EPOX EP-BX5C Bedienungsanleitung

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

EP-BX5CEP-BX5C

EP-BX5C

A PA P

A Pentiumentium

entiumentium

entium®®

®®

®II/III/CelerII/III/Celer

II/III/CelerII/III/Celer

II/III/Celeronon

onon

Slot1 Processor based AGPSlot1 Processor based AGP

Slot1 Processor based AGP

mainboarmainboar

mainboard (100/66MHz)d (100/66MHz)

d (100/66MHz)d (100/66MHz)

d (100/66MHz)

EP-BX5C

Technical Support Services

If you need additional information, help during installation or normal use of this

product, please contact your retailer. Your retailer will have the most current

information about your configuration. If your retailer cannot help, you may visit our

online technical support website and/or contact our support technicians at the

locations listed below.

Record your serial number before installing your EP-BX5C mainboard. (the

serial number is located near the ISA slots at the edge of the board)

EP-BX5C serial number:

__________________________

Contacting Technical Support

EPoX technical support is working hard to answer all of your questions online. From

our website you can find answers to many common questions, drivers, BIOS

updates, tech notes, and important technical bulletins. If you are still unable to

locate the solution you are seeking, you always have the option to contact our

support technicians directly.

North American website (English language)

http://www.epox.com

[email protected]

European website (Multi-language)

http://www.epox.nl

[email protected]

Taiwan website (Chinese language)

http://www.epox.com.tw

[email protected]

Thank you for using EPoX mainboards!

EP-BX5C

CAUTION

The EP-BX5C mainboard is subject to

damage by static electricity. Always

observe the handling procedures.

The product name and revision number are both printed on the

mainboard itself.

Handling Procedures

Static electricity can severely damage your equipment. Handle the EP-

BX5C and any other device in your system with care and avoid unneccessary

contact with system components on the mainboard.

Always work on an antistatic surface to avoid possible damage to the

motherboard from static discharge.

We assume no responsibility for any damage to the EP-BX5C mainboard that

results from failure to follow installation instructions or failure to observe

safety precautions.

EP-BX5C

Table of Contents

Section 1 Introduction

Components Checklist ................................... 1-1

Overview

Pentium®II or Pentium®III Processor.......... 1-2

S.E.C. Cartridge Terminology ........................1-3

Accelerated Graphics Port............................. 1-4

Hardware Monitoring ..................................... 1-4

EP-BX5C Form-Factor.................................. 1-5

I/O Shield Connector ..................................... 1-6

Power-On/Off (Remote)................................ 1-6

System Block Diagram................................... 1-7

Section 2 Features

EP-BX5C Features ......................................... 2-1

Section 3 Installation

EP-BX5C Detailed Layout............................. 3-2

Easy Installation Procedure

Configure Settings..........................................3-3

System Memory Configuration ..................... 3-5

Installing a Pentium®II/III Processor............3-8

Device Connectors ......................................... 3-10

External Modem Ring-in Power ON and

Keyboard Power ON Function (KBPO) ........ 3-12

Section 4 Award BIOS Setup

BIOS Instructions ........................................... 4-1

Standard CMOS Setup ....................................4-2

BIOS Features Setup ...................................... 4-3

Chipset Features Setup................................... 4-8

Power Management Setup.............................. 4-12

PNP/PCI Configuration ................................. 4-16

Load Setup Defaults .......................................4-17

Integrated Peripherals .................................... 4-18

Sensor and CPU Speed Setting ...................... 4-23

Page

EP-BX5C

Change Supervisor or User Password ...........4-25

IDE HDD Auto Detection ..............................4-26

Save & Exit Setup ........................................... 4-28

Exit Without Saving........................................ 4-28

Section 5 Appendix

Appendix A

Memory Map ..................................................A-1

I/O Map ........................................................... A-1

Timer & DMA Channels Map ........................ A-2

Interrupt Map .................................................. A-2

RTC & CMOS RAM Map ...............................A-3

Appendix B

POST Codes.................................................... A-5

Unexpected Errors .........................................A-8

Appendix C

Load Setup Defaults .......................................A-9

EP-BX5C

Page Left Blank

IntroductionEP-BX5C

Page 1-1

Section 1

INTRODUCTION

Components Checklist

üü

üA. (1) EP-BX5C mainboard

üü

üB. (1) EP-BX5C user’s manual

üü

üC. (1) Floppy ribbon cable

üü

üD. (1) Hard driver ribbon cables

üü

üE. (1) Foldable Retention Module

F. (1) Heatsink Support Unit (Optional)

G. (1) PS/2 to AT keyboard connector adapter (optional)

üü

üH. (1) Bus master drivers

(1) USDM

USER’S

MANUAL

EP-BX5C

Top Half

Bottom Half

Introduction EP-BX5C

Page 1-2

Overview

Pentium®II or Pentium®III Processor

The Pentium®II or Pentium®III Processor (The Pentium®III Processor as 300/

100MHz, 350/100MHz, 400/100MHz, 450/100MHz, 500/100MHz and 550/

100MHz speed with 512K-L2 cache Versions.) is the follow-on to the Pentium®

Processor. The Pentium®II or Pentium®III Processor, like the Pentium®Pro

processor, implements a Dynamic Execution micro-architecture -- a unique

combination of multiple branch prediction, data flow analysis, and speculative

execution. This enables the Pentium®II Processor to deliver higher performance

than the Pentium®processor, while maintaining binary compatibility with all

previous Intel architecture processors.

A significant feature of the Pentium®II or Pentium®III Processor, from a system

perspective, is the built-in direct multiprocessing support. In order to achieve

multiprocessing, and maintain the memory and I/O bandwidth to support it, new

system designs are needed. For systems with dual processors, it is important to

consider the additional power burdens and signal integrity issues of supporting

multiple loads on a high speed bus. The Pentium®II or Pentium®III Processor

card supports both uni-processor and dual processor implementations.

The Pentium®II or Pentium®III Processor utilizes Single Edge Contact (S.E.C.)

(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2

cache to remain tightly coupled to the processor, while maintaining flexibility

when implementing high performance processors into OEM systems. The second

level cache is performance optimized and tested at the cartridge level. The S.E.C.

cartridge utilizes surface mounted core components and a printed circuit board

with an edge finger connection. The S.E.C. cartridge package introduced on the

Pentium®II Processor will also be used in future Slot 1 processors.

The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB

with an edge finger connection. The thermal plate allows standardized heatsink

attachment or customized thermal solutions. The thermal plate enables a reusable

heatsink to minimize fit issues for serviceability, upgradeability and replacement.

The full enclosure also protects the surface mount components. The edge finger

connection maintains socketabilty for system configuration. The edge finger

connector is denoted as ‘Slot 1 connector’ in this and other documentation.

IntroductionEP-BX5C

Page 1-3

The entire enclosed product is called the Pentium®II or Pentium®III Processor.

The packaging technology and each of the physical elements of the product are

referred to using accurate technical descriptions. This allows clear reference to

the products as just a processor. This is the model used in past packaging tech-

nologies like PGA, TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

• Pentium®II or Pentium®III Processor

The new enclosed card packaging technology is called a “Single Edge

Contact cartridge.” This is similar to previous names for packaging

technology such as PGA or TCP.

• Processor card

The green PCB (with or without components on it)

• Processor core

The silicon on the PLGA package on the PCB

• Cover

The plastic cover on the opposite side from the thermal plate.

• Slot 1

The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro

processor uses Socket 8.

• Retention mechanism

Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in

place.

• Thermal plate

The heatsink attach-

ment plate.

• Heat sink supports

The support pieces that

are mounted on the

mainboard to provide

added support for

heatsinks. Figure 1: Pentium®II/III Processor CPU

with S.E.C.C. or S.E.C.C.2 Package

Pentium®II Processor

in an S.E.C.C. Package Pentium®III Processor

in an S.E.C.C.2 Package

Introduction EP-BX5C

Page 1-4

The L2 cache (TagRAM, PBSRAM) components keep standard industry names.

The Pentium®II or Pentium®III Processor is the first product to utilize the S.E.C.

cartridge technology and Slot 1 connector. Unless otherwise noted, any refer-

ences to “Pentium®II Processor,” “Pentium®II or Pentium®III Processor/Slot 1

processor” or “Pentium III Processor” will apply to both the Pentium®II Proces-

sor desktop processors.

Accelerated Graphics Port

(AGP or A.G.P.)

Typically, 3D graphics rendering requires a tremendous amount of memory, and

demands ever increasing throughput speed as well. As 3D products for the

personal computer become more and more popular, these demands will only

increase. This will cause a rise in costs for both end users and manufacturers.

Lowering these costs as well as improving performance is the primary motivation

behind AGP. By providing a massive increase in the bandwidth available between

the video card and the processor, it will assist in relieving some of these pres-

sures for quite sometime.

Hardware Monitoring

Hardware monitoring allows you to monitor various aspects of your systems

operations and status. The features include CPU temperature, voltage and RPM

of fan.

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