JVC KD-SH1000J Bedienungsanleitung

SERVICE MANUAL

2006/3

CD RECEIVER

MA25520063

KD-SH1000J,KD-SH1000E,

KD-SH1000EX,KD-SH1000EY,

KD-SH1000EU,KD-SH1000U,

KD-SH1000UN,KD-SH1000UT,

KD-SH1000UH

Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)

TABLE OF CONTENTS

1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23

5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27

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1-2 (No.MA255)

SPECIFICATION

AUDIO AMPLIFIER SECTION

Power Output (for J) 20 W RMS ×4 Channels at 4 Ωand [< or =] 1% THD+N

Signal to Noise Ratio(for J) 80 dBA (reference: 1 W into 4 Ω)

Maximum Power Output Front/Rear 50 W per channel

Continuous Power Output (RMS) Front/Rear 19 W per channel into 4 Ω, 40 Hz to 20 000 Hz at no more than

0.8% total harmonic distortion

Load Impedance 4 Ω(4 Ωto 8 Ωallowance)

Equalizer Control Range Frequencies Graphic EQ 63 Hz, 125 Hz, 250 Hz, 500 Hz, 1 kHz, 2 kHz, 4 kHz, 8 kHz, 12.5

kHz (9 bands)

Parametric EQ 3 bands (Band 1/2/3): 20 Hz, 25 Hz, 31.5 Hz, 40 Hz, 50 Hz, 63 Hz,

80 Hz, 100 Hz, 125 Hz, 160 Hz, 200 Hz, 250 Hz, 315 Hz, 400 Hz,

500 Hz, 630 Hz, 800 Hz, 1 kHz, 1.2 kHz, 1.6 kHz, 2 kHz, 2.5 kHz,

3.2 kHz, 4 kHz, 5 kHz, 6.3 kHz, 8 kHz, 10 kHz, 12.5 kHz, 16 kHz,

20 kHz (31 frequencies)

Level ±10 dB

Frequency Response 40 Hz to 20 000 Hz

Level/Impedance Line-In 1.5 V/20 kΩload (full scale)

Line-Out 5.0 V/20 kΩload (full scale)

Output Impedance 1 kΩ

Subwoofer-Out Level/Impedance 2.0 V/20 kΩload (full scale)

Other Terminals LINE IN, CD changer

TUNER SECTION

Frequency Range FM (for J) 87.5 MHz to 107.9 MHz (with channel interval set to 200 kHz)

87.5 MHz to 108.0 MHz (with channel interval set to 50 kHz)

FM 87.5 MHz to 108.0 MHz

AM (for J) 530 kHz to 1 710 kHz (with channel interval set to 10 kHz)

531 kHz to 1 602 kHz (with channel interval set to 9 kHz)

AM (for asia) 531 kHz to 1 602 kHz

AM (for europe) (MW) 522 kHz to 1 620 kHz

(LW) 144 kHz to 279 kHz

FM Tuner Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)

50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)

Alternate Channel Selectivity (400 kHz) 65 dB

Frequency Response 40 Hz to 15 000 Hz

Stereo Separation 30 dB

AM Tuner Sensitivity/Selectivity 20 µV/65 dB

MW Tuner (for europe) Sensitivity/Selectivity 20 µV/65 dB

LW Tuner (for europe) Sensitivity 50 µV

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Design and specifications are subject to change without notice.

CD PLAYER SECTION

Type Compact disc player

Signal Detection System Non-contact optical pickup (semiconductor laser)

Number of Channels 2 channels (stereo)

Frequency Response 5 Hz to 20 000 Hz

Dynamic Range 98 dB

Signal-to-Noise Ratio 102 dB

Wow and Flutter Less than measurable limit

MP3 Bit Rate 32 kbps - 320 kbps

Sampling Frequency MPEG-1: 48 kHz, 44.1 kHz, 33 kHz

MPEG-2: 24 kHz, 22.05 kHz, 16 kHz

WMA Bit Rate 8 kbps - 320 kbps

Sampling Frequency 48 kHz, 44.1 kHz, 32 kHz

SD CARD

Format FAT 12/16

Storage 8 MB - 512 MB

Playable Audio Format MP3/WMA

MP3 Bit Rate 8 kbps - 320 kbps

Sampling Frequency MPEG-1: 48 kHz, 44.1 kHz, 33 kHz

WMA Bit Rate MPEG-2: 24 kHz, 22.05 kHz, 16 kHz

Sampling Frequency 8 kbps - 192 kbps

48 kHz, 44.1 kHz, 32 kHz

USB MEMORY

Format FAT 12/16/32

Storage Less than 4 GB (1 partition type)

Playable Audio Format MP3/WMA

Max. Current Less than 500 mA

MP3 Bit Rate 32 kbps - 320 kbps

Sampling Frequency MPEG-1: 48 kHz, 44.1 kHz, 32 kHz

MPEG-2: 24 kHz, 22.05 kHz, 16 kHz

MPEG-2.5: 12 kHz, 11.025 kHz, 8 kHz

WMA Bit Rate 5 kbps - 320 kbps

Sampling Frequency 8 kHz - 48 kHz

GENERAL

Power Requirement DC 14.4 V (11 V to 16 V allowance)

Grounding System Negative ground

Allowable Operating Temperature 0°C to +40°C (32°F to 104°F)

Dimensions (W ×H ×D) Installation Size (approx.) 182 mm ×52 mm ×162 mm (7-3/16" ×2-1/16" ×6-7/16")

Panel Size (approx.) 188 mm ×58 mm ×11 mm (7-7/16" ×2-5/16" ×7/16")

Mass (approx.) 1.7 kg (3.8 lbs) (excluding accessories)

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SECTION 1

PRECAUTIONS

1.1 Safety Precautions

!Burrs formed during molding may be left over on some parts of the chassis. Therefore,

pay attention to such burrs in the case of preforming repair of this system.

!Please use enough caution not to see the beam directly or touch it in case of an

adjustment or operation check.

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1.2 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser

diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.

1.2.1 Grounding to prevent damage by static electricity

Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as laser products.

Be careful to use proper grounding in the area where repairs are being performed.

(1) Ground the workbench

Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the

traverse unit (optical pickup) on it.

(2) Ground yourself

Use an anti-static wrist strap to release any static electricity built up in your body.

(3) Handling the optical pickup

• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical

pickup are shorted. After replacement, return the shorted parts to their original condition.

(Refer to the text.)

• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily

destroy the laser diode.

1.3 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.

(2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the

replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a

time when attaching it to the connector.

(3) Handle the flexible cable carefully as it may break when subjected to strong force.

(4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.4 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the pickup unit.

• Apply solder to the short land before the flexible wire is disconnected from the connector on the pickup unit.

(If the flexible wire is disconnected without applying solder, the pickup may be destroyed by static electricity.)

• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.

(caption)

Anti-static wrist strap

Conductive material

(conductive sheet) or iron plate

CN601

Short sections Flexible wire

Mechanism control board

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1.5 Important for laser products

1.CLASS 1 LASER PRODUCT

2.DANGER : Invisible laser radiation when open and inter

lock failed or defeated. Avoid direct exposure to beam.

3.CAUTION : There are no serviceable parts inside the

Laser Unit. Do not disassemble the Laser Unit. Replace

the complete Laser Unit if it malfunctions.

4.CAUTION : The CD,MD and DVD player uses invisible

laser radiation and is equipped with safety switches which

prevent emission of radiation when the drawer is open and

the safety interlocks have failed or are defeated. It is

dangerous to defeat the safety switches.

5.CAUTION : If safety switches malfunction, the laser is able

to function.

6.CAUTION : Use of controls, adjustments or performance of

procedures other than those specified here in may result in

hazardous radiation exposure.

REPRODUCTION AND POSITION OF LABELS

Please use enough caution not to

see the beam directly or touch it

in case of an adjustment or operation

check.

WARNING LABEL

CAUTION : Visible and Invisible

laser radiation when open and

interlock failed or defeated.

AVOID DIRECT EXPOSURE TO

BEAM. (e)

VARNING : Synlig och

osynling laserstrålning när

den öppnas och spärren är

urkopplad. Betrakta ej

strålen. (s)

VARO : Avattaessa ja suojalukitus

ohitettuna tai viallisena olet alttiina

näkyvälle ja näkymättömälle

lasersäteilylle. Vältä säteen

kohdistumista suoraan itseesi. (f)

ADVARSEL : Synlig og usynlig

laserstråling når maskinen er

åben eller interlocken fejeler.

Undgå direkte eksponering til

stråling. (d)

CLASS 1

LASER PRODUCT

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SECTION 2

SPECIFIC SERVICE INSTRUCTIONS

This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.

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1-8 (No.MA255)

SECTION 3

DISASSEMBLY

3.1 Main body section

3.1.1 Removing the front panel assembly

(See Fig.1)

(1) Push the detach button in the lower right part of the front

panel assembly.

(2) Remove the front panel assembly.

Fig.1

3.1.2 Removing the heat sink

(See Fig.2)

Reference:

Remove the front panel assembly as required.

(1) From the left side of the main body, remove the two screws

Aand two screws Battaching the heat sink.

(2) Remove the heat sink from the main body.

Fig.2

Detach button

Front panel assembly

Heat sink

AAB

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3.1.3 Removing the top chassis assembly

(See Fig.3 to 6)

• Prior to performing the following procedures, remove the heat

sink.

Reference:

Remove the front panel assembly as required.

(1) From the bottom side of the main body, remove the two

screws Cattaching the top chassis assembly to the bottom

chassis assembly. (See Fig.3)

(2) Remove the two screws Eattaching the IC heat sink from

left side of the main body. (See Fig.5)

(3) From the both and rear sides of the main body, remove the

four screws Dattaching the top chassis assembly to the

bottom chassis assembly. (See Fig.4 to 6)

(4) Lift the top chassis assembly in the direction of the arrow,

disconnect the connector CN503 on the mechanism con-

trol board from the connector CN721 on the main board.

(See Fig.4 to 6)

(5) Take out the top chassis assembly from the bottom chassis

assembly.

Fig.3

Fig.4

Fig.5

Fig.6

Top chassis assembly

Bottom chassis assembly

Top chassis assembly

CN503

CN721

Main board

Mechanism control board

Bottom chassis assembly

Main board

IC heat sink

Top chassis assembly

Mechanism control board

Top chassis assembly

Bottom chassis assembly Rear bracket

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3.1.4 Removing the front chassis assembly

(See Fig 7, 8)

• Prior performing the following procedure, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the both sides of the top chassis assembly, remove

the two screws Fattaching the front chassis assembly.

(2) Remove the front chassis assembly from the top chassis

assembly.

Fig.7

Fig.8

3.1.5 Removing the CD mechanism assembly

(See Fig.9)

• Prior performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

Reference:

Remove the front chassis assembly as required.

(1) From the inside of the top chassis assembly, remove the

three screws Gattaching the CD mechanism assembly.

(2) Release the mecha heat sink from the slots aon the mech-

anism control board and remove the mecha heat sink from

the main body.

(3) Take out the CD mechanism assembly from the top chas-

sis.

Fig.9

Top chassis assembly

Front chassis assembly

Top chassis assembly

Front chassis assembly

Top chassis

Mecha heat sink

G G

CD mechanism assembly

Mechanism control board

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