HP FF 12910 Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Networking Equipment

Marketing Name / Model

[List multiple models if applicable.]

HP FF 12910 Main Processing Unit (JG621A)

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as

defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display

backlights, scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or

PCAs already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

2＃

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective

treatment:

1. Unscrew the screws on heat sink 3, and then remove heat sink 3 from panel 5.

2. Unscrew the screws on pcb 1, and then remove pcb 1.

3. Unscrew the screws on guiding set 2, and then remove guiding set 2 from pcb 1.

4. Remove shielding finger 4 from panel 5.

5. Remove film 6 from panel 5.

6. Remove battery from pcb 1.

(a) Remove conformal coating (if any) and clean work area of any contamination, oxides, adhesives, residues or

fluxes.

(b) Install thermal drive desoldering tip handpiece.

(d) Thermal shock tip with damp sponge.

(e) Tin tip with solder. (See Figure 2.)

(f) Lower tip contacting solder connection.

(g) Confirm complete solder melt of contacted lead. (See Figure 3.)

(h) For a flat lead, move lead back and forth; for a round lead, use a circular motion and apply vacuum while

continuing lead movement. (See Figures 4&5)

(i) Lift tip from lead, hold vacuum for an additional 3 seconds to clear all molten solder from heater chamber. (See

Figure 6.)

(j) Repeat for all solder connections.

(k) Re-tin tip end with solder and return handpiece to its stand.

(l) Lift the component body free of the printed board.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Figure 1 disassembly process

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Figure 2 Position Tip

Figure3 Melt Solder

Figure 4 Move Lead & Apply Vacuum

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Figure 5 Move Lead & Apply Vacuum

Figure 6 Lift Handpiece

3.3 Material of the facility built Table 1

Facility

Components

Material

Weight(g)

Weight

percentage

Selective treatment for

materials and components

Details

Complex PWB

828.4

32.743%

The surface lf PCB is

greater than 10 square

centimeters

48.0

1.897%

Zn recycling

273.4

10.806%

Al recycling

Be-Cu

1.7

0.067%

Cu recycling

1373.4

54.285%

Fe recycling

5.1

0.202%

Containing brominated

flame retardants

Pla recycling

4. Revised record

Date

Version

Author

Modify content

2013.03.21

Huang Zhengwei

Initial version

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