EPOX EP-6WEA4 Bedienungsanleitung

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 1.0

November 23, 1999

A PA P

A Pentiumentium

entiumentium

entium®®

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®II or PII or P

II or PII or P

II or Pentiumentium

entiumentium

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®III Slot1III Slot1

III Slot1III Slot1

III Slot1

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Processor basedocessor based

ocessor basedocessor based

ocessor based AA

AGP mainboarGP mainboar

GP mainboarGP mainboar

GP mainboardd

(133/100/66MHz)(133/100/66MHz)

(133/100/66MHz)

EP-6WEA4EP-6WEA4

EP-6WEA4

EP-6WEA4IEP-6WEA4I

EP-6WEA4I

EP-6WEA4/4I

User Notice

No part of this product, including the product and software may be reproduced,

transmitted, transcribed, stored in a retrieval system, or translated into any

language in any form without the express written permission of EPoX Computer

Company (hereinafter referred to as EPoX) except for documentation kept by the

purchaser for backup purposes.

We provide this manual “as is” without warranty of any kind, either expressed or

implied, including but not limited to the implied warranties or conditions of

merchantability or fitness for a particular purpose. In no event shall EPoX be

liable for any loss of profits, loss of business, loss of use or data, interruption of

business or for indirect, special incidental, or consequential damages of any kind,

even if EPoX has been advised of the possibility of such damages arising from any

defect or error in the manual or product. EPoX may revise this manual from time

to time without notice. For updated BIOS, drivers, or product release information

you may visit our websites at http://www.epox.com or http://www.epox.com.tw.

Products mentioned in this manual are mentioned for identification purposes only.

Product names appearing in this manual may or may not be registered trademarks

or copyrights of their respective companies. The product name and revision

number are both printed on the mainboard itself.

Handling Procedures

Static electricity can severely damage your equipment. Handle the EP-6WEA4/4I

and any other device in your system with extreme care and avoid unnecessary

contact with system components on the mainboard. Always work on an antistatic

surface to avoid possible damage to the mainboard from static discharge. Always

have the power supply unplugged and powered off when inserting and removing

devices within the computer chassis. EPoX assumes no responsibility for any

damage to the EP-6WEA4/4I mainboard that results from failure to follow

instruction or failure to observe safety precautions.

CAUTION

The EP-6WEA4/4I mainboard is subject to

damage by static electricity. Always

observe the handling procedures.

EP-6WEA4/4I

Technical Support Services

If you need additional information, help during installation or normal use of this

product, please contact your retailer. Your retailer will have the most current

information about your configuration. If your retailer cannot help, you may visit

our online technical support website and/or contact our support technicians at the

locations listed below.

Record your serial number before installing your EP-6WEA4/4I mainboard. (The

serial number is located near the PCI slots at the edge of the board.)

EP-6WEA4/4I serial number: __________________________

Contacting Technical Support

EPoX technical support is working hard to answer all of your questions online.

From our website you can find answers to many common questions, drivers, BIOS

updates, tech notes, and important technical bulletins. If you are still unable to

locate the solution you are seeking, you always have the option to contact our

support technicians directly.

North American website (English language)

http://www.epox.com

[email protected]

European website (Multi-language)

http://www.epox.nl

[email protected]

Taiwan website (Chinese language)

http://www.epox.com.tw

[email protected]

Thank you for using EPoX mainboards!

EP-6WEA4/4I

Table of Contents

Section 1 Introduction

Components Checklist..............................................1-1

Overview

Pentium®II or Pentium®III Processor ....................1-2

S.E.C. Cartridge Terminology ..................................1-3

Intel®810E Chipset Feature .....................................1-4

EP-6WEA4/4I Form-Factor .....................................1-6

I/O Shield Connector................................................1-7

Power-On/Off (Remote) ..........................................1-7

System Block Diagram.............................................1-8

Section 2 Features

EP-6WEA4/4I Features ...........................................2-1

Section 3 Installation

EP-6WEA4/4I Detailed Layout................................3-2

Easy Installation Procedure

Configure Jumpers ...................................................3-3

AC’97/MR Configuration Table ...............................3-4

System Memory Configuration ................................3-5

Installing a Pentium®II/III Processor.......................3-7

Device Connectors ...................................................3-9

External Modem Ring-in Power ON and

Keyboard Power ON Function (KBPO) ..................3-11

STR (Suspend To RAM) Function ..........................3-13

Section 4 Award BIOS Setup

Main Menu ...............................................................4-1

Standard CMOS Setup.............................................4-3

Advanced BIOS Features.........................................4-7

Advanced Chipset Features ......................................4-10

Integrated Peripherals...............................................4-13

Power Management Setup .......................................4-18

Page

EP-6WEA4/4I

PNP/PCI Configuration Setup .................................4-21

PC Health Status ......................................................4-22

Frequency/VoltageControl .......................................4-24

Defaults Menu..........................................................4-25

Supervisor/User Password Setting ...........................4-26

ExitSelecting ............................................................4-27

Section 5 810E VGA and Sound Driver Installation

Easy Driver Installation ............................................5-1

Appendix Appendix A

Memory Map ...........................................................A-1

I/O Map....................................................................A-1

Timer & DMA Channels Map..................................A-2

Interrupt Map ...........................................................A-2

RTC & CMOS RAM Map .......................................A-3

Appendix B

POST Codes ............................................................A-5

Appendix C

Load Optimized Defaults .........................................A-13

Appendix D

GHOST 5.1 Quick User’s Guide .............................A-15

EP-6WEA4/4I

Page Left Blank

IntroductionEP-6WEA4/4I

Page 1-1

Section 1

INTRODUCTION

Components Checklist

üü

üA. (1) EP-6WEA4/4I mainboard

üü

üB. (1) EP-6WEA4/4I user’s manual

üü

üC. (1) Floppy ribbon cable

üü

üD. (1) ATA-66 Hard driver ribbon cables

üü

üE. (1) Foldable Retention Module

F. (1) PS/2 to AT keyboard connector adapter (optional)

üü

üG. (1) Onboard Graphic and Sound Driver

USER’S

MANUAL

EP-6WEA4/4I

Introduction EP-6WEA4/4I

Page 1-2

Overview

Pentium®II or Pentium®III Processor

The Pentium®II or Pentium®III Processor (The Pentium®III Processor as 350~600/

100MHz and 533~733/133MHz speed or above with 512K/256K-L2 cache

Versions.) is the follow-on to the Pentium®Processor. The Pentium®II or Pentium®

III Processor, like the Pentium®Pro processor, implements a Dynamic Execution

micro-architecture -- a unique combination of multiple branch prediction, data flow

analysis, and speculative execution. This enables the Pentium®II/III Processor to

deliver higher performance than the Pentium®processor, while maintaining binary

compatibility with all previous Intel architecture processors.

A significant feature of the Pentium®II or Pentium®III Processor, from a system

perspective, is the built-in direct multiprocessing support. In order to achieve

multiprocessing, and maintain the memory and I/O bandwidth to support it, new

system designs are needed. For systems with dual processors, it is important to

consider the additional power burdens and signal integrity issues of supporting

multiple loads on a high speed bus. The Pentium®II or Pentium®III Processor

card supports both uni-processor and dual processor implementations.

The Pentium®II or Pentium®III Processor utilizes Single Edge Contact (S.E.C.)

(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2

cache to remain tightly coupled to the processor, while maintaining flexibility

when implementing high performance processors into OEM systems. The second

level cache is performance optimized and tested at the cartridge level. The S.E.C.

cartridge utilizes surface mounted core components and a printed circuit board

with an edge finger connection. The S.E.C. cartridge package introduced on the

Pentium®II Processor will also be used in future Slot 1 processors.

The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB

with an edge finger connection. The thermal plate allows standardized heatsink

attachment or customized thermal solutions. The thermal plate enables a reusable

heatsink to minimize fit issues for serviceability, upgradeability and replacement.

The full enclosure also protects the surface mount components. The edge finger

connection maintains socketabilty for system configuration. The edge finger

connector is denoted as ‘Slot 1 connector’ in this and other documentation.

IntroductionEP-6WEA4/4I

Page 1-3

The entire enclosed product is called the Pentium®II or Pentium®III Processor.

The packaging technology and each of the physical elements of the product are

referred to using accurate technical descriptions. This allows clear reference to

the products as just a processor. This is the model used in past packaging tech-

nologies like PGA, TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

• Pentium®II or Pentium®III Processor

The new enclosed card packaging technology is called a “Single Edge

Contact cartridge.” This is similar to previous names for packaging

technology such as PGA or TCP.

• Processor card

The green PCB (with or without components on it)

• Processor core

The silicon on the PLGA package on the PCB

• Cover

The plastic cover on the opposite side from the thermal plate.

• Slot 1

The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro

processor uses Socket 8.

• Retention mechanism

Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in

place.

• Thermal plate

The heatsink attach-

ment plate.

• Heat sink supports

The support pieces that

are mounted on the

mainboard to provide

added support for

heatsinks. Figure 1: Pentium®II/III Processor CPU

with S.E.C.C. or S.E.C.C.2 Package

Pentium®II Processor

in an S.E.C.C. Package Pentium®III Processor

in an S.E.C.C.2 Package

Introduction EP-6WEA4/4I

Page 1-4

The L2 cache (TagRAM, PBSRAM) components keep standard industry names.

The Pentium®II or Pentium®III Processor is the first product to utilize the S.E.C.

cartridge technology and Slot 1 connector. Unless otherwise noted, any refer-

ences to “Pentium®II Processor,” “Pentium®II or Pentium®III Processor/Slot 1

processor” or “Pentium III Processor” will apply to both the Pentium®II Proces-

sor desktop processors.

Intel(R) 810E chipset features

The Intel(R) 810E chipset that Built on the strong foundation of Intel(R) 440BX

AGPset technology, the Intel(R) 810E chipset has re-engineered the Value PC,

providing next generation features and great graphics performance.

The 82810E Graphics Memory Controller Hub (GMCH) features : Intel(R)

graphics technology and software drivers, using Direct AGP (integrated AGP) to

create vivid 2D and 3D effects and images. The 82810E chip feature integrated

Hardware Motion Compensation to improve soft DVD video quality.

The Inte(R) 82810E chipset use Intel(R) Dynamic Video Memory Technology (D.

V.M.T.) is an architecture that offers breakthrough performance for the

(motherboard) PC through efficient memory utilization and Direct AGP. The

system OS uses the Intel software drivers and intelligent memory arbiter to

support richer graphics applications.

The 82801AA I/O Controller Hub (ICH) employs the Intel(R) Accelerated Hub

Architecture to make a direct connection from the graphics and memory to the

integrated AC97 controller, the IDE controllers (ATA/66 or ATA/33), dual USB

ports, and PCI add-in cards.

The Accelerated Hub Architecture provides twice the bandwidth of the PCI bus at

266 MB per second. This allows a wider flow of rich information from the I/O

controller to the memory controller, with optimized arbitration rules allowing

more functions to run concurrently, enabling more life-like audio and video.

The Integrated Audio-Codec 97 controller enables software audio and modem

(AMR Riser Optional) by using the processor to run sound and modem software.

By reusing existing system resources, this feature adds flexibility, improves

sound and modem quality.

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