Panasonic DMR-EH50EB Bedienungsanleitung

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DMR-EH50EB

DMR-EH50EG

DMR-EH50EP

DMR-EH52EG

Vol.1

Colour

(K).......................Black Type

(S).......................Silver Type

DVD Video Recorder

ORDER NO.DSD0503040C2

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

1 Safety precautions 5

1.1. General guidelines 5

2 Prevention of Electrostatic Discharge (ESD) to Electrostatic

Sensitive (ES) Devices 6

3 Precaution of Laser Diode 7

4 Handling the Lead-free Solder 7

4.1. About lead free solder (PbF) 7

5 Each Button 8

6 New Feature 10

6.1. Quick start function(REC) 10

7 Taking out the Disc from RAM-Drive Unit when the Disc

cannot be ejected by OPEN/CLOSE button 11

7.1. Forcible Disc Eject 11

7.2. When the Forcible Disc Eject can not be done. 11

8 Service Explorer 12

9 Self-Diagnosis and Special Mode Setting 15

9.1. Self-Diagnosis Functions 15

9.2. Special Modes Setting 16

9.3. Service Modes 19

10 Assembling and Disassembling 24

10.1. Disassembly Flow Chart 24

10.2. P.C.B. Positions 24

10.3. Top Case 25

10.4. Front Panel 25

10.5. SD Card P.C.B. 25

10.6. Digital P.C.B. 25

10.7. DVD-RAM Drive 26

10.8. HDD 26

10.9. LED P.C.B. 27

10.10. Power P.C.B. 28

10.11. Rear Panel 28

10.12. Front (L) P.C.B. 29

10.13. Main P.C.B. 29

10.14. Tuner P.C.B. and Nicam Decoder P.C.B. 30

11 Service Fixture and Tools 31

12 Service Positions 31

12.1. Checking and Repairing of Power P.C.B. 31

12.2. Checking and Repairing of Digital P.C.B. 32

12.3. Checking and Repairing of Main P.C.B. 33

12.4. Checking and Repairing of DVD-RAM Drive 34

12.5. Checking and Repairing of HDD 35

13 Caution after replacing parts 36

13.1. After replacing the RAM Drive with new one 36

13.2. When the unit does not operate normally after replacing

the Timer Microprocessor or Main P.C.B. 36

14 Standard Inspection Specifications after Making Repairs 36

15 Voltage and Waveform Chart 37

15.1. Power P.C.B. 37

15.2. Main P.C.B. 37

15.3. Tuner P.C.B. 39

15.4. LED P.C.B. 39

15.5. P9001 Connector 40

15.6. Waveform Chart 41

16 Abbreviations 42

17 Block Diagram 45

17.1. Power Supply Block Diagram 45

17.2. Analog Video Block Diagram 47

17.3. Analog Audio Block Diagram 48

17.4. Timer Block Diagram 49

18 Schematic Diagram 51

18.1. Interconnection Schematic Diagram 51

18.2. Power Supply Schematic Diagram 52

18.3. Main Net Section (Main P.C.B. (1/3)) Schematic Diagram

(M) 54

18.4. A/V I/O Section (Main P.C.B. (2/3)) Schematic Diagram

(AI) 56

18.5. Timer Section (Main P.C.B. (3/3)) Schematic Diagram (T)

18.6. Tuner Pack Schematic Diagram 60

18.7. Nicam Decoder Schematic Diagram 61

18.8. SD Card Schematic Diagram 62

18.9. LED Schematic Diagram 63

19 Print Circuit Board 65

19.1. Power P.C.B. 65

19.2. Main P.C.B. 66

19.3. Tuner P.C.B., LED P.C.B., Front (L) P.C.B. 71

19.4. Nicam Decoder P.C.B. 72

19.5. SD Card P.C.B. 73

20 Exploded Views 75

20.1. Casing Parts & Mechanism Section 75

20.2. Packing & Accessories Section 76

21 Replacement Parts List 77

CONTENTS

Page Page

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

1.1.1. Leakage current cold check

1. Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screwheads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1MΩand 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be .

Figure 1

1.1.2. Leakage current hot check

(See Figure 1 .)

1. Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the

voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6. The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

1 Safety precautions

1.1. General guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

2 Prevention of Electrostatic Discharge (ESD) to

Electrostatic Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable

conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage

an ES device).

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

3 Precaution of Laser Diode

4 Handling the Lead-free Solder

4.1. About lead free solder (PbF)

Distinction of PbF P.C.B.:

P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.

Caution:

·Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher.

Please use a high temperature soldering iron. In case of the soldering iron with temperature control, please set it to 700 ±

20°F (370 ± 10°C).

·Pb free solder will tend to splash when heated too high (about 1100°F/600°C).

·When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat

the soldering points with the Pb free solder until it melts enough.

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

5 Each Button

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

6 New Feature

6.1. Quick start function(REC)

1. General

A few seconds after tuning on the unit,you can start recording to DVD-RAM,HDD.

You can switch the operation of this function (ON/OFF) on the menu screen. .

2. Quick start(REC) principle

In the power-off at Quick start, only power supplies for video IC,tuner and storage media are cut off.

When the REC button is pushed a few second after the power button is pushed, Audio and Video data are stored in

DDR SDRAM before a storage media(DVD-RAM or HDD) preparation.

*Preparation time →DVD-RAM: Fabout 8seconds

HDD: about 18seconds

After a storage media(DVD-RAM or HDD) preparation,Audio and Video data are transfer from DDR SDRAM to the

storage media.

DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG

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