EPOX EP-D3VA Bedienungsanleitung
A Dual FC-PGA Pentium® III Processors based
AGP mainboard Supports PC133 Memory
TRADEMARKS
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trademarks of their respectives holders.
These specifications are subject to change without notice.
Manual Revision 1.1
November 24 , 2000
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Components Checklist
A (1) Mainboard
B (1) Uusers manual
(1) Floppy drive cable
D (2) ATA-66/100 Hard drive cable
E (1) Software drivers set (disks or D-ROM)
Highpoint 370 Driver & Utility diskete
VIA Driver D Disk
D (2)
USERS
MANUAL
B
A
C
E
or
Table of Contents
Chapter 1: Introduction
Overview of Main Features .................................................................7
Pentium® III F -PGA Processor.........................................................9
Accelerated Graphics Port (AGP) .....................................................10
ATX Form Factor .............................................................................. 11
Hardware Monitoring ........................................................................12
I/O Shield ..........................................................................................13
Power ON Remotely (KBPO & Modem Ring-in) .............................13
Universal Serial Bus (USB) ...............................................................14
Symmetrical Multi-Processing (SMP) ...............................................14
System Block Diagram ......................................................................16
Chapter 2: Hardware Installation
Directions & Recommended Tools ...................................................17
Detailed Board Layout ......................................................................18
onfiguration of Jumpers ..................................................................19
Installing into ATX case.....................................................................20
Installing onnectors .........................................................................21
Installing Memory .............................................................................22
Installing Processor(s) .......................................................................24
Device onnector Description ...........................................................26
onfiguring KBPO and Modem Ring-in ...........................................27
Chapter 3: Software Installation
Included Software & Drivers ............................................................29
Microsoft Windows® 95/98 Setup .....................................................30
Microsoft Windows® 2000 Setup ......................................................33
Microsoft Windows® NT 4 Setup ......................................................35
Chapter 4: Award BIOS Setup
BIOS Instructions ..............................................................................37
Standard MOS Features .................................................................38
Advanced BIOS Features ..................................................................39
Advanced hipset Features ...............................................................44
Integrated Peripherals ........................................................................48
Power Management Setup ................................................................53
PNP/P I onfigurations ...................................................................56
P Health Status ...............................................................................58
Frequency/Voltage ontrol ................................................................59
hange Supervisor or User Password ...............................................60
Save & Exit Setup .............................................................................61
Exit Without Saving ...........................................................................61
Chapter 5: HP 370 UltraDMA-100 & RAID
RAID Introduction ............................................................................63
reate RAID .....................................................................................65
Delete RAID......................................................................................66
Duplicate Mirror Disk........................................................................66
reate Spare Disk .............................................................................67
Remove Spare Disk...........................................................................68
Set Drive Mode .................................................................................68
Select Boot Disk ................................................................................69
Appendix A: Load Optimized Defaults
Load Optimized Defaults.................................................................A-1
Appendix B: GHOS 5.1 Quick Users Guide
Ghost 5.1 Quick Users Guide ........................................................B-1
Additional Sources of Information
HighPoint
http://www.highpoint-tech.com
Intel Corporation
http://www.intel.com
http://developer.intel.com
Micro oft Corporation
http://www.microsoft.com
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Introduction
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Overview of Main Features
The board is a Dual FC-PGA Processors based motherboard. Measuring at
305mm by 44mm this ATX board supports the fastest performing processors now
available: the Intel FC-PGA Pentium III Coppermine. Standard Front Side Bus
options include 66, 100 & 133MHz.
Teamed with the VIA Apollo Pro133A chipset is support for 4x SDRAM (DIMM)
modules and UltraDMA-66. Additionally for added functionality we has included
the versatile HPT 370 IDE controller to add UltraDMA-100 and IDE RAID.
The HPT370 PCI Dual Channel Ultra DMA/ATA 100 RAID Controller supports up
to 4 Ultra DMA/ATA 100 disk devices with a burst transfer rate of up to 100MB/
Sec. The HPT370 is fully backward-compatible with all IDE/ATAPI devices
including Ultra DMA/ATA 66, 33, EIDE Fast ATA- , IDE drives and CD ROM
drives. HPT 370 coexists with motherboard IDE ports, adding two additional IDE/
ATAPI ports.
Processor Support
The board is based on the Dual FC-PGA Pentium® III Processors. 66/100/
133MHz Front Side Bus with PPGA / FC-PGA socket 370 packaging. Single
PPGA/FC-PGA Socket370 Celeron processor may also be used.
Chipset
Designed with VIA Apollo Pro133A (133MHz FSB) AGPset (694X +
VT8 C596B).
Memory
Supports up to 1.5 Gigabyte of SDRAM (minimum of 32MB) on boar .
The boar will support Error Checking an Correcting (ECC) when using
parity SDRAM memory mo ules. This will etect multiple bit errors an
correct 1-bit memory errors.
Introduction
2=CA&
Expansion Slots
Supports (1) 16 bit ISA slot, (5) 3 bit PCI slots, and (1) AGP slot. The board
supports (5) PCI Bus Master slots and a jumperless PCI INT# control scheme
which reduces configuration confusion when plugging in PCI card(s).
IDE Bus Master UltraDMA-66 & UltraDMA-1 RAID
VIA Apollo Pro133A chipset provides two ( ) standard independent high
performance PCI IDE interfaces capable of supporting PIO Mode 3/4 and
UltraDMA-66 devices. With the addition of the HPT370 IDE chipset two ( )
extra IDE ports are also included - adds UltraDMA-100 & IDE Raid
functionality. Four (4) IDE/Atapi devices supported on the VIA UltraDMA-66
controllers and four (4) supported on the HPT370 UltraDMA-100/RAID
controllers. All ports are backwards compatible with UltraDMA-66,
UltraDMA-33 and PIO Modes 3/4.
Super Multi I/O
Designed with Winbond W83977EF-AW Multi I/O: (1) floppy port, (1)
parallel port (EPP, ECP), and ( ) serial ports (16550 Fast UART), (1) IrDA.
Includes a PS/ mouse connector. Allows use of a PS/ or AT keyboard (with
optional adapter).
BIOS
Features Award Plug & Play BIOS for easy flash upgradability. Features the
newer Award v6.0 interface allowing better compatibility and support for todays
hardware. The BIOS setup options are backed-up via the use of a Lithium battery
which provides environmental protection and longer battery life.
USB
Supports the Universal Serial Bus (USB) connector. The onboard VIA chip
provides the means for connecting PC peripherals such as keyboards, joysticks,
telephones, and modems.
Built-in ATX 0-pin power supply connector.
Supports ring-in feature - system can be turned on remotely using external modem.
Power on by Alarm - Allows your system to turn on at a preselected time.
Supports Hot Key, Any Key, or password Keyboard power ON function
(KBPO).
Built-in WOL (Wake On Lan) and WOM (Wake On Modem) Connectors.
Introduction
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Pentium III FC-PGA Processor
Intels latest Pentium® III processors are designed using the highly advanced 0.18-
micron process. This new generation of technology brings all the performance-
enhancing features of the Pentium III processor into exciting new PC products.
This redesigned Pentium III processor with Advanced Transfer Cache means you
have all the power and performance for todays and tomorrows Internet
applications.
The Pentium III processor is designed for high-performance workstations and
servers. It is binary compatible with previous Intel processors. The Pentium III
provides supreme performance for any applications running on advanced operating
systems such as Windows NT and Windows 000. This is made possible by the
best features of Intel Processors -- Advanced Transfer Cache, Dual Independent
Bus (DIB), streaming SIMD extensions, Dynamic execution, and much more.
Scalable from one to two processors in a multiprocessor system the Pentium III
extends the power of previous generation processors with enough processing
muscle to satisfy the most intensive applications. The Intel Pentium III processor
for FC-PGA (PGA370) socket is the next member of Intels P6 family of
processors. This processor uses the same core and offers the same if not better
performance as the Intel Pentium III processor for the SC 4 (Slot 1), but utilizes
a newer packaging type called flip-chip pin grid array (FC-PGA).
Key features of Pentium III FC-PGA:
System bus frequency of 100MHz or 133MHz.
Available in versions that incorporate 56KB Advanced Transfer Cache with
ECC.
Dual Independent Bus (DIB) architecture: Seperate dedicated external system
bus and dedicated internal high-speed cache bus.
Internet Streaming SIMD Extensions.
Dynamic execution micro architecture.
Intel Processor Serial Number.
Power Management capabilities.
System Management mode.
Optimized for 3 -bit applications running on advanced 3 -bit operating
systems.
Error-correcting code for system bus data.
Enabled systems which are scalable for up to two processors.
Introduction
2=CA
Accelerated Graphics Port (4X AGP MO E)
The Accelerated Graphics Port (more commonly known as AGP) interface is a
new platform bus specification that enables high performance graphics
capabilities, especially 3D. This interface specification will enable 3D
applications, which not only require sufficient information storage so that the
monitor image may be refreshed, but also enough storage to support texture
mapping, z-buffering and alpha blending.
PCI will continue to be the main general-purpose system I/O bus. The AGP
interface has been designed specifically for dedicated use by graphics controllers,
and is not intended to replace PCI. It is physically separated from the PCI bus and
it uses a separate connector.
The benefits of AGP:
1. Direct texturing from main memory:
-Two memory pipes are provided to graphic engines for concurrency.
-Richer textures with no frame buffer growth.
-Graphics & CPU get a continuous view of graphic data structures from
GART (Graphics Address Re-mapping Table) Hardware.
. De-multiplexed address and data.
-Enables pipelining and concurrency.
3. 533 Mbytes /s peak bandwidth. -Delivers high performance data control.
4. Peak bandwidth can be 4 times the PCI bus bandwidth, and higher sustained rates
via Sideband and pipelining.
5. Direct Memory Execute Textures.
6. Reduced Contention with the CPU and I/O devices for bus and memory access.
The PCI bus serves disk controllers, LAN chips, and possibly video capture.
AGP operates concurrently with and independent from most PCI operations.
Furthermore, the CPU can accesses system RAM while with the AGP graphic
chip reads RAM, because of out-of-order queuing hardware support in the chip
set. Therefore, in spite of the heavy access from the graphic chip, there should
be no audio breakup or other CPU degradation.
7. A separate port for the graphics chip to access memory, which allows for
concurrent texture reads from AGP memory while read/writing from local
memory. Efficient utilization of the bandwidths allows the graphic chip to
obtain 1.3 GB/s peak by using both ports simultaneously, versus 0.8 GB/s from
the local RAM.
8. Allowing the CPU to write directly to AGP shared system memory.
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