Panasonic DMR-ES25P Bedienungsanleitung

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DMR-ES25P

DMR-ES25PC

Vol. 1

Colour

(S).......................Silver Type

DVD Recorder

ORDER NO.CHM0604022CE

B24

1 Safety Precaution 3

1.1. General guidelines 3

1.2. Caution for fuse replacement 3

2 Warning 4

2.1. Prevention of Electrostatic Discharge (ESD) to

Electrostatic Sensitive (ES) Devices 4

2.2. Precaution of Laser Diode 5

2.3. Service caution based on legal restrictions 6

3 Service Navigation 7

3.1. Service Information 7

4 Specifications 8

5 Feature 10

5.1. HDAVI Control (HDMI Link) 10

6 Location of Controls and Components 12

7 Operation Instructions 13

7.1. Taking out the Disc from DVD-Drive Unit when the Disc

cannot be ejected by OPEN/CLOSE button 13

8 Service Mode 14

8.1. Self-Diagnosis and Special Mode Setting 14

9 Service Fixture & Tools 22

10 Disassembly and Assembly Instructions 23

10.1. Disassembly Flow Chart 23

10.2. P.C.B. Positions 23

10.3. Top Case 24

10.4. Front Panel 24

10.5. SD Card P.C.B. 24

10.6. RAM/Digital P.C.B. Module 24

10.7. DV Jack P.C.B. 26

10.8. Front (L) P.C.B. 26

10.9. Rear Panel 26

10.10. Main P.C.B. 26

10.11. HDMI P.C.B. 27

11 Measurements and Adjustments 28

11.1. Service Positions 28

11.2. Notice after replacing RAM/Digital P.C.B. Module 30

11.3. When the unit does not operate normally after replacing

the Timer Microprocessor or Main P.C.B. 30

11.4. Standard Inspection Specifications after Making Repairs

12 Block Diagram 31

12.1. Power Supply Block Diagram 31

12.2. Analog Video Block Diagram 33

12.3. Analog Audio Block Diagram 34

12.4. Analog Timer Block Diagram 35

12.5. HDMI Block Diagram 36

13 Schematic Diagram 37

13.1. Interconnection Schematic Diagram 37

13.2. Power Supply Section (Main P.C.B.(1/3)) Schematic

Diagram (P) 38

13.3. A/V I/O (1/4) Section (Main P.C.B.(2/3)) Schematic

Diagram (A) 40

13.4. A/V I/O (2/4) Section (Main P.C.B.(2/3)) Schematic

Diagram (A) 41

13.5. A/V I/O (3/4) Section (Main P.C.B.(2/3)) Schematic

Diagram (A) 42

13.6. A/V I/O (4/4) Section (Main P.C.B.(2/3)) Schematic

Diagram (A) 43

13.7. Timer (1/4) Section (Main P.C.B.(3/3)) Schematic Diagram

Schematic Diagram (FL) 45

13.8. Timer (2/4) Section (Main P.C.B.(3/3)) Schematic Diagram

Schematic Diagram (FL) 46

13.9. Timer (3/4) Section (Main P.C.B.(3/3)) Schematic Diagram

Schematic Diagram (FL) 47

13.10. Timer (4/4) Section (Main P.C.B.(3/3)) Schematic Diagram

Schematic Diagram (FL) 48

13.11. HDMI Schematic Diagram 50

13.12. SD Card Schematic Diagram 52

13.13. DV Jack Schematic Diagram 53

13.14. Front (L) Schematic Diagram 53

14 Print Circuit Board 55

14.1. Main P.C.B. 55

14.2. HDMI P.C.B. 60

14.3. SD Card P.C.B., Front (L) P.C.B. 61

14.4. DV Jack P.C.B. 62

15 Appendix for Schematic Diagram 63

15.1. Voltage and Waveform Chart 63

16 Miscellaneous 68

16.1. Abbreviations 68

17 Parts and Exploded Views 70

17.1. Exploded Views 70

17.2. Replacement Parts List 72

CONTENTS

Page Page

DMR-ES25P / DMR-ES25PC

1.1.1. Leakage current cold check

1.Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2.Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screwheads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1MWand 5.2MW.

When the exposed metal does not have a return path to the

chassis, the reading must be .

Figure 1

1.1.2. Leakage current hot check

(See Figure 1 .)

1.Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3.Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4.Check each exposed metallic part, and measure the

voltage at each point.

5.Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6.The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

1 Safety Precaution

1.1. General guidelines

1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Caution for fuse replacement

DMR-ES25P / DMR-ES25PC

2 Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatic Sensitive

(ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electrostatic discharge (ESD).

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable

conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage

an ES device).

DMR-ES25P / DMR-ES25PC

2.2. Precaution of Laser Diode

DMR-ES25P / DMR-ES25PC

2.3. Service caution based on legal restrictions

2.3.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

Service caution for repair work using Lead Free Solder (PbF)

· ·

· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

· ·

· To put lead free solder, it should be well molten and mixed with the original lead free solder.

· ·

· Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

· ·

· Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt

the lead free solder.

· ·

· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30

degrees C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

· ·

· The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

DMR-ES25P / DMR-ES25PC

3 Service Navigation

3.1. Service Information

DMR-ES25P / DMR-ES25PC

4 Specifications

DMR-ES25P / DMR-ES25PC

5.1. HDAVI Control (HDMI Link)

Linked operations by HDAVI Control (HDMI Link)

5.1.1. What is HDMI

HDMI is abbreviation of [High-Definition Multimedia Interface],

and is digital interface standard for next generation TV

corresponding to follows.

1.Non-compressing high quality digital image

2.Digital transmission of multi channel digital audio.

3. Two way communication of control signal of control

straightening between equipments

Pin Name

Pin layout of plug of HDMI cable seen from outside.

5.1.2. Link functions with Equipments

Corresponding Table

Functions

(1) Automatic Input switch

(2) Link of Power

In case setting of [FUNCTIONS] ®[Setup] ®[TV Screen] ®

[Functions of HDMI] ®[Control with HDMI] are on, all above

equipments Link functions are effective.

5.1.3. Outline of Equipments Linked

functions

(1) Automatic Input switch

At starting of playback/ GUI display by DIGA, it turns on

power of VIErA, and it displays picture of DIGA onto screen

of VIErA.

Starting of playback:

It includes automatic playback of DVD-Video and so on.

And it includes picture of screen saver too.

GUI display:

FUNCTIONS, DIRECT NAVIGATOR, TV PROGRAM,

PROG/CHECK, Timer Recording, G-code, Initial setting,

Playback setting, Play list, SD/DVD guide, Warning

messages that user can select and so on.

5 Feature

DMR-ES25P / DMR-ES25PC

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