EPOX EP-3S1M Bedienungsanleitung

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 1.1

September 26, 2000

An Intel 815 series chipset basedAn Intel 815 series chipset based

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EP-3S1MEP-3S1M

EP-3S1M

User Notice

No part of this product, including the product and software may be reproduced,

transmitted, transcribed, stored in a retrieval system, or translated into any

language in any form without the express written permission of EPoX omputer

ompany (hereinafter referred to as EPoX) except for documentation kept by the

purchaser for backup purposes.

We provide this manual as is without warranty of any kind, either expressed or

implied, including but not limited to the implied warranties or conditions of

merchantability or fitness for a particular purpose. In no event shall EPoX be

liable for any loss of profits, loss of business, loss of use or data, interruption of

business or for indirect, special incidental, or consequential damages of any kind,

even if EPoX has been advised of the possibility of such damages arising from any

defect or error in the manual or product. EPoX may revise this manual from time

to time without notice. For updated BIOS, drivers, or product release information

you may visit our websites at http://www.epox.com or http://www.epox.com.tw.

Products mentioned in this manual are mentioned for identification purposes only.

Product names appearing in this manual may or may not be registered trademarks

or copyrights of their respective companies. The product name and revision

number are both printed on the mainboard itself.

Handling Procedures

Static electricity can severely damage your equipment. Handle the EP-3S1M and

any other device in your system with extreme care and avoid unnecessary contact

with system components on the mainboard. Always work on an antistatic surface to

avoid possible damage to the mainboard from static discharge. Always have the

power supply unplugged and powered off when inserting and removing devices

within the computer chassis. EPoX assumes no responsibility for any damage to the

EP-3S1M mainboard that results from failure to follow instruction or failure to

observe safety precautions.

CAUTION

The EP-3S1M mainboard is subject to damage by static

electricity. Always observe the handling rocedures.

EP-3S1M

Technical Support Services

If you need additional information, help during installation or normal use of this

product, please contact your retailer. Your retailer will have the most current

information about your configuration. If your retailer cannot help, you may visit

our online technical support website and/or contact our support technicians at the

locations listed below.

Record your serial number before installing your EP-3S1M mainboard. (The serial

number is located near the P I slots at the edge of the board.)

EP-3S1M serial number: _____________________

Contacting Technical Support

EPoX technical support is working hard to answer all of your questions online.

From our website you can find answers to many common questions, drivers, BIOS

updates, tech notes, and important technical bulletins. If you are still unable to

locate the solution you are seeking, you always have the option to contact our

support technicians directly.

North American website (English language)

http://www.epox.com

[email protected]

European website (Multi-language)

http://www.epox.nl

[email protected]

Taiwan website (Chinese language)

http://www.epox.com.tw

[email protected]

Thank you for using EPoX mainboards!

EP-3S1M

Table of Contents

ection 1 Introduction

omponents hecklist ................................................... 1-1

Overview

Intel eleron processors (P.P.G.A.) 370 ...................... 1-2

Intel oppermine processors (F -PGA) 370 ............... 1-3

Intel® 815 Series hipset Feature .................................. 1-4

EP-3S1M Form-Factor .................................................. 1-6

I/O Shield onnector ...................................................... 1-7

Power-On/Off (Remote) ................................................ 1-7

System Block Diagram ................................................... 1-8

ection 2 Features

EP-3S1M Features.......................................................... 2-1

ection 3 Installation

EP-3S1M Detailed Layout ............................................. 3-2

Easy Installation Procedure

PU Insertion ................................................................. 3-3

Jumper Settings ............................................................... 3-5

System Memory onfiguration ...................................... 3-6

Device onnectors ......................................................... 3-8

External Modem Ring-in Power ON and

Keyboard Power ON Function (KBPO) ........................ 3-11

STR (Suspend To RAM) Function .................................. 3-13

ection 4 Award BIO etup

Main Menu ...................................................................... 4-1

Standard MOS Setup .................................................... 4-3

Advanced BIOS Features ................................................ 4-7

Advanced hipset Features............................................. 4-10

Integrated Peripherals..................................................... 4-14

Page

EP-3S1M

Power Management Setup .............................................. 4-18

PNP/P I onfiguration Setup........................................ 4-21

P Health Status ............................................................. 4-22

Frequency ontrol .......................................................... 4-24

Defaults Menu................................................................. 4-25

Supervisor/User Password Setting ................................. 4-26

Exit Selecting .................................................................. 4-27

ection 5 815 eries VGA and ound Driver Installation

Easy Driver Installation .................................................. 5-1

Appendix

Appendix A

Memory Map................................................................... A-1

I/O Map ........................................................................... A-1

Timer & DMA hannels Map ......................................... A-2

Interrupt Map................................................................... A-2

RT & MOS RAM Map ............................................... A-3

Appendix B

POST odes .................................................................... A-5

Appendix C

Load Optimized Defaults................................................ A-13

Appendix D

GHOST 5.1 Quick Users Guide .................................... A-15

EP-3S1M

Page Left Blank

IntroductionEP-3S1M

Page 1-1

Section 1

INTRODUCTION

Components Checklist

9A. (1) EP-3S1M mainboard

9B. (1) EP-3S1M users manual

9C. (1) Floppy ribbon cable

9. (1) ATA66 Hard drive ribbon cable

9E. (1) RS-232 9-PIN ribbon cable

F. (1) PS/2 to AT keyboard connector adapter (optional)

9G. (1) Onboard Graphic and Sound river

H. (1) TV2 adapter card (optional)

I. (1) PL2 adapter card (optional)

K. (1) AIMM card (optional)

USERS

MANUAL

HIK

Introduction EP-3S1M

Page 1-2

Overview

Intel Celeron processors (P.P.G.A.) 370

The Intel Celeron processors provide power to handle the internet, educational

programs, interactive 3 games, and productivity applications. The Intel Celeron

processors at 700, 667, 633, 600, 566, 533, 500, 466 and 433 MHz include inte-

grated L2 cache 128Kbyte. The core for the 700, 667, 633, 600, 566, 533, 500,

466 and 433 MHz processors have 19M transistors due to the addition of the inte-

grated L2 cache 128Kbyte. All the Intel Celeron processors are available in the

plastic pin grid array (P.P.G.A.) form factor. The P.P.G.A. form factor is compat-

ible with the 370 pin socket. All the Intel Celeron processors are available in the

plastic pin grid array (PPGA) package. The PPGA package is compatible with the

370 pin socket and provides more flexibility to design low cost systems by en-

abling lower profile and smaller systems and providing the potential for reducing

costs of processor retention and cooling solutions. Like the Intel Celeron proces-

sors that utilize S.E.P.P., the Intel Celeron processors that use P.P.G.A., feature a

P6-microarchitecture-based core processor on a single-sided substrate without

BSRAM componentry.

The Intel Celeron processor at 700, 667, 633, 600, 566, 533, 500, 466 and 433

MHz. Includes Intel MMX[tm] media enhancement technology. Offers ynamic

Execution technology.

Includes a 32Kbyte (16Kbyte/16Kbyte) non-blocking, level-one cache that provides

fast access to heavily used data. Intel Celeron processors at 700, 667, 633, 600,

566, 533, 500, 466 and 433 MHz include integrated L2 cache 128Kbyte. All the

Intel Celeron processor utilize the Intel P6 microarchitectures multi-transaction

system bus at 66MHz. The 700, 667, 633, 600, 566, 533, 500, 466 and 433 MHz

processors utilize the Intel P6 microarchitectures multi-transaction system bus

with the addition of the L2 cache interface. The combination of the L2 cache bus

and the processor-to-main-memory system bus increases bandwidth and perfor-

mance over single-bus processors.

IntroductionEP-3S1M

Page 1-3

Intel MMX technology includes new instructions and data types that allow

applications to achieve a new level of performance. Intels MMX technology is

designed as a set of basic, general-purpose integer instructions that are easily

applied to the needs of a wide diversity of multimedia and communications

applications. The highlights of the technology are:

* Single Instruction, Multiple ata (SIM ) technique

* 57 new instructions

* Eight 64-bit wide MMX technology registers

* Four new data types

Intel Coppermine processors (FC-PGA) 370

These Coppermine-128K and Coppermine-256K processor is the next addition to the

P6 micro architecture product family. The FC-PGA package is a new addition to the

Intel IA-32 processor line and hereafter will be referred to as the Coppermine FC-

PGA processor, or simply The processor. The package utilizes the same 370-pin

zero insertion force socket (PGA370) used by the Intel Celeron processor. Thermal

solutions are attached directly to the back of the processor core package without the

use of a thermal plate or heat spreader.

The Coppermine processor, like the Intel Celeron, Intel Pentium II and Pentium III in

the P6 family processor, implement a ynamic Execution micro architecture --- a unique

combination of multiple branch prediction, data flow analysis, and speculative

execution. This enable these processors to deliver higher performance than the Intel

Pentium processor, while maintaining binary compatibility with all previous Intel Ar-

chitecture processors. The processor also executes Intel MMX technology instruc-

tions for enhanced media and communication performance just as its predecessor the

Intel Pentium III processor. Additionally the Coppermine FC-PGA processor executes

streaming SIM (Single-Instruction Multiple ata) Extensions for enhanced floating

point and 3- application performance. The concept of processor identification, via

CPUI , is extended in the processor family with the addition of a processor serial

number. The processor utilizes multiple low-power states such as AutoHALT, Stop-

Grant, Sleep and eep Sleep to conserve power during idle times.

Introduction EP-3S1M

Page 1-4

The processor includes an integrated on-die, 128KB or 256KB, 8-way set associa-

tive level-two (L2) cache with a separated 16KB level one (L1) instruction cache

and 16KB level one (L1) data cache. These cache arrays run at the full speed of the

processor core. As with the Intel Pentium III processor, the Coppermine FC-PGA

processor has a dedicated L2 cache bus, thus maintaining the dual independent bus

architecture to deliver high bus bandwidth and performance. Memory is cacheable

for 4GB/64GB of addressable memory space, allowing significant headroom for

desktop system.

Intel(R) 815 Series chipset features

The Intel(R) 815 series chipset that S RAM interface supports 100MHz and

133MHz operation, the Intel(R) 815 series chipset has re-engineered the Value

PC, providing next generation features and great graphics performance.

The 82815 series Graphics Memory Controller Hub (GMCH) features : Intel(R)

graphics technology and software drivers, using irect AGP (integrated AGP) to

create vivid 2 and 3 effects and images. The 82815 series chip feature

integrated Hardware Motion Compensation to improve soft V video quality.

The Inte(R) 82815 series chipset use Intel(R) ynamic Video Memory Technol-

ogy ( .V.M.T.) is an architecture that offers breakthrough performance for the

(motherboard) PC through efficient memory utilization and irect AGP. The system

OS uses the Intel software drivers and intelligent memory arbiter to support richer

graphics applications.

The Intel(R) 82815 series provides an AGP universal connector to support the

AGP 2.0 including 4X AGP data transfers.

The 82801AA I/O Controller Hub (ICH1) employs the Intel(R) Accelerated Hub

Architecture to make a direct connection from the graphics and memory to the

integrated AC97 controller, the I E controllers (ATA/66 or ATA/33), dual USB

ports, and PCI add-in cards.

The Accelerated Hub Architecture provides twice the bandwidth of the PCI bus at

266 MB per second. This allows a wider flow of rich information from the I/O

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