Huawei MU709Gs-8 Bedienungsanleitung
Copyright © Huawei Technologies Co., Ltd. 2012.
All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Huawei Technologies Co., Ltd.
The product described in this manual may include copyrighted software of Huawei
Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce,
distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign,
or sublicense the said software, unless such restrictions are prohibited by applicable laws or
such actions are approved by respective copyright holders under licenses.
Trademarks and Permissions
, , and are trademarks or registered trademarks of Huawei
Technologies Co., Ltd.
Other trademarks, product, service and company names mentioned are the property of their
respective owners.
Notice
Some features of the product and its accessories described herein rely on the software
installed, capacities and settings of local network, and may not be activated or may be
limited by local network operators or network service providers, thus the descriptions herein
may not exactly match the product or its accessories you purchase.
Huawei Technologies Co., Ltd reserves the right to change or modify any information or
specifications contained in this manual without prior notice or obligation.
NO WARRANTY
THE CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY
APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED,
INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND
FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY,
RELIABILITY OR CONTENTS OF THIS MANUAL.
TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI
TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR
CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR
ANTICIPATED SAVINGS.
Import and Export Regulations
Customers shall comply with all applicable export or import laws and regulations and will
obtain all necessary governmental permits and licenses in order to export, re-export or
import the product mentioned in this manual including the software and technical data
therein.
i
Contents
Getting to Know the MU709...........................................................................................................................1
PCB Design............................................................................................................................................................2
Assembly................................................................................................................................................................3
1
Thank you for purchasing HUAWEI MU709Gs-8 HSPA+ LGA
Module (hereinafter referred to as the MU709)
Note:
This manual briefly describes the preparation, the process for PCB Design, Assembly
and safety precautions.
You are recommended to read the manual before using the MU709.
Getting to Know the MU709
The package of the LGA module is 145 pin LGA with a dimension of 30 mm × 30 mm ×
2.27 mm. It is applied to the user interface board, and can be used as a wireless terminal
in a network environment.
2
PCB Design
PCB Pad Design
To achieve assembly yields and solder joints of high reliability, it is recommended that
the PCB pad size be designed as follows: the sizes of the solder pads on customers'
PCBs are the same as those of the module's solder pads for the high production
efficiency and high reliability of solder joints. For details, see the following figure:
3
Requirements on PCB Layout
To reduce deformation, a thickness of at least 1.0 mm is recommended.
Other devices must be located more than 3 mm (5 mm recommended) away from the
LGA module. The minimum distance between the LGA module and the PCB edge is 0.5
mm.
When the PCB layout is double sided, it is recommended that the LGA module be
placed on the second side for assembly; so as to avoid module dropped from PCB or
component (located in module) re-melding defects caused by uneven weight.
Design of Solder Mask
The PCB pad design can be solder mask defined (SMD), or non-solder mask defined
(NSMD).NSMD is recommended. In addition, the solder mask of the NSMD pad design
is larger than the pad so the reliability of the solder joint can be improved.
The solder mask must be 100 µm to150 µm larger than the pad, that is, the single side
of the solder mask must be 50 µm to 75 µm larger than the pad. The specific size
depends on the processing capability of the PCB manufacturer.
Assembly
Stencil Design
It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For the
stencil design, see the following figure：
4
0.6
5
Reflow Profile
For the soldering temperature of the LGA module, see the following figure.
Reflow profile
Reflow parameters
Temperature Zone
Time
Key Parameter
Preheat zone (40°C–150°C)
60s–120s
Heating rate:
0.5°C/s–2°C/s
6
Soak zone
(150°C–200°C)
(t1–t2): 60s–120s
Heating rate: < 1.0°C/s
Reflow zone (> 217°C)
(t3–t4): 30s–90s
Peak reflow
temperature:
230°C–250°C
Cooling zone
Cooling rate: 1°C/s ≤ Slope ≤ 4°C/s
Andere Huawei Steuereinheit Handbücher
Huawei
Huawei ME936 Montageanleitung
Huawei
Huawei MU509 Series Bedienungsanleitung
Huawei
Huawei ME906V Bedienungsanleitung
Huawei
Huawei CX116 Kurzanleitung
Huawei
Huawei PLC CCO01A Bedienungsanleitung
Huawei
Huawei EM770V Bedienungsanleitung
Huawei
Huawei PDU5000 Bedienungsanleitung
Huawei
Huawei RTN 380H Bedienungsanleitung
Huawei
Huawei EM660C EVDO Bedienungsanleitung
Huawei
Huawei SmartLi-ESM-24020P1 Bedienungsanleitung
Huawei
Huawei ECC500 Bedienungsanleitung
Huawei
Huawei MU509 Series Handbuch
Huawei
Huawei MU609 Benutzerhandbuch
Huawei
Huawei MU709 Series Montageanleitung
Huawei
Huawei MC509 Montageanleitung
Huawei
Huawei SmartAX MA5600T Leitfaden
Huawei
Huawei PDC V2.0 Bedienungsanleitung
Huawei
Huawei ME936 Montageanleitung
Huawei
Huawei ME909u-521 Montageanleitung
Huawei
Huawei ME906E Bedienungsanleitung
Beliebte Steuereinheit Handbücher anderer Marken
Festo
Festo Compact Performance CP-FB6-E Stücklistenhandbuch
Elo TouchSystems
Elo TouchSystems DMS-SA19P-EXTME Bedienungsanleitung
JS Automation
JS Automation MPC3034A Bedienungsanleitung
JAUDT
JAUDT SW GII 6406 Series Kurzanleitung
Spektrum
Spektrum Air Module System Bedienungsanleitung
BOC Edwards
BOC Edwards Q Series Bedienungsanleitung
