 19
10.0.1 Locating Materials on a 3.5-inch Hard Disk Drive............................................................ 21
10.0.2 Locating Materials on a 2.5-inch Hard Disk Drive............................................................ 22
11.0 Reportable Materials on the HD400 ................................................................................. 23
11.1 Materials of Interest to Recyclers.................................................................................... 25
11.2 Precious Metals................................................................................................................ 27
11.3 Plastic Part Markings ....................................................................................................... 27
12.0 Disassembly Details......................................................................................................... 28
12.0.1 Required Tools for Disassembly...................................................................................... 28
12.0.2 Safety Precautions........................................................................................................... 28
12.0.3 Disassembling the HD400 Enclosure ........................................................................... 29
12.0.3.1 Removing a Hard Disk Drive...................................................................................... 29
12.0.3.1.1 Disassembling a 3.5-inch Hard Disk Drive............................................................ 30
12.0.3.1.2 Disassembling a 2.5-inch Hard Disk Drive............................................................ 32
12.0.3.2 Removing the Front Panel ......................................................................................... 33
12.0.3.1 Disassembling a fan module .................................................................................... 36
12.0.3.4 Removing the Power Supplies................................................................................... 37
12.0.3.4.1 Disassembling the Power Supply .............................................................................. 38
12.0.3.5 Removing the Suitcase.............................................................................................. 39
15.0.5.1 Removing Components from the Suitcase............................................................... 40
12.0.3.6 Disassembling the Chassis to Retrieve the Base Board PCB ................................ 58
16.0 RoHS Restricted Materials............................................................................................... 64
4
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
1.0 Document Purpose
This document provides the most accurate information available on the location and removal of
reportable materials as required by the European Union (EU) Waste Electrical and Electronic
Equipment (WEEE) Directive 2002/96/EC.
For more information on EMC’s environmental initiatives, policies, and goals go to:
http://www.emc.com/corporate/sustainability/index.htm
2.0 Important Notice
This document does not in any way replace disposal instructions in EMC contracts, or those
included in EMC Product and Residuals Disposal Guidelines.
3.0 How to Use these Instructions
EMC recommends that you adopt the following workflow to ensure the greatest efficiency in
compliance with WEEE legislation.
1. See 8.0 Product Photos to familiarize yourself with the hardware.
2. Review the items listed in 11.0 Reportable Materials on the HD400 Disk Processor
Enclosure, 11.1 Materials of Interest to Recyclers, and 11.2 Precious Metals to learn the
recyclable materials present in this product.
3. Review 12.0.2 Safety Precautions prior to disassembling the product.
4. Review 12.0 Disassembly Details for removal procedures.
4.0 Related Documentation
EMC provides separate WEEE disassembly instructions per product platform. Contact the
required.
5.0 Brand Owner Identification
EMC Corporation
176 South Street
Hopkinton, Massachusetts 01748
U.S.A
http://www.emc.com
5
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
6.0 Acronyms
Table 1 defines acronyms that may be used in the document.
Table 1 Acronyms List
ABS
Acrylonitrile butadiene styrene
Ag
Silver
Au
Gold
BBU
Battery Backup Unit
Cd
Cadmium
CFC
Chlorofluorocarbons
CPU
Central Processing Unit
Cr Vl
Hexavalent Chromium
Cu
Copper
DIMMs
Dual in-line Memory Modules
DPE
Disk Processor Enclosure
DRL
Device Regulatory Label
EMI
Electromagnetic Interference
ESD
Electrostatic discharge
EU
European Union
GWP
Global Warming Potential
HC
Hydrocarbons
HCFC
Hydrochlorofluorocarbons
HDPE
High-Density Polyethylene
Hg
Mercury
ICM
Interconnect Module
LCC
Link Control Card
LDPE
Low-Density Polyethylene
Pb
Lead
PBB
Polybrominated Biphenyls
PBDE
Polybrominated Diphenyl Ethers
PC
Polycarbonate
PCB
Printed Circuit Board
PCT
Polychlorinated Terphenyl
Pd
Palladium
PETE or PET
Polyethylene Terephthalate
6
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
PP
Polypropylene
PS
Polystyrene
Pt
Platinum
PVC
Polyvinyl Chloride
RoHS
Restriction of Hazardous Substances
SAS
Serial Attached SCSI
SP
Storage Processor
SPE
Storage Processor Enclosure
SSD
Solid State Disk
V
Volt
WEEE
Waste Electrical and Electronic Equipment
7
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
7.0 Product Identification
7.0.1 HD400 DPE
Note: EMC uses the Product Regulatory Model Name (see first item in Table 2) as the main
identifier throughout this document. Locate the product regulatory model name on the Device
Rating Label (DRL) affixed to a rectangular recess on the top of the product chassis.
Table 2 Product Regulatory Model Name and Specifications
Product Regulatory Model Name
HD400
Product Description
4U, 60-slot Disk Processor Enclosure (DPE)
Part Number
900-569-002
Note: The part number cited denotes the
base chassis (includes midplane). Each
platform supports many different EMC
products. Contact your EMC Sales
Representative for product-specific part
numbers.
Dimensions
194.7 cm (H) x 76.7 cm (W) x 106.4 cm (D)
Mass
96.6 kg (based on a fully populated unit)
8
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
8.0 Product Photos
Figure 1. HD400 front view
Figure 2 HD400 rear view
9
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
9.0 Locating Main Assemblies with Reportable Materials
9.0.1 Locating assemblies with reportable materials on the Front and
Rear Assemblies.
Figure 3 –Front Panel Assemblies
Figure 4 –Rear Panel Assemblies
1
2
3
4
5
10
WEEE Disassembly Instructions for the
HD400 Disk Processor Enclosure
Table 3 Assemblies on the Front and Rear
Item
Component
Item
Component
1
Front Panel Assembly
4
Suitcase Assembly
2
3 Fan Modules
5
Suitcase Assembly Handle
3
2 Power Supplies
9.0.2.1 Locating materials on a Fan Module
Figures 5a and 5b, along with Table 4 identify components on the fan module.
Figure 5a –Components on Fan Module
6
7
8
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