Intel Pentium II Montage- und Bedienungsanleitung

Pentium

Processor –

Low-Power Module at 266 MHz

Memory Bus Simulation

Methodology

Application Note

June 1999

Order Number: 273217-002

Application Note

Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to

fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not

intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Pentium®II processor – Low-Power Module may contain design defects or errors known as errata which may cause the products to deviate from

published specifications. Current characterized errata are available on request.

MPEG is an international standard for video compression/decompression promoted by ISO. Implementations of MPEG CODECs, or MPEG enabled

platforms may require licenses from various entities, including Intel Corporation.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling

1-800-548-4725 or by visiting Intel's website at http://www.intel.com.

*Third-party brands and names are the property of their respective owners.

Application Note 3

Low-Power Module Memory Bus Simulation Methodology

Contents

1.0 Introduction..................................................................................................................5

1.1 Key Terms.............................................................................................................5

1.2 Related Documents...............................................................................................5

2.0 SimulationPrerequisites.........................................................................................6

3.0 SimulationBlockDiagram......................................................................................6

4.0 Details of the Electrical Interconnect Models.................................................7

5.0Simulation Conditions..............................................................................................8

6.0 Flight Time andSignal QualityDefinitions....................................................11

6.1 Procedure 1:Determining Flight Time.................................................................11

6.1.1Flight Time Determinationfor Setup Time..............................................12

6.1.2Hold Time...............................................................................................13

6.2 Procedure 2:Signal Quality.................................................................................14

Figures

1Simulation Model Components.............................................................................7

2400-pin Connector Package Model.......................................................................8

3DIMM Connector Package Model.........................................................................8

4DIMM Connection..................................................................................................9

5Determining Flight Time......................................................................................11

6Flight Time (Rising Edge)....................................................................................12

7Flight Time (Falling Edge)...................................................................................13

8Flight Time Measurement (With Ringing)............................................................15

Tables

1Related Intel Documents.......................................................................................5

2Fast, Slow, and Worst-Case Signal Quality Corner InterconnectModels.............7

3Low-Power Module Memory Interface Pin Loading...............................................9

4Simulation Conditions..........................................................................................10

5Signal Quality Criteria..........................................................................................14

Low-Power Module Memory Bus Simulation Methodology

Application Note 5

1.0 Introduction

This application note describes a simulation methodology for interfacing memory signals from the

Intel® Pentium®II Processor – Low-Power Module to the 66-MHz Unbuffered SDRAM Dual In-

Line Memory Modules (SDRAM DIMM).

The models used to drive the simulation tool are based on the I/O Buffer Industry Standard (IBIS).

1.1 Key Terms

The Low-Power Module is identical to the Pentium II Processor Mobile Module Connector

(MMC-2). A complete description of this module is located in the Intel

Pentium

II Processor –

Low-Power Module datasheet (order number 273256).

Intel 440BX AGPset refers to both the 82443 BX Host Bridge/Controller and the 82371EB PCI

ISA IDE Xcelerator. A complete description of this chipset is located in both the Intel

440BX

AGPset: 82443BX Host Bridge/Controller datasheet (order number 290633) and the 82371AB

PCI-TO-ISA/IDE Xcelerator (PIIX4) datasheet (order number 290562).

SDRAM DIMM refers to synchronous DRAM dual in-line memory modules.

SE Board refers to the system electronics board.

1.2 Related Documents

These documents are available for download from Intel’s World Wide Web site at

http://www.intel.com.

Table 1. Related Intel Documents

Document Order Number

Intel

Pentium

Processor – Low-Power Module

datasheet 273256

Mobile Pentium

Processor Specification Update

243887

82371AB PCI-TO-ISA/IDE Xcelerator (PIIX4)

datasheet 290562

Intel

440BX AGPset: 82443BX Host Bridge/Controller

datasheet 290633

82443BX Host Bridge/Controller Electrical and Thermal Timing Specification

datasheet addendum

273218

Intel

440BX AGPset: 82443BX Host Bridge/Controller Specification Update

290639

Low-Power Module Memory Bus Simulation Methodology

6Application Note

2.0 Simulation Prerequisites

The following information is needed to simulate the Low-Power Module memory bus:

•Pentium

II Processor Mobile Module MMC-2 I/O Buffer Model Specification, Rev 1.0

(contact your Intel Field Sales Representative)

— Module interconnect specifications

— Connector parameters

•82443BX Electrical and Thermal Timing Specifications datasheet addendum, Rev 1.0

(order number: 273218)

— 82443BX AC and DC Specifications

•4-Clock 66 MHz 72-Bit ECC Unbuffered SDRAM DIMM Design Specification, Rev 1.0

(http://developer.intel.com/)

— DIMM board layout

— SDRAM AC and DC specifications

•I/O Buffer Models

— 82443BX IBIS model, Rev 1.2 (contact your Intel Field Sales Representative). The

82443BX IBIS model is used for the Intel®440BX AGPset chipset.

— SDRAM component IBIS models. The 66-MHz unbuffered SDRAM IBIS models are

available in x8 and x16 configurations from various memory manufacturers.

3.0 Simulation Block Diagram

Figure 1 shows the simulation block diagram for the Low-Power Module/DIMM memory

interface. The Pentium II Processor Mobile Module MMC-2 I/O Buffer Model describes the

interconnect characteristics between the Low-Power Module 400-pin connector, and the 82443BX

Host Bridge/Controller.

As shown in Figure 1, the 400-pin connector is used to model the net (TL-1) and the 400-pin

connector model. The 4-clock, 66-MHz, 72-bit Unbuffered SDRAM DIMM specification, which

describes the interconnect characteristics of the SDRAM DIMM, is used to model the nets (TL-3,

TL-4, TL-5, TL-6) of DIMM. Based on all the corners of simulations, as described in Section 5.0,

the interconnect on the system electronics (SE) board (TL-2) can be specified to meet the setup/

hold requirements for both the SDRAM and 82443BX Host Bridge/Controller.

Low-Power Module Memory Bus Simulation Methodology

Application Note 7

4.0 Details of the Electrical Interconnect Models

This section provides detailed information on the electrical interconnect models used for the

simulation. Table 2 lists the assumed characteristics for the Low-Power Module, the SE board, and

the DIMM interface, for fast, slow, and worst-case signal quality models.

Figure 1. Simulation Model Components

A6429-01

TL-4

TL-3TL-2TL-1 TL-5

TL-6

82443BX

IBIS

SDRAM

IBIS

400-pin

Connector DIMM

Connector .

Table 2. Fast, Slow, and Worst-Case Signal Quality Corner Interconnect Models

Component Parameter Fast Typical Slow Units

Low-Power Module

Impedance (Z0)475563Ω

Dielectric (Er)4.14.44.8

Trace Propagation Delay (tpd) 138 162 186 ps/in

SE Board

Impedance (Z0)475563Ω

Dielectric (Er)4.14.44.8

Trace Propagation Delay (tpd) 138 162 186 ps/in

DIMM

Impedance (Z0)607080Ω

Dielectric (Er)4.24.44.8

Trace Propagation Delay (tpd) 133 158 183 ps/in

Low-Power Module Memory Bus Simulation Methodology

8Application Note

Figure 2, shows the Pi-element network model used for the 400-pin module connector.

Figure 3 shows the Pi-element network model used for the DIMM connector.

5.0 Simulation Conditions

The DIMM topology routing for each signal is defined in the 4-Clock 66 MHz 72-Bit ECC

Unbuffered SDRAM DIMM design specification. Figure 4 shows the 2-DIMM system connection

and the possible receiver pin loads for each memory signal. For example, a fully populated x8 with

ECC arrangement for a 2-DIMM system yields the heaviest receiving pin load (2 x 18 = 36 loads)

on the SRAS_A#, SCAS_A#, WE_A#, and MAB# signals, as shown in Table 3. Since the Low-

Power Module is also designed to support a 1-DIMM system, a x16 arrangement DIMM yields the

lightest pin load (four loads) on the same signals.

The heaviest and lightest receiving pin loads for each Low-Power Module memory signal is used

for slow (setup) and fast (hold) corner simulations, respectively.

The DIMMs used for this simulation are x8, x8 with ECC, and x16 DIMM arrangements.

Figure 2. 400-pin Connector Package Model

AA6430-01

R = 0.01 Ohms L = 3.5 nH

C =

0.5 pF C =

0.5 pF

Figure 3. DIMM Connector Package Model

A6431-01

R = 0.027 Ohms L = 5 nH

C =

0.9 pF C =

0.9 pF

Low-Power Module Memory Bus Simulation Methodology

Application Note 9

Figure 4. DIMM Connection

Table 3. Low-Power Module Memory Interface Pin Loading

SDRAM

Signals

Number of Populated

DIMM Sockets on

SE Board†

Number of Pin Loads

DIMM x8 DIMM x8

with ECC DIMM x16

SRAS_A# 1 min, 2 max 8 min, 16 max 9 min, 18 max 4 min, 8 max

SCAS_A# 1 min, 2 max 8 min, 16 max 9 min, 18 max 4 min, 8 max

WE_A# 1 min, 2 max 8 min, 16 max 9 min, 18 max 4 min, 8 max

MAB[x:x]# 1 min, 2 max 8 min, 16 max 9 min, 18 max 4 min, 8 max

CKE[x:x] 1894

CS_A[x:x]# 1894

MD[x:x], MECC[x:x] 1 min, 2 max 1 min, 2 max 1 min, 2 max 1 min, 2 max

DQM_A[x:x]# 1 min, 2 max 1 min, 2 max 1 min, 2 max 1 min, 2 max

†Assumes a 2-DIMM socket system.

DIMM 1

DIMM 0

Closest Connector

Farthest Connector

CS_A[3:2]#, CS_A[3:2]#

CS_A[1:0]#, CS_A[1:0]#

WE_A#

SRAS_A#

SCAS_A#

DQM_A[7:0]#

MECC[7:0]

MD[63:0]

DIMM_CLK[3:0]

DIMM_CLK[7:4]

SMB_CLK

SMB_DATA

CKE_[1:0]

CKE_[3:2]

RAS

CAS

/S1/S0,/S3/S2

DQ[63:0]

CB[7:0]

DQM

CK[3:0]

CKE

SCL

SDA

MAB[12:11,9:0]#, MAB[13,10] A[13:0]

Low-Power Module Memory Bus Simulation Methodology

10 Application Note

Table 4 lists the Low-Power Module/DIMM condition used in the simulation. Each driver/receiver

pair of the memory signal with the heaviest/lightest pin load is simulated with these conditions.

The first four entries of the table are used for slow corner (setup) simulations in conjunction with

heaviest receiver pin loads of the driver/receiver signal pair. The last four entries of the table are

used for fast corner (hold) and signal quality simulations in conjunction with the lightest receiver

pin loads of the driver/receiver signal pair.

In general, a simulation tool assumes a no-loss transmission line in the pre-layout simulation. Also,

each signal is simulated as a single net. No crosstalk is taken into account.

After the S.E. board is designed to meet the memory interface trace length requirement, a crosstalk

simulation can be run with two adjacent parallel lines. The stackup and trace width are varied to

run a fast and slow corner simulation. However, this document only describes the methodology for

pre-layout simulations.

Table 4. Simulation Conditions

Driver Receiver

Low-Power

Module/SE Board

Trace Velocity

(ns/in)

DIMM

Trace Velocity

(ns/in)

Low-Power

Module/SE Board

Impedance

(ohms)

DIMM

Impedance

(ohms)

Slow Slow 0.186 0.183 63 80

Slow Slow 0.186 0.183 63 60

Slow Slow 0.186 0.183 47 80

Slow Slow 0.186 0.183 47 60

Fast Fast 0.138 0.133 63 80

Fast Fast 0.138 0.133 63 60

Fast Fast 0.138 0.133 47 80

Fast Fast 0.138 0.133 47 60

Andere Handbücher für Pentium II

Inhaltsverzeichnis

Andere Intel Computerhardware Handbücher

Intel

Intel RS25NB008 Bedienungsanleitung

Intel

Intel WPC2011BWW - PRO/Wireless 2011B LAN PC Card Bedienungsanleitung

Intel

Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor Leitfaden

Intel

Intel CHIPS HiQVideo Series Bedienungsanleitung

Intel

Intel Enpirion EM2COMIF Bedienungsanleitung

Intel

Intel Xeon X5570 Bedienungsanleitung

Intel

Intel P8700 - Core 2 Duo Processor Bedienungsanleitung

Intel

Intel H110 Express Bedienungsanleitung

Intel

Intel USB930HxADBD Bedienungsanleitung

Intel

Intel Core i7-2600 Gain Bedienungs- und Sicherheitshinweise

Intel

Intel 80C186EA Bedienungsanleitung

Intel

Intel E5345 - Xeon 2.33 GHz 8M L2 Cache 1333MHz FSB LGA771 Active Quad-Core... Bedienungsanleitung

Intel

Intel RMS2MH080 Installationshandbuch

Intel

Intel U3-1L Bedienungsanleitung

Intel

Intel RS25SB008 Installationshandbuch

Intel

Intel CELERON PROCESSOR P4505 - ADDENDUM Bedienungsanleitung

Intel

Intel PXA270 Bedienungsanleitung

Intel

Intel X5550 - Quad Core Xeon Leitfaden

Intel

Intel 855PM Leitfaden

Intel

Intel MultiProcessor Bedienungsanleitung

Intel

Intel E6600 - Core 2 Duo Dual-Core Processor Bedienungsanleitung

Intel

Intel 87C196CA Bedienungsanleitung

Intel

Intel CHIPS DKHiQV-AGP Bedienungsanleitung

Intel

Intel Xeon E5-2400 Leitfaden

Beliebte Computerhardware Handbücher anderer Marken

EMC2

EMC2 VNX Series Betriebsanleitung

Panasonic

Panasonic DV0PM20105 Bedienungsanleitung

Mitsubishi Electric

Mitsubishi Electric Q81BD-J61BT11 Bedienungsanleitung

Gigabyte

Gigabyte B660M DS3H AX DDR4 Bedienungsanleitung

Raidon

Raidon iT2300 Bedienungsanleitung

National Instruments

National Instruments PXI-8186 Bedienungsanleitung

Hauppauge

Hauppauge WinTV-HVR-2250 Bedienungsanleitung

Kontron

Kontron CP6002 Bedienungsanleitung

Manhattan

Manhattan 702843 Bedienungsanleitung

Aphex

Aphex 230 Bedienungsanleitung

AMD

AMD Phenom II Betriebshandbuch

dbx

dbx Zone Pro 1260 Bedienungsanleitung

Galaxy

Galaxy GHDX2-2430S-24F4D Bedienungsanleitung

Kontron

Kontron DIMM-PC/MD Bedienungsanleitung

ST X-NUCLEO-SAFEA1B Betriebsanleitung

STEINWAY LYNGDORF

STEINWAY LYNGDORF SP-1 Bedienungsanleitung

Advantech

Advantech ASMB-935 Series Bedienungsanleitung

Jupiter

Jupiter RAM PACK Bedienungsanleitung