IBM Flex System x240 Compute Node Bedienungsanleitung

IBM Flex System x240 Compute Node 1

I B M ®

IBM Flex System x240 Compute Node

IBM Redbooks Product Guide

The IBM Flex System™ x240 Compute Node is a high-performance server that offers outstanding

performance for virtualization with new levels of CPU performance and memory capacity, and flexible

configuration options. The x240 Compute Node is an efficient server designed to run a broad range of

workloads, armed with advanced management capabilities allowing you to manage your physical and

virtual IT resources from a single-pane of glass.

Suggested use: database, virtualization, enterprise applications, collaboration/email, streaming media,

web, HPC, Microsoft RemoteFX, and cloud applications.

Figure 1 shows the IBM Flex System x240 Compute Node.

Figure 1. The IBM Flex System x240 Compute Node

Did you know?

IBM Flex System is a new category of computing that integrates multiple server architectures, networking,

storage, and system management capability into a single system that is easy to deploy and manage. IBM

Flex System has full built-in virtualization support of servers, storage, and networking to speed

provisioning and increased resiliency. In addition, it supports open industry standards, such as operating

systems, networking and storage fabrics, virtualization, and system management protocols, to easily fit

within existing and future data center environments. IBM Flex System is scalable and extendable with

multi-generation upgrades to protect and maximize IT investments.

IBM Flex System x240 Compute Node 2

Key features

The IBM Flex System x240 Compute Node is a high-availability, scalable compute node optimized to

support the next-generation microprocessor technology and is ideally suited for medium and large

businesses. This section describes the key features of the server.

Scalability and performance

The x240 offers numerous features to boost performance, improve scalability, and reduce costs:

The Intel Xeon Processor E5-2600 product family improves productivity by offering superior system



performance with up to 8-core processors and up to 3.3 GHz core speeds depending on the CPU's

number of cores, up to 20 MB of L3 cache, and QPI interconnect links of up to 8 GT/s.

The Intel Xeon Processor E5-2600 provides up to 80% performance boost over the previous



generation, the Intel Xeon Processor 5600 (Westmere EP).

Up to two processors, 16 cores, and 32 threads maximize the concurrent execution of multi-threaded



applications.

Intelligent and adaptive system performance with Intel Turbo Boost Technology 2.0 allows CPU cores



to run at maximum speeds during peak workloads by temporarily going beyond processor TDP.

Intel Hyper-Threading Technology boosts performance for multi-threaded applications by enabling



simultaneous multi-threading within each processor core, up to two threads per core.

Intel Virtualization Technology integrates hardware-level virtualization hooks that allow operating



system vendors to better utilize the hardware for virtualization workloads.

Intel Advanced Vector Extensions (AVT) significantly improve floating point performance for



compute-intensive technical and scientific applications compared with Intel Xeon 5600 series

processors.

Up to 24 DDR3 ECC memory RDIMMs provide speeds up to 1600 MHz and a memory capacity of up



to 384 GB. Load-reduced DIMMs (LRDIMMs) are supported with a maximum capacity of 768 GB.

The theoretical maximum memory bandwidth of the Intel Xeon processor E5 family is 51.6 GBps,



which is 60% more than in the previous generation of Intel Xeon processors.

The use of solid-state drives (SSDs) instead of or along with traditional spinning drives (HDDs) can



significantly improve I/O performance. An SSD can support up to 100 times more I/O operations per

second (IOPS) than a typical HDD.

Up to 16 virtual I/O ports per compute node with integrated 10 Gb Ethernet ports, offering the choice



of Ethernet, Fibre Channel, iSCSI, or FCoE connectivity.

The x240 offers PCI Express 3.0 I/O expansion capabilities that improve the theoretical maximum



bandwidth by 60% (8 GT/s per link), compared with the previous generation of PCI Express 2.0.

With Intel Integrated I/O Technology, the PCI Express 3.0 controller is integrated into the Intel Xeon



processor E5 family. This helps to dramatically reduce I/O latency and increase overall system

performance.

Support for high-bandwidth I/O adapters, up to two in each x240 Compute Node. Support for 10 Gb



Ethernet, 16 Gb Fibre Channel, and FDR InfiniBand.

Availability and serviceability

The x240 provides many features to simplify serviceability and increase system uptime:

Chipkill, memory mirroring and memory rank sparing for redundancy in the event of a non-correctable



memory failure.

IBM Flex System x240 Compute Node 3

Tool-less cover removal provides easy access to upgrades and serviceable parts, such as CPU,



memory, and adapter cards.

Hot-swap drives supporting integrated RAID 1 redundancy for data protection and greater system



uptime.

A light path diagnostics panel and individual light path LEDs to quickly lead the technician to failed (or



failing) components. This simplifies servicing, speeds up problem resolution, and helps improve

system availability.

Predictive Failure Analysis (PFA), which detects when system components (such as processors,



memory, and hard disk drives) operate outside of standard thresholds and generates pro-active alerts

in advance of possible failure, therefore increasing uptime.

Solid-state drives (SSDs), which offer significantly better reliability than traditional mechanical HDDs



for greater uptime.

Built-in Integrated Management Module II (IMM2) continuously monitors system parameters, triggers



alerts, and performs recovering actions in case of failures to minimize downtime.

Built-in diagnostics using Dynamic Systems Analysis (DSA) Preboot speeds up troubleshooting



tasks to reduce service time.

Three-year customer replaceable unit and onsite limited warranty, next business day 9x5. Optional



service upgrades are available.

Manageability and security

Powerful systems management features simplify local and remote management of the x240:

The x240 includes an Integrated Management Module II (IMM2) to monitor server availability and



perform remote management.

Integrated industry-standard Unified Extensible Firmware Interface (UEFI) enables improved setup,



configuration, and updates, and simplifies error handling.

Integrated Trusted Platform Module (TPM) 1.2 support enables advanced cryptographic functionality,



such as digital signatures and remote attestation.

Industry-standard AES NI support for faster, stronger encryption.



Integrates with the IBM® Flex System™ Manager for proactive systems management. It offers



comprehensive systems management for the entire IBM Flex System platform that help to increase

up-time, reduce costs, and improve productivity through advanced server management capabilities.

IBM Fabric Manager simplifies deployment of infrastructure connections by managing network and



storage address assignments.

Intel Execute Disable Bit functionality can help prevent certain classes of malicious buffer overflow



attacks when combined with a supporting operating system.

Intel Trusted Execution Technology provides enhanced security through hardware-based resistance



to malicious software attacks, allowing an application to run in its own isolated space protected from

all other software running on a system.

Energy efficiency

The x240 offers the following energy-efficiency features to save energy, reduce operational costs,

increase energy availability, and contribute to the green environment:

Component-sharing design of the IBM Flex System chassis provides ultimate power and cooling



savings.

IBM Flex System x240 Compute Node 4

The Intel Xeon processor E5-2600 product family offers significantly better performance over the



previous generation while fitting into the same thermal design power (TDP) limits.

Intel Intelligent Power Capability powers individual processor elements on and off as needed, to



reduce power draw.

Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally



constrained data centers and telecommunication environments.

Low-voltage 1.35 V DDR3 memory RDIMMs consume 15% less energy than 1.5 V DDR3 RDIMMs.



Solid state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch



HDDs.

The x240 uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology.



Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow

through the system.

Active Energy Manager provides advanced power management features with actual real-time energy



monitoring, reporting, and capping features.

Locations of key components and connectors

Figure 2 shows the front of the server.

Figure 2. Front view of the IBM Flex System x240 Compute Node

IBM Flex System x240 Compute Node 5

Figure 3 shows the locations of key components inside the server.

Figure 3. Inside view of the IBM Flex System x240 Compute Node

Standard specifications

The following table lists the standard specifications.

Table 1. Standard specifications (part 1)

Components Specification

Form factor Half-wide compute node.

Chassis support IBM Flex System Enterprise Chassis.

Processor Up to two Intel Xeon Processor E5-2600 product family CPUs with eight-core (up to 2.9 GHz) or

six-core (up to 2.9 GHz) or quad-core (up to 3.3 GHz) or dual-core (up to 3.0 GHz). Two QPI

links up to 8.0 GT/s each. Up to 1600 MHz memory speed. Up to 20 MB L3 cache.

Chipset Intel C600 series.

Memory Up to 24 DIMM sockets (12 DIMMs per processor) using Low Profile (LP) DDR3 DIMMs.

RDIMMs, UDIMMs, and LRDIMMs supported. 1.5 V and low-voltage 1.35 V DIMMs supported.

Support for up to 1600 MHz memory speed depending on the processor. Four memory

channels per processor (three DIMMs per channel). Supports two DIMMs per channel operating

at 1600 MHz (2 DPC @ 1600MHz) with single and dual rank RDIMMs. Supports three DIMMs

per channel at 1066 MHz 1600MHz) with single and dual rank RDIMMs.

Memory

maximums With LRDIMMs: Up to 768 GB with 24x 32 GB LRDIMMs and two processors.

With RDIMMs: Up to 384 GB with 24x 16 GB RDIMMs and two processors.

With UDIMMs: Up to 64 GB with 16x 4 GB UDIMMs and two processors.

Memory

protection ECC, Chipkill (for x4-based memory DIMMs), memory mirroring, and memory rank sparing.

IBM Flex System x240 Compute Node 6

Table 1. Standard specifications (part 2)

Components Specification

Disk drive bays Two 2.5" hot-swap SAS/SATA drive bays supporting SAS, SATA, and SSD drives. Optional

eXFlash support for up to eight 1.8” SSDs.

Maximum

internal storage With two 2.5” hot-swap drives: Up to 2 TB with 1 TB 2.5" NL SAS HDDs, or up to 1.8 TB with

900 GB 2.5" SAS HDDs, or up to 2 TB with 1 TB 2.5" SATA HDDs, or up to 512 GB with 256 GB

2.5" SATA SSDs. Intermix of SAS and SATA HDDs and SSDs is supported. With eXFlash 1.8”

SSDs and ServeRAID M5115 RAID adapter: Up to 1.6 TB with eight 200 GB 1.8” SSDs.

RAID support RAID 0 and 1 with integrated LSI SAS2004 controller. Optional ServeRAID M5115 RAID

controller with RAID 0, 1, 10, 5, 50 support and 1 GB cache. Supports up to eight 1.8” SSD with

expansion kits. Optional flash-backup for cache, RAID 6/60, SSD performance enabler.

Network

interfaces x2x models: Two 10 Gb Ethernet ports with Embedded 10Gb Virtual Fabric Ethernet

LAN-on-motherboard (LOM) controller; Emulex BE3 based.

x1x models: None standard; optional 1Gb or 10Gb Ethernet adapters.

PCI Expansion

slots Two I/O connectors for adapters. PCI Express 3.0 x16 interface.

Ports USB ports: One external. Two internal for embedded hypervisor with optional USB Enablement

Kit. Console breakout cable port providing local KVM and serial ports (cable standard with

chassis; additional cables optional).

Systems

management UEFI, IBM Integrated Management Module 2 (IMM2) with Renesas SH7757 controller,

Predictive Failure Analysis, light path diagnostics panel, automatic server restart, remote

presence. Support for IBM Flex System Manager, IBM Systems Director and Active Energy

Manager, IBM ServerGuide.

Security

features Power-on password, administrator's password, Trusted Platform Module 1.2.

Video Matrox G200eR2 video core with 16 MB video memory integrated into the IMM2. Maximum

resolution is 1600x1200 at 75 Hz with 16 M colors.

Limited

warranty 3-year customer-replaceable unit and onsite limited warranty with 9x5/NBD.

Operating

systems

supported

Microsoft Windows Server 2008 R2, Red Hat Enterprise Linux 5 and 6, SUSE Linux Enterprise

Server 10 and 11, VMware ESX 4. See "Supported operating systems" for details.

Service and

support Optional service upgrades are available through IBM ServicePacs®: 4-hour or 2-hour response

time, 8-hour fix time, 1-year or 2-year warranty extension, remote technical support for IBM

hardware and selected IBM and OEM software.

Dimensions Width: 215 mm (8.5”), height 51 mm (2.0”), depth 493 mm (19.4”).

Weight Maximum configuration: 6.98 kg (15.4 lb).

The x240 servers are shipped with the following items:

Statement of Limited Warranty



Important Notices



Documentation CD that contains the

Installation and User's Guide



IBM Flex System x240 Compute Node 7

Standard models

Table 2 lists standard models.

Table 2. Standard models

Model___ Processor (2 maximum)* Memory

(max

786 GB)

Disk

adapter Disk bays

(used/max)† Disks 10 GbE

Embedded

Virtual

Fabric‡

I/O slots

(used/max)

8737-A1x 1x Xeon E5-2630L 6C 2.0GHz

15MB 1333MHz 60W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open No 0 / 2

8737-D2x 1x Xeon E5-2609 4C 2.40GHz

10MB 1066MHz 80W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-F2x 1x Xeon E5-2620 6C 2.0GHz

15MB 1333MHz 95W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-G2x 1x Xeon E5-2630 6C 2.3GHz

15MB 1333MHz 95W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-H1x 1x Xeon E5-2640 6C 2.5GHz

15MB 1333MHz 95W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open No 0 / 2

8737-H2x 1x Xeon E5-2640 6C 2.5GHz

15MB 1333MHz 95W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-J1x 1x Xeon E5-2670 8C 2.6GHz

20MB 1600MHz 115W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open No 0 / 2

8737-L2x 1x Xeon E5-2660 8C 2.2GHz

20MB 1600MHz 95W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-M1x 1x Xeon E5-2680 8C 2.7GHz

20MB 1600MHz 130W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open No 0 / 2

8737-M2x 1x Xeon E5-2680 8C 2.7GHz

20MB 1600MHz 130W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-N2x 1x Xeon E5-2643 4C 3.3GHz

10MB 1600MHz 130W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-Q2x 1x Xeon E5-2667 6C 2.9GHz

15MB 1600MHz 130W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

8737-R2x 1x Xeon E5-2690 8C 2.9GHz

20MB 1600MHz 135W 2x 4 GB SAS/SATA

RAID 2.5” hot-swap

(0 / 2) Open Standard 1 / 2‡

* Processor detail: Processor quantity and model, cores, core speed, L3 cache, memory speed, power

consumption.

† The 2.5-inch drive bays can be replaced and expanded with IBM eXFlash and a ServeRAID M5115 RAID

controller to support up to eight 1.8-inch solid state drives (SSDs).

‡ The x2x models include an Embedded 10Gb Virtual Fabric Ethernet controller. Connections are routed using a

Fabric Connector. The Fabric Connector precludes the use of an I/O adapter in I/O connector 1.

Chassis support

The x240 is supported in the IBM Flex System Enterprise Chassis.

IBM Flex System x240 Compute Node 8

Processor options

The x240 supports the processor options listed in the following table. The server supports one or two

processors. The table also shows which server models have each processor standard. If no

corresponding

where used

model for a particular processor is listed, then this processor is available only

through Configure to Order (CTO).

Table 3. Processor options

Part

number Intel Xeon processor description Models

where used

81Y5180 Intel Xeon Processor E5-2603 4C 1.8GHz 10MB Cache 1066MHz 80W -

81Y5182 Intel Xeon Processor E5-2609 4C 2.40GHz 10MB Cache 1066MHz 80W D2x

81Y5183 Intel Xeon Processor E5-2620 6C 2.0GHz 15MB Cache 1333MHz 95W F2x

81Y5184 Intel Xeon Processor E5-2630 6C 2.3GHz 15MB Cache 1333MHz 95W G2x

81Y5206 Intel Xeon Processor E5-2630L 6C 2.0GHz 15MB Cache 1333MHz 60W A1x

49Y8125 Intel Xeon Processor E5-2637 2C 3.0GHz 5MB Cache 1600MHz 80W -

81Y5185 Intel Xeon Processor E5-2640 6C 2.5GHz 15MB Cache 1333MHz 95W H1x, H2x

81Y5190 Intel Xeon Processor E5-2643 4C 3.3GHz 10MB Cache 1600MHz 130W N2x

95Y4670 Intel Xeon Processor E5-2648L 8C 1.8GHz 20MB Cache 1600MHz 70W -

81Y5186 Intel Xeon Processor E5-2650 8C 2.0GHz 20MB Cache 1600MHz 95W -

81Y5179 Intel Xeon Processor E5-2650L 8C 1.8GHz 20MB Cache 1600MHz 70W -

95Y4675 Intel Xeon Processor E5-2658 8C 2.1GHz 20MB Cache 1600MHz 95W -

81Y5187 Intel Xeon Processor E5-2660 8C 2.2GHz 20MB Cache 1600MHz 95W L2x

49Y8144 Intel Xeon Processor E5-2665 8C 2.4GHz 20MB Cache 1600MHz 115W -

81Y5189 Intel Xeon Processor E5-2667 6C 2.9GHz 15MB Cache 1600MHz 130W Q2x

81Y9418 Intel Xeon Processor E5-2670 8C 2.6GHz 20MB Cache 1600MHz 115W J1x

81Y5188 Intel Xeon Processor E5-2680 8C 2.7GHz 20MB Cache 1600MHz 130W M1x, M2x

49Y8116 Intel Xeon Processor E5-2690 8C 2.9GHz 20MB Cache 1600MHz 135W R2x

Memory options

IBM DDR3 memory is compatibility tested and tuned for optimal performance and throughput. IBM

memory specifications are integrated into the light path diagnostics for immediate system performance

feedback and optimum system uptime. From a service and support standpoint, IBM memory

automatically assumes the IBM system warranty, and IBM provides service and support worldwide.

The x240 supports Low Profile (LP) DDR3 memory RDIMMs, UDIMMs, and LRDIMMs. The server

supports up to 12 DIMMs when one processor is installed and up to 24 DIMMs when two processors are

installed. Each processor has four memory channels, and there are three DIMMs per channel.

IBM Flex System x240 Compute Node 9

The following rules apply when selecting the memory configuration:

Mixing 1.5 V and 1.35 V DIMMs in the same server is supported. In such a case all DIMMs operate at



1.5 V.

The maximum number of ranks supported per channel is eight.



The maximum quantity of DIMMs that can be installed in the server depends on the number of CPUs,



DIMM rank, and operating voltage, as shown in the "Max. qty supported" row in the following table.

The shaded cells indicate that the DIMM type supports the maximum number of DIMMs (24 for the

x240)

All DIMMs in all CPU memory channels operate at the same speed, which is determined as the



lowest value of:

Memory speed supported by specific CPU



Lowest maximum operating speed for the selected memory configuration that depends on rated



speed, as shown under the "Max. operating speed" section in the following table. The shaded

cells indicate that the speed indicated is the maximum that the DIMM allows.

Table 4. Maximum memory speeds

Specification UDIMMs RDIMMs LRDIMMs

Rank Dual rank Single rank Dual rank Quad rank Quad rank

Rated speed 1333 MHz 1333 MHz 1600

MHz 1333 MHz 1600

MHz 1066 MHz 1333 MHz

Rated voltage 1.35 V 1.35 V 1.5 V 1.35 V 1.5 V 1.35 V 1.35 V

Operating

voltage 1.35 V 1.5 V 1.35 V 1.5 V 1.5 V 1.35 V 1.5 V 1.5 V 1.35 V 1.5 V 1.35 V 1.5 V

Max quantity* 16 16 16 24 24 16 24 24 8 16 24 24

Largest DIMM 4 GB 4 GB 4 GB 4 GB 4 GB 16 GB 16 GB 16 GB 32 GB 32 GB 32 GB 32 GB

Max memory

capacity 64 GB 64 GB 64 GB 96 GB 96 GB 256 GB 384 GB 384 GB 256 GB 512 GB 768 GB 768 GB

Max memory

at rated speed 64 GB 64 GB 64 GB 64 GB 64 GB 256 GB 256 GB 256 GB 128 GB 256 GB 768 GB 512 GB

Maximum operating speed (MHz)

1 DIMMs

per channel 1333

MHz 1333

MHz 1600

MHz 1333

MHz 1600

MHz 800

MHz 1066

MHz 1333

MHz

2 DIMMs

per channel 1333

MHz 1333

MHz 1600

MHz 1333

MHz 1600

MHz NS** 800

MHz 1066

MHz 1333

MHz

3 DIMMs

per channel NS** NS** NS** 1066

MHz 1066

MHz NS** 1066

MHz 1066

MHz NS** NS** 1066

MHz 1066

MHz

* The maximum quantity supported is shown for two processors installed. When one processor is installed, the

maximum quantity supported is a half of that shown.

** NS = Not supported. When three 1.35 V DIMMs are installed in a memory channel, they operate at 1.5 V instead.

The following memory protection technologies are supported:

ECC



Chipkill (for x4-based memory DIMMs -- look for "x4" in the DIMM description)



Memory mirroring



Memory sparing



If memory mirroring is used, then DIMMs must be installed in pairs (minimum of one pair per CPU), and

both DIMMs in a pair must be identical in type and size.

IBM Flex System x240 Compute Node 10

If memory rank sparing is used, then a minimum of one quad-rank DIMM or two single-rank or dual-rank

DIMMs must be installed per populated channel (the DIMMs do not need being identical). In rank sparing

mode, one rank of a DIMM in each populated channel is reserved as spare memory. The size of a rank

varies depending on the DIMMs installed.

The following table lists memory options available for the x240 server. DIMMs can be installed one at a

time, but for performance reasons, install them in sets of four (one for each of the four memory channels).

Table 5. Memory options for the x240

Part number Description Models

where used

Registered DIMM (RDIMM) modules

49Y1405 2GB (1x2GB, 1Rx8, 1.35V) PC3L-10600 CL9 ECC DDR3 1333MHz LP RDIMM -

49Y1406 4GB (1x4GB, 1Rx4, 1.35V) PC3L-10600 CL9 ECC DDR3 1333MHz LP RDIMM H1x, H2x, G2x,

F2x, D2x, A1x

49Y1407 4GB (1x4GB, 2Rx8, 1.35V) PC3L-10600 CL9ECC DDR3 1333MHz LP RDIMM -

49Y1559 4GB (1x4GB, 1Rx4, 1.5V) PC3-12800 CL11 ECC DDR3 1600MHz LP RDIMM R2x, Q2x, N2x, M2x,

M1x, L2x, J1x

90Y3178 4GB (1x4GB, 2Rx8, 1.5V) PC3-12800 CL11 ECC DDR3 1600MHz LP RDIMM -

90Y3109 8GB (1x8GB, 2Rx4, 1.5V) PC3-12800 CL11 ECC DDR3 1600MHz LP RDIMM -

49Y1397 8GB (1x8GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC DDR3 1333MHz LP RDIMM -

49Y1563 16GB (1x16GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC DDR3 1333MHz LP RDIMM -

49Y1400 16GB (1x16GB, 4Rx4, 1.35V) PC3L-8500 CL7 ECC DDR3 1066MHz LP RDIMM -

00D4968 16GB (1x16GB, 2Rx4, 1.5V) PC3-12800 CL11 ECC DDR3 1600MHz LP RDIMM -

Unbuffered DIMM (UDIMM) modules

49Y1404 4GB (1x4GB, 2Rx8, 1.35V) PC3L-10600 CL9 ECC DDR3 1333MHz LP UDIMM -

Load-reduced (LRDIMM) modules

49Y1567 16GB (1x16GB, 4Rx4, 1.35V) PC3L-10600 CL9 ECC DDR3 1333MHz LP LRDIMM -

90Y3105 32GB (1x32GB, 4Rx4, 1.35V) PC3L-10600 CL9 ECC DDR3 1333MHz LP LRDIMM -

Internal disk storage options

The x240 server has two 2.5" hot-swap drive bays accessible from the front of the blade server (Figure 2).

These bays are connected to the integrated 4-port LSI SAS2004 6 Gbps SAS/SATA RAID-on-Chip (ROC)

controller.

The integrated LSI SAS2004 ROC has the following features:

Four-port controller with 6 Gbps throughput per port



PCIe x4 Gen 2 host interface



Two SAS ports routed internally to the two hot-swap drive bays



Supports RAID levels 0 (Integrated Striping), 1 (Integrated Mirroring), 10 (Integrated Mirroring and



Striping), and 1E (Integrated Mirroring Enhanced)

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