JVC KD-G700 Bedienungsanleitung

SERVICE MANUAL

2004/1

CD RECEIVER

MA05020041KD-G700

TABLE OF CONTENTS

1 PRECAUTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

2 SPECIFIC SERVICE INSTRUCTIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-26

5 TROUBLE SHOOTING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27

Area suffix

J -------------- Northern America

SOUND

VOL VOL

SOURCE

ATT

1-2 (No.MA050)

SPECIFICATION

Design and specifications are subject to change without notice.

AUDIO AMPLIFIER SECTION

Maximum Power Output Front 50 W per channel

Rear 50 W per channel

Continuous Power Output (RMS) Front 19 W per channel into 4 Ω, 40 Hz to 20 000 Hz at no more

than 0.8% total harmonic distortion.

Rear 19 W per channel into 4 Ω, 40 Hz to 20 000 Hz at no more

than 0.8% total harmonic distortion.

Load Impedance 4 Ω(4 Ωto 8 Ωallowance)

Equalizer Control Range Low ±12 dB (60 Hz, 80 Hz, 100 Hz, 120 Hz)

Mid ±12 dB

High ±12 dB (8 kHz, 10 kHz, 12 kHz, 15 kHz)

Frequency Response 40 Hz to 20 000 Hz

Signal-to-Noise Ratio 70 dB

Line-In Level/Impedance KD-AR800 1.5 V/20 kΩload

Line-Out Level/Impedance KD-AR800 5.0 V/20 kΩload (full scale)

KD-G800 4.0 V/20 kΩload (full scale)

KD-G700 2.5 V/20 kΩload (full scale)

Output Impedance 1 kΩ

Subwoofer-Out Level/Impedance KD-AR800/KD-G800 2.0 V/20 kΩload (full scale)

TUNER SECTION

Frequency Range FM 87.5 MHz to 107.9 MHz

AM 530 kHz to 1 710 kHz

[FM Tuner] Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)

50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)

Alternate Channel Selectivity (400 kHz) 65 dB

Frequency Response 40 Hz to 15 000 Hz

Stereo Separation 35 dB

Capture Ratio 1.5 dB

[AM Tuner] Sensitivity 20 µV

Selectivity 35 dB

CD PLAYER SECTION

Type Compact disc player

Signal Detection System Non-contact optical pickup (semiconductor laser)

Number of channels 2 channels (stereo)

Frequency Response 5 Hz to 20 000 Hz

Dynamic Range 96 dB

Signal-to-Noise Ratio 98 dB

Wow and Flutter Less than measurable limit

MP3 decoding format MPEG1/2 Audio Layer 3 Max. Bit Rate:320 Kbps

WMA (Windows Media Audio) decoding format Max. Bit Rate:192 Kbps

GENERAL

Power Requirement Operating Voltage DC 14.4 V (11 V to 16 V allowance)

Grounding System Negative ground

Allowable Operating Temperature 0ºC to +40ºC (32ºF to 104ºF)

Dimensions (W ×H ×D) Installation Size (approx.) 182 mm ×52 mm ×159 mm (7-3/16" ×2-1/16" ×6-5/16")

Panel Size (approx.) 188 mm ×58 mm ×12 mm (7-7/16" ×2-5/16" ×1/2")

Mass (approx.) 1.5 kg (3.4 lbs) (excluding accessories)

(No.MA050)1-3

SECTION 1

PRECAUTION

1.1 Safety Precautions

!Burrs formed during molding may be left over on some parts of the chassis. Therefore,

pay attention to such burrs in the case of preforming repair of this system.

!Please use enough caution not to see the beam directly or touch it in case of an

adjustment or operation check.

1-4 (No.MA050)

1.2 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser

diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.

1.2.1 Grounding to prevent damage by static electricity

Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players.

Be careful to use proper grounding in the area where repairs are being performed.

(1) Ground the workbench

Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the

traverse unit (optical pickup) on it.

(2) Ground yourself

Use an anti-static wrist strap to release any static electricity built up in your body.

(3) Handling the optical pickup

• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical

pickup are shorted. After replacement, return the shorted parts to their original condition.

(Refer to the text.)

• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily

destroy the laser diode.

1.3 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.

(2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the

replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a

time when attaching it to the connector.

(3) Handle the flexible cable carefully as it may break when subjected to strong force.

(4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.4 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the CD pickup unit.

• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit.

(If the flexible wire is disconnected without applying solder, the CDpickup may be destroyed by static electricity.)

• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.

(caption)

Anti-static wrist strap

Conductive material

(conductive sheet) or iron plate

Pickup

Short-circuit point

(Soldering)

Flexible wire

(No.MA050)1-5

SECTION 2

SPECIFIC SERVICE INSTRUCTIONS

This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.

1-6 (No.MA050)

SECTION 3

DISASSEMBLY

3.1 Main body

3.1.1 Removing the front panel assembly

(See Fig.1)

(1) Push the detach button in the lower right part of the front

panel assembly.

(2) Remove the front panel assembly.

Fig.1

3.1.2 Removing the heat sink

(See Fig.2)

(1) From the left side of the main body, remove the two screws

A, two screws Band screw Cattaching the heat sink.

Fig.2

Front panel assembly

Detach button

Heat sink

AAC

(No.MA050)1-7

3.1.3 Removing the top chassis assembly

(See Figs.3 to 6)

• Prior to performing the following procedures, remove the heat

sink.

Reference:

Remove the front panel assembly as required.

(1) From the bottom side of the main body, remove the two

screws Dattaching the top chassis assembly to the bottom

chassis assembly. (See Fig.3.)

(2) From the both and rear sides of the main body, remove the

four screws Eattaching the top chassis assembly to the

bottom chassis assembly. (See Figs.4 to 6.)

(3) Lift the top chassis assembly in the direction of the arrow,

disconnect the connector CN501 on the main board. (See

Figs.5 and 6.)

(4) Take out the top chassis assembly from the bottom chassis

assembly.

Fig.3

Fig.4

Fig.5

Fig.6

Top chassis assembly

Bottom chassis assembly

Top chassis assembly

Bottom chassis assembly

CD mechanism assembly

Main board CN501

Top chassis assembly

Bottom chassis assembly

Rear bracket

1-8 (No.MA050)

3.1.4 Removing the front chassis

(See Figs.7 and 8)

• Prior to performing the following procedure, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the both sides of the top chassis assembly, remove

the two screws Fattaching the front chassis.

Fig.7

Fig.8

3.1.5 Removing the CD mechanism assembly

(See Fig.9)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the inside of the top chassis assembly, remove the

three screws Gattaching the CD mechanism assembly.

(2) Take out the CD mechanism assembly from the top

chassis.

Fig.9

Top chassis assembly

Front chassis

Top chassis assembly

Front chassis

Top chassis G

CD mechanism assembly

(No.MA050)1-9

3.1.6 Removing the main board

(See Figs.10 and 11)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the rear side of the bottom chassis assembly, remove

the two screws Hattaching the rear bracket to the bottom

chassis assembly. (See Fig.10.)

(2) From the top side of the bottom chassis assembly, remove

the two screws Jattaching the main board to the bottom

chassis assembly. (See Fig.11.)

(3) Release the stopper of the connector CN701 on the main

board in an upward direction, disconnect the card wire from

the connector CN701. (See Fig.11.)

(4) Disconnect the wire from the connector of the front door

mechanism assembly. (See Fig.11.)

(5) Disconnect the wire from the connector CN951 on the main

board. (See Fig.11.)

Reference:

After connecting the wires, fix the wire with the wire

holder.

(6) Take out the main board from the bottom chassis

assembly.

Fig.10

Fig.11

3.1.7 Removing the rear bracket

(See Fig.12)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink, top chassis assembly and main

board.

(1) Remove the screw Kand three screws Lattaching the rear

bracket to the main board.

Fig.12

Rear bracket

Bottom chassis assembly

Connector

Wire holder CN701

Stopper

Bottom chassis assembly

CN951 Wires

Main board

Card wire

Front door mechanism assembly

Rear bracket

1-10 (No.MA050)

3.1.8 Removing the front door mechanism assembly

(See Fig.13.)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink, top chassis assembly and main

board.

(1) From the top side of the bottom chassis assembly, remove

the screw Mattaching the FPC guide to the bottom

chassis.

(2) Remove the five screws Nattaching the front door

mechanism assembly to the bottom chassis.

Reference:

When attaching the screws Mand N, apply a locking

agent them.

(3) Take out the front door mechanism assembly from the bot-

tom chassis.

Fig.13

3.1.9 Removing the front board

(See Figs.14 to 16)

• Prior to performing the following procedures, remove the front

panel assembly.

(1) From the rear side of the front panel assembly, remove the

four screws Pattaching the rear cover assembly to the front

panel assembly. (See Fig.14.)

(2) Release the twelve joints aof the front panel assembly and

remove the rear cover assembly. (See Fig.15.)

(3) Take out the front board from the front panel assembly.

(See Fig.16.)

Note:

When removing the rear cover assembly and front board, be

careful not to lose the comp. spring. (See Fig.16.) Fig.14

Fig.15

Fig.16

Bottom chassis

FPC guide

Front door mechanism assembly

PRear cover assembly P

Rear cover assembly

joints a joints a

Front board

Front panel assembly

Comp. spring

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