Panasonic DMR-EH50EB Bedienungsanleitung
©2005 Matsushita Electric Industrial CO., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
DMR-EH50EB
DMR-EH50EG
DMR-EH50EP
DMR-EH52EG
Vol.1
Colour
(K).......................Black Type
(S).......................Silver Type
DVD Video Recorder
ORDER NO.DSD0503040C2
2
DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
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DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
1 Safety precautions 5
1.1. General guidelines 5
2 Prevention of Electrostatic Discharge (ESD) to Electrostatic
Sensitive (ES) Devices 6
3 Precaution of Laser Diode 7
4 Handling the Lead-free Solder 7
4.1. About lead free solder (PbF) 7
5 Each Button 8
6 New Feature 10
6.1. Quick start function(REC) 10
7 Taking out the Disc from RAM-Drive Unit when the Disc
cannot be ejected by OPEN/CLOSE button 11
7.1. Forcible Disc Eject 11
7.2. When the Forcible Disc Eject can not be done. 11
8 Service Explorer 12
9 Self-Diagnosis and Special Mode Setting 15
9.1. Self-Diagnosis Functions 15
9.2. Special Modes Setting 16
9.3. Service Modes 19
10 Assembling and Disassembling 24
10.1. Disassembly Flow Chart 24
10.2. P.C.B. Positions 24
10.3. Top Case 25
10.4. Front Panel 25
10.5. SD Card P.C.B. 25
10.6. Digital P.C.B. 25
10.7. DVD-RAM Drive 26
10.8. HDD 26
10.9. LED P.C.B. 27
10.10. Power P.C.B. 28
10.11. Rear Panel 28
10.12. Front (L) P.C.B. 29
10.13. Main P.C.B. 29
10.14. Tuner P.C.B. and Nicam Decoder P.C.B. 30
11 Service Fixture and Tools 31
12 Service Positions 31
12.1. Checking and Repairing of Power P.C.B. 31
12.2. Checking and Repairing of Digital P.C.B. 32
12.3. Checking and Repairing of Main P.C.B. 33
12.4. Checking and Repairing of DVD-RAM Drive 34
12.5. Checking and Repairing of HDD 35
13 Caution after replacing parts 36
13.1. After replacing the RAM Drive with new one 36
13.2. When the unit does not operate normally after replacing
the Timer Microprocessor or Main P.C.B. 36
14 Standard Inspection Specifications after Making Repairs 36
15 Voltage and Waveform Chart 37
15.1. Power P.C.B. 37
15.2. Main P.C.B. 37
15.3. Tuner P.C.B. 39
15.4. LED P.C.B. 39
15.5. P9001 Connector 40
15.6. Waveform Chart 41
16 Abbreviations 42
17 Block Diagram 45
17.1. Power Supply Block Diagram 45
17.2. Analog Video Block Diagram 47
17.3. Analog Audio Block Diagram 48
17.4. Timer Block Diagram 49
18 Schematic Diagram 51
18.1. Interconnection Schematic Diagram 51
18.2. Power Supply Schematic Diagram 52
18.3. Main Net Section (Main P.C.B. (1/3)) Schematic Diagram
(M) 54
18.4. A/V I/O Section (Main P.C.B. (2/3)) Schematic Diagram
(AI) 56
18.5. Timer Section (Main P.C.B. (3/3)) Schematic Diagram (T)
58
18.6. Tuner Pack Schematic Diagram 60
18.7. Nicam Decoder Schematic Diagram 61
18.8. SD Card Schematic Diagram 62
18.9. LED Schematic Diagram 63
19 Print Circuit Board 65
19.1. Power P.C.B. 65
19.2. Main P.C.B. 66
19.3. Tuner P.C.B., LED P.C.B., Front (L) P.C.B. 71
19.4. Nicam Decoder P.C.B. 72
19.5. SD Card P.C.B. 73
20 Exploded Views 75
20.1. Casing Parts & Mechanism Section 75
20.2. Packing & Accessories Section 76
21 Replacement Parts List 77
CONTENTS
Page Page
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DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
1.1.1. Leakage current cold check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
1.1.2. Leakage current hot check
(See Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
1 Safety precautions
1.1. General guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
2 Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage
an ES device).
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DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
3 Precaution of Laser Diode
4 Handling the Lead-free Solder
4.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
·Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher.
Please use a high temperature soldering iron. In case of the soldering iron with temperature control, please set it to 700 ±
20°F (370 ± 10°C).
·Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
·When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat
the soldering points with the Pb free solder until it melts enough.
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DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
5 Each Button
8
DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
9
DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
6 New Feature
6.1. Quick start function(REC)
1. General
A few seconds after tuning on the unit,you can start recording to DVD-RAM,HDD.
You can switch the operation of this function (ON/OFF) on the menu screen. .
2. Quick start(REC) principle
In the power-off at Quick start, only power supplies for video IC,tuner and storage media are cut off.
When the REC button is pushed a few second after the power button is pushed, Audio and Video data are stored in
DDR SDRAM before a storage media(DVD-RAM or HDD) preparation.
*Preparation time →DVD-RAM: Fabout 8seconds
HDD: about 18seconds
After a storage media(DVD-RAM or HDD) preparation,Audio and Video data are transfer from DDR SDRAM to the
storage media.
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DMR-EH50EB / DMR-EH50EG / DMR-EH50EP / DMR-EH52EG
Andere Handbücher für DMR-EH50EB
1
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