HP In/Out P2P 10/13dBi MIMO 3 Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP In/Out P2P 10/13dBi MIMO 3 Elmnt Ant (J9170A)

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers 0

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Slotted Screwdriver

3/16

Wrenches

3/4", 5/8",

1/4", 3/16"

Solder Iron

Solder Wick

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Use slotted screwdriver to pry plastic enclosure from metal base plate

2. Use solder iron and solder wick to remove solder where PCB is soldered to cable

3. Use 1/4" wrench to remove nuts holding PCB to assembly

4. Remove PCB's from assembly

5. Use 3/16 wrench to remove nuts holding cable to metal base plate

6. Use 3/4" and 5/8" wrench to loosen plastic cable strain relief

7. Remove cables from assembly

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Inhaltsverzeichnis

Andere HP Netzwerk-Hardware Handbücher

HP iSCSI Bedienungsanleitung

HP StorageWorks T5521A Handbuch

HP FlexNetwork 6616 Bedienungsanleitung

HP HP 16500 Montage- und Wartungsanleitung

HP AHA-8940 Bedienungsanleitung

HP Surestore Disk Array 12h - And FC60 Bedienungsanleitung

HP X1600 - StorageWorks Network Storage System 5.4TB SAS Model NAS... Anleitung zur Verwendung

HP ProCurve Radio Port 230 Montageanleitung

HP Bc1500 - BladeSystem - Blade PC Bedienungsanleitung

HP 5900AF-48XG-4QSFP+ Montageanleitung

HP StorageWorks 2324fc Bedienungsanleitung

HP VMA Series Merkblatt

HP Mv2120 - Media Vault Network Drive Bedienungsanleitung

HP 180 Degree Turn Bedienungsanleitung

HP X1600 - StorageWorks Network Storage System 5.4TB SAS Model NAS... Bedienungsanleitung

HP X1800sb G2 Gebrauchsanweisung

HP ARUBA 8320 48 10/6 40 X472 5 2 Bdl Montageanleitung

HP 10:10 LAN Bridge MB Installations- und Betriebsanleitung

HP ProCurve 1600M Bedienungsanleitung

HP ProLiant DL980 G7 Kurzanleitung

HP Presario X1000 - Notebook PC Gebrauchsanweisung

HP 226824-001 - ProLiant - ML750 Referenzhandbuch

HP X5000 G2 Service-Handbuch

HP Ethernet Network Interface Card hn230e Bedienungsanleitung

Beliebte Netzwerk-Hardware Handbücher anderer Marken

Matrix Switch Corporation

Matrix Switch Corporation MSC-HD161DEL Bedienungsanleitung

B&B Electronics

B&B Electronics ZXT9-IO-222R2 Bedienungsanleitung

Yudor

Yudor YDS-16 Bedienungsanleitung

D-Link

D-Link ShareCenter DNS-320L Bedienungsanleitung

Samsung

Samsung ES1642dc Gebrauchsanweisung

Honeywell Home

Honeywell Home LTEM-PV Montageanleitung

evertz

evertz 7700 Series Bedienungsanleitung

D-Link

D-Link ShareCenter DNS-343 Bedienungsanleitung

Asante

Asante AsanteBridge 1012 Bedienungsanleitung

FireBrick

FireBrick FB2700 Bedienungsanleitung

Audiovox Electronics

Audiovox Electronics ARWH2T Bedienungsanleitung

ADC

ADC DSX-1 Handbuch

NetComm

NetComm NF2 Bedienungsanleitung

Alcatel-Lucent

Alcatel-Lucent 5620 Bedienungsanleitung

Dell EMC

Dell EMC XC6420 Series Bedienungsanleitung

Lanner

Lanner NCA-1020A Bedienungsanleitung

Allied Telesis

Allied Telesis AT-TN121-A Bedienungsanleitung

Lanner

Lanner NCA-1525 Bedienungsanleitung