RF-Star SimpleLink RF-BM-2652P4 CC2652P7 Bedienungsanleitung

RF-BM-2652P4(I)

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Shenzhen RF-star Technology Co., Ltd. Page 1 of 23

RF-BM-2652P4 and RF-BM-2652P4I CC2652P7

SimpleLink™ Multiprotocol 2.4 GHz Wireless Module

with Integrated Power Amplifier

Version 1.0

Shenzhen RF-star Technology Co., Ltd.

May 25th, 2023

RF-BM-2652P4(I)

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1 Device Overview

1.1 Description

RF-BM-2652P4(I) is an RF module based on TI lower-power CC2652P7 SoC, which is a multiprotocol 2.4 GHz wireless

module supporting Matter, Thread, Zigbee®, Bluetooth®5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects

(6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a

Dynamic Multiprotocol Manager (DMM) driver. It integrates a 48 MHz crystal and a 32.768 kHz crystal, 704 KB of

in-system Programmable Flash, 256 KB ROM, 8 KB of Cache SRAM, and 144 KB of ultra-low leakage SRAM. Its ARM®

Cortex®-M4F core application processor can operate at an extremely low current at flexible power modes. And the

module enables long-range and low-power applications using an integrated +20 dBm high-power amplifier with

best-in-class transmit current consumption at 101 mA. It features a small size, robust connection distance, and rigid

reliability. Optional antenna output modes (PCB, IPEX connector, and half-hole interface) make the module more

convenient for application and development.

1.2 Key Features

•RF Features

- Bluetooth® 5.3 Low Energy

- Matter, ZigBee®, Thread

- Proprietary systems

- IEEE 802.15.4

- IPv6-enabled smart objects (6LoWPAN)

- SimpleLinkTM TI 15.4-Stack (2.4 GHz)

- Dynamic Multiprotocol Manager (DDM) driver

•TX power: up to +20 dBm with temperature

compensation

•Excellent receiver sensitivity

- -99 dBm for 802.15.4 (2.4 GHz)

- -104 dBm for Bluetooth 125 kbps (LE coded PHY)

•Wide Operation Range

- 1.8 V to 3.8 V single power supply

- Operating temperature: -40 °C to +85 °C

- Storage temperature: -40 °C to +125 °C

•Microcontroller

- Powerful 48 MHz ARM®Cortex®-M4F processor

- EEBMC CoreMark®score: 148

- 2-pin cJTAG and JTAG debugging

- Support OTA upgrade

•Memory

- 704 KB of in-system programmable flash

- 256 KB of ROM for protocols and library

functions

- 8 KB of cache SRAM (Alternatively available as

general-purpose RAM)

- 144 KB of ultra-low leakage SRAM. The SRAM

is protected by parity to ensure high reliability of

operation.

•Ultra-low power sensor controller with 4 KB of

SRAM

- Sample, store, and process sensor data

- Operation independent from system CPU

- Fast wake-up for low-power operation

•Rich Peripherals

- Digital peripheral pins can be routed to 23

GPIOs

- 4 ×32-bit or 8 × 16-bit general-purpose timers

- 12-bit ADC, 200 ksamples/s, 8 channels

- 2 ×comparators

- Programmable current source

- 2 ×UART

RF-BM-2652P4(I)

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- 2 ×SSI (SPI, Microwave, TI)

- I2C

- I2S

- Real-time clock (RTC)

- Integrated temperature and battery monitor

•Security Enablers

- AES 128-bit and 256- bit Crypto accelerator

- ECC and RSA public key hardware accelerator

- SHA2 accelerator (full suite up to SHA-512)

- True random number generator (TRNG)

•External system

- On-chip buck DC/DC converter

•Dimension: 30.0 mm × 16.4 mm × 2.2 mm

1.3 Applications

•2400 to 2480 MH ISM and SRD systems with

down to 4 kHz of receive bandwidth

•Home and building automation

•Building security system

•HVAC system

•Gateway

•IP network camera

•Fire safety system

•Smart grid

•Automatic meter reading

•Industrial transport

•Wireless sensor networks

•Factory automation and control

•Wireless healthcare applications

•Energy harvesting applications

•Asset tracking and management

•Electronic Shelf Label (ESL)

•Wired networking

•Small business router

•Portable electronics

•Set-top box

•Connected peripherals

•Keyboard and keypads

•Home theater & entertainment

•Electronic and robotic toys

•Wearables

RF-BM-2652P4(I)

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1.4 Functional Block Diagram

Figure 1. Functional Block Diagram of RF-BM-2652P4(I)

1.5 Part Number Conventions

The part numbers are of the form of RF-BM-2652P4(I) where the fields are defined as follows:

Figure 2. Part Number Conventions of RF-BM-2652P4(I)

2652P

Company Name

RF-STAR

Wireless Type

Bluetooth Module

Chipset

CC2652P7

Module Version Number

The Fourth PA Version

Antenna Type

IPEX Connector

CC2652P7

GPIOs

Jtag

EMI Filter

48.0 MHz

32.768 kHz

Reset

2.4 GHz

Balun

2.4 GHz

PA Balun

000

Power Supply

1.8 V ~ 3.8 V

Control (GPIO)

Antenna

Matching

Switch

PCB Antenna

IPEX Connector

Half Hole Interface

 RF-BM-2652P4(I) 
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Table of Contents 
Device Overview............................................................................................................................................................. 2 
1 Description............................................................................................................................................................ 2 
2 Key Features ....................................................................................................................................................... 2 
3 Applications.......................................................................................................................................................... 3 
4 Functional Block Diagram .............................................................................................................................. 4 
5 Part Number Conventions.............................................................................................................................. 4 
Table of Contents................................................................................................................................................................ 5 
Module Configuration and Functions ...................................................................................................................... 7 
1 Module Parameters........................................................................................................................................... 7 
2 Module Pin Diagram ......................................................................................................................................... 8 
3 Pin Functions....................................................................................................................................................... 8 
Specifications .................................................................................................................................................................10 
1 Recommended Operating Conditions .....................................................................................................10 
2 Handling Ratings..............................................................................................................................................10 
3 PA Output Control............................................................................................................................................10 
Application, Implementation, and Layout.............................................................................................................11 
1 Module Photos..................................................................................................................................................11 
2 Recommended PCB Footprint....................................................................................................................11 
3 Schematic Diagram.........................................................................................................................................12 
4 Reference Design............................................................................................................................................13 
5 Antenna................................................................................................................................................................13 
5.1 Antenna Design Recommendation ..............................................................................................13 
5.2 Antenna Output Mode Modification..............................................................................................14 
5.3 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................15 
5.4 IPEX Connector Specification........................................................................................................16 
6 Basic Operation of Hardware Design ......................................................................................................16 
7 Trouble Shooting..............................................................................................................................................17 
7.1 Unsatisfactory Transmission Distance........................................................................................17 
7.2 Vulnerable Module..............................................................................................................................18 
7.3 High Bit Error Rate .............................................................................................................................18 
8 Electrostatics Discharge Warnings ...........................................................................................................18 

RF-BM-2652P4(I)

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4.9 Soldering and Reflow Condition.................................................................................................................18

5 Optional Package Specification ..............................................................................................................................20

6 Revision History ............................................................................................................................................................22

7 Contact Us.......................................................................................................................................................................23

RF-BM-2652P4(I)

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2 Module Configuration and Functions

2.1 Module Parameters

Table 1. Parameters of RF-BM-2652P4(I)

Chipset

CC2652P7

Supply Power Voltage

1.8 V ~ 3.8 V, 3.3 V is recommended

Frequency

2402 MHz ～2480 MHz

Maximum Transmit Power

+20.0 dBm

Receiving Sensitivity

-99 dBm @ 802.15.4 (2.4 GHz)

-104 dBm @ Bluetooth 125 kbps (LE Coded PHY)

GPIO

Flash

704 KB

ROM

256 KB

SRAM

152 KB

Power Consumption

RX current: 6.4 mA

TX current: 7.3 mA @ 0 dBm

9.7 mA @ 5 dBm

21 mA @ 10 dBm

101 mA @ 20 dBm

MCU 48 MHz (CoreMark): 3.1 mA (65 μA/MHz)

Sensor Controller: 29.2 μA @ Low Power-Mode, 2 MHz

799 μA @ Active-Mode, 24 MHz

Standby: 0.9 µA

Shutdown: 0.1 µA

Support Protocol

Bluetooth 5.3 Low Energy, Matter, ZigBee, Thread, IEEE 802.15.4, 6LoWPAN,

SimpleLinkTM TI 15.4-stack, Proprietary systems

Crystal

48 MHz, 32.768 kHz

Package

SMT packaging (1.27-mm half-hole pitch stamp stick)

Dimension

30.0 mm × 16.4 mm × 2.2 mm

Type of Antenna

RF-BM-2652P4: PCB antenna

RF-BM-2652P4I: IPEX connector, ANT pin

Operating Temperature

-40 ℃～+85 ℃

Storage Temperature

-40 ℃～+125 ℃

RF-BM-2652P4(I)

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2.2 Module Pin Diagram

Figure 3. Pin Diagram of RF-BM-2652P4(I)

2.3 Pin Functions

Table 2. Pin Diagram of RF-BM-2652P4(I)

Name

Chip Pin

Function

Description

DIO5

DIO_5

Digital

GPIO, high-drive capability

DIO6

DIO_6

Digital

GPIO, high-drive capability

DIO7

DIO_7

Digital

GPIO, high-drive capability

DIO8

DIO_8

Digital

GPIO

DIO9

DIO_9

Digital

GPIO

DIO10

DIO_10

Digital

GPIO

DIO11

DIO_11

Digital

GPIO

DIO12

DIO_12

Digital

GPIO

DIO13

DIO_13

Digital

GPIO

RES

RESET_N

Digital

Reset, active low. Internal pullup.

JTAG_TMSC

Digital

JTAG TMSC, high-drive capability

JTAG_TCKC

Digital

JTAG TCKC

RF-BM-2652P4(I)

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VCC

Power supply: 1.8 V ~ 3.8 V, recommended to 3.3 V

GND

Ground

DIO14

DIO_14

Digital

GPIO

DIO15

DIO_15

Digital

GPIO

DIO16

DIO_16

Digital

GPIO, JTAG_TDO, high-drive capability

DIO17

DIO_17

Digital

GPIO, JTAG_TDI, high-drive capability

DIO18

DIO_18

Digital

GPIO

DIO19

DIO_19

Digital

GPIO

DIO20

DIO_20

Digital

GPIO

DIO21

DIO_21

Digital

GPIO

DIO22

DIO_22

Digital

GPIO

DIO23

DIO_23

Digital or Analog

GPIO, analog capability

DIO24

DIO_24

Digital or Analog

GPIO, analog capability

DIO25

DIO_25

Digital or Analog

GPIO, analog capability

DIO26

DIO_26

Digital or Analog

GPIO, analog capability

DIO27

DIO_27

Digital or Analog

GPIO, analog capability

GND

Ground

ANT

External antenna interface

RF-BM-2652P4(I)

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3 Specifications

3.1 Recommended Operating Conditions

Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table

below. Long-term work beyond this limit will affect the reliability of the module more or less.

Table 3. Recommended Operating Conditions of RF-BM-2652P4(I)

Items

Condition

Min.

Typ.

Max.

Unit

Operating Supply Voltage

1.8

3.3

3.8

Operating Temperature

-40

+25

+85

℃

3.2 Handling Ratings

Table 4. Handling Ratings of RF-BM-2652P4(I)

Items

Condition

Min.

Typ.

Max.

Unit

Storage Temperature

Tstg

-40

+25

+125

℃

Human Body Model

HBM

±2000

Moisture Sensitivity Level

Charged Device Model

±500

3.3 PA Output Control

The PA of the CC2652P switches the RF switch by controlling the output of DIO28 and DIO29, and then switches the PA

and non-PA RF output to realize the control of the transmission power range.

Table 3. RF Control Truth Table

Power

DIO28 (Output)

DIO29 (Output)

+5 dBm ~ + 20 dBm (PA)

< 5 dBm

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