A3M39SL039 Airfast Power Amplifier Module with Autobias Control, Rev. 0, March 2022
Data Sheet: Technical Data 2/ 33
Contents
1Pinout configuration and function ..................3
1.1 Pin connections...............................................3
1.2 Functional pin description................................4
2Electrical characteristics..................................4
2.1 Ratings ............................................................4
2.1.1 Maximum ratings.............................................4
2.1.2 Lifetime............................................................5
2.1.3 ESD protection characteristics ........................5
2.1.4 Moisture sensitivity level..................................5
2.2 Operating characteristics.................................5
2.2.1 Nominal DAC settings .....................................5
2.2.2 Functional tests ...............................................6
2.2.3 Wideband ruggedness ....................................6
2.2.4 Typical performance........................................6
3Register map and OTP memory.......................7
3.1 One-time programmable memory....................7
3.2 Register map...................................................7
4Power supply sequence .................................10
5Autobias functionality ....................................11
5.1 General overview ..........................................11
5.2 Operational overview.....................................11
5.3 Tx enable control...........................................12
5.4 Sense_DAC ..................................................12
5.5 VGS_DAC .....................................................13
5.6 Engineering Mode (EM) ................................13
6Ordering information ......................................13
7Component layout and parts list ................... 14
7.1 Component layout......................................... 14
7.2 Component designations and values ............ 15
8Temperature sensor .......................................15
9Communication interfaces............................. 16
9.1 SPI ................................................................ 16
9.1.1 SPI timing diagram........................................ 16
9.1.2 SPI instruction set definition.......................... 16
9.2 I2C ................................................................. 17
9.2.1 I2C addressing............................................... 17
9.2.2 I2C instruction set .......................................... 18
9.2.3 I2C Device ID Read instruction...................... 19
9.3 I2C electrical specification and timing for I/O
stages and bus lines ..................................... 20
9.3.1 I2C SCLK and SDA characteristics................ 21
9.3.2 I2C bus electrical characteristics ................... 22
10 Design considerations ................................... 22
10.1 Power on sequence ...................................... 22
10.2 Programming guidelines to avoid hardware
failure or damage .......................................... 23
10.3 Group programming ...................................... 23
11 Product marking .............................................25
12 Package information.......................................26
13 Product software and tools............................32
14 Failure analysis...............................................32
15 Revision history..............................................32
