HP ARUBA 8320 48 10/6 40 X472 5 2 Bdl Montageanleitung

MF877-00 Page 1

Template Revision A

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

ARUBA 8320 48 10/6 40 X472 5 2 Bdl (JL479A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

MF877-00 Page 2

Template Revision A

HPE instructions for this template are available at MF877-01

Tool Description

Tool Size (if

applicable)

Phillips screwdriver

Nut spinner screwdriver

5mm

Nut spinner screwdriver

5.5mm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the top cover

1. Using a Phillips screwdriver, remove the screws attaching the top cover.

2. Slide the cover off the chassis.

2. Remove the two power supplies

1. While pressing the release lever toward the handle, pull the power supply out of the chassis.

2. Repeat for the other power supply.

3. Remove the five fan assemblies

1. Using a Phillips screwdriver, loosen the set screw for each fan assembly.

2. Using the fan assembly handle, pull the fan assembly out of the chassis.

3. Repeat for the other fan assemblies.

4. Remove the CPU PCA assembly

1. Using a Phillips screwdriver, remove two screws at the back corners of the CPU PCA assembly.

2. Using a 5.5mm Nut spinner screwdriver, remove two nuts at the front corners of the CPU PCA assembly.

3. Remove the CPU PCA assembly from the chassis.

5. Remove the fan assembly PCA

1. Using a Phillips screwdriver, remove four screws attaching the fan assembly PCA to the chassis.

2. Remove the fan assembly PCA from the chassis.

6. Disconnect all fan assembly PCA & main PCA cable connections.

7. Remove the air baffles

1. Using a Phillips screwdriver, remove the screws attaching the air baffles.

2. Remove the air baffles.

8. Remove the main PCA

1. Using a Phillips screwdriver, remove the screws attaching the main PCA.

2. Using a 5mm Nut spinner screwdriver, remove the hexagonal spacers attaching the main PCA.

3. Slide the main PCA off the chassis.

9. Remove the heatsink

1. Using a Phillips screwdriver, remove the screws attaching the heatsink.

2. Remove the heatsink and the attached bracket.

10. Remove the bottom cover

1. Using a Phillips screwdriver, remove two screws attaching the bottom cover.

2. Remove the bottom cover.

11. Remove the luggage tab.

MF877-00 Page 3

Template Revision A

HPE instructions for this template are available at MF877-01

MF877-00 Page 4

Template Revision A

HPE instructions for this template are available at MF877-01

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