Shuttle HOT-661/P Bedienungsanleitung

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HOT-661/P

Pentium™IIprocessor

Based AGP MAINBOARD

User's Manual

FCCNotice:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC

Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses and can radiate radio frequency energy. If not installed and used properly, in strict accor-

dance with the manufacturer’s instructions, may cause harmful interference to radio communications. However, there is no

guarantee that interference will not occur in a particular installation. If this equipment does cause interference to radio or

television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct

the interference by one or more of the following measures :

Reorientorrelocatethereceivingantenna.

Increasethe separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/television technician for help and for additional suggestions.

The user may find the following booklet prepared by the Federal Communications Commission helpful “How to Identify

and Resolve Radio-TV Interference Problems.” This booklet is available from the U.S. Government Printing Office.

Washington, DC 20402, Stock 004-000-00345-4

FCCWarning

The user is cautioned that changes or modifications not expressly approved by the manufacturer could void the user’s

authority to operate this equipment.

Note : In order for an installation of this product to maintain compliance with the limits for a Class B device, shielded

cables and power cord must be used.

CENotice:

Following standards were applied to this product, in order to achieve compliance with the electromagnetic

compatibility :

- Immunity in accordance with EN 50082-1: 1992

- Emissions in accordance with EN 55022: 1987 Class B.

NOTICE

Manual Ver 3.0

All information, documentation, and specifications contained in this manual are subject to change without prior

notificationby themanufacturer.

The author assumes no responsibility for any errors or omissions which may appear in this document nor does

it make a commitment to update the information contained herein.

TRADEMARKS

Intel is a registered trademark of Intel Corporation

PentiumII Processor is a registered trademark of Intel Corporation

PC/AT is a registered trademark of International Business Machine Corporation.

PS/2 is a registered trademark of IBM Corporation.

All other brand and product names referred to in this manual are trademarks or registered trademarks of their

respective holders.

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TABLE OF CONTENTS

PREFACE ............................................................................................................ 3

CHAPTER 1 INTRODUCTION ..................................................................................... 4

Specification...............................................................................................................................4

Accessories of HOT-661/P .........................................................................................................6

CHAPTER 2 HARDWARE CONFIGURATION ................................................................... 7

The Pentium II Processor............................................................................................................7

What does the URM (Universal Retention Mechanism) consist of..............................................8

Install the Universal Retention Mechanism and Heat Sink Support.............................................8

Install Pentium II Processor......................................................................................................10

Celeron Processor S.E.P.P. only Retention Mechanism Assembly Procedures.......................... 11

Install Celeron Processor ..........................................................................................................12

Install S.E.C.C.2 Processor.......................................................................................................13

Jumpers ....................................................................................................................................14

CPU Clock Speed Selection......................................................................................................14

Clear CMOS - JP19 ..................................................................................................................17

Flash EEPROM Vpp - J17........................................................................................................17

Keyboard PS/2 Mouse Power-On Setting - J44, JP38................................................................17

Connectors................................................................................................................................18

CHAPTER 3 MEMORY CONFIGURATION .................................................................... 21

CHAPTER 4 FLASH UTILITY ................................................................................... 22

CHAPTER 5 AWARD BIOS SETUP ......................................................................... 25

The Main Menu........................................................................................................................26

Standard CMOS Setup..............................................................................................................28

BIOS Features Setup.................................................................................................................30

Chipset Features Setup..............................................................................................................33

Power Management Setup ........................................................................................................37

PCI Configuration Setup...........................................................................................................40

Integrated Peripherals...............................................................................................................42

Password Setting ......................................................................................................................45

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HOT-661/P mainboard is a highly integrated IBM PC/AT compatible system board. The

design will accept Intel Pentium II processors which features high-performance pipelined

burst secondary cache memory support with size of 512KB or 256KB. The memory

subsystem is designed to support up to 1024MB SDRAM in standard 168-pin DIMM

socket.

HOT-661/P provides a new level of I/O integration. Intel's 82440BX AGPset chipset

provides increased integration and improved performance over other chipset designs.

HOT-661/P main board provides an AGP slot to support a new generation of graphics

cards with ultra-high memory bandwidth.

The 82440BX AGPset chipset provides an integrated Bus Mastering IDE controller with

two high performance IDE interfaces for up to four IDE devices.

The onboard Giga I/O controller provides the standard PC I/O functions: floppy inter-

face, two FIFO serial ports, an IrDA device port and a SPP/EPP/ECP capable parallel

port.

Up to four PCI local bus slots provide a high bandwidth data path for data-movement

intensive functions such as graphics, and up to three ISA slots complete the I/O function.

The HOT-661/P provides the foundation for cost effective, high performance, highly

expandable platforms, which deliver the latest in Pentium processor and I/O standard.

PREFACE

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SPECIFICATION

The HOT-661/P mainboard is carefully designed for the demanding PC user who wants high perfor-

mance and many intelligent features in a compact package:

Intel Chipset:

Features Intel 440BX AGPset with I/O subsystems.

CPU Support:

CeleronTM processors 266/33 ~ 333/66 MHz

Pentium IITM processors 233/66 ~ 333/66 MHz and 350/100 ~ 500/100 MHz

Versatile Memory Supports:

Supports four banks of normal or PC/100 SDRAM maximum memory size up to 1024MB

Configurable support for EC (Error Checking) and ECC (Error Checking and Correcting)

PCI and ISA Expansion Slots:

Provides four 32-bit PCI slots and three 16-bit ISA slots.

AGPSlot:

Supports Accelerated Graphics Port cards for high performance, component level interconnect

targeted at 3D graphical display applications.

Onboard GiGA-I/O:

Provides one Floppy port; One PS/2 mouse port and one PS/2 Keyboard port; Two 16C550 com-

patible UARTS serial ports support Infra-red communication and one parallel port supports SPP,

EPP and ECP. Serial Port 2 can also be directed from COM2 to the Infrared Module for wireless

connections.

Onboard PCI Bus Master IDE Controller:

Two Ultra DMA/33 Bus Master IDEPorts supports four IDE devices up to 33 MB/sec IDE trans-

fers and supports Enhanced PIO Modes 3 and 4 and Bus Master IDE DMA Mode 2 devices.

Onboard 20-pin ATX Power Supply:

Provides ATX power connector onboard supports soft-on/off function.

SystemBIOS:

Provides licensed Award V4.51PG BIOS on Flash EEPROM.

Supports Green PC, DMI and Bundled with NCR SCSI BIOS.

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ACPI:

SupportACPI (Advanced Configuration and Power Interface)function. ACPI provide more

Energy Saving Features for the future operating system supporting OS Direct Power Management

(OSPM) functionality.

Board Size:

ATX form factor, dimension 305mm x 170mm

AdvancedFeatures:

Low EMI -- Spread Spectrum built in - ±1.5% modulation and automatic clock shut-off of unused

PCI/SDRAMS slots to reduce the EMI.

Dual Function Power Button -- The system can be one of two states, one is Suspend mode and

the other is the Soft-off mode. Pushing the power button for less than 4 seconds will place the

system into Suspend mode. When push the power button for more than 4 seconds, the system

enters the Soft-off mode.

Modem Ring Power-on -- The system will power-on automatically by activating of modem ring.

MoreAdvanced Features (HOT-661P):

Voltages Monitoring -- System voltages levels are monitored to ensure stable current to main

board components.

System voltages include VCORE and VL2 for CPU, and +5V, +12V, -5V, -12V for system.

FAN Status Monitoring -- To prevent CPU overheat, CPU fan is monitored for RPM and failure.

(CPU Cooling FAN with RPM sensor is required)

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ACCESSORIESOF HOT-661/P

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HARDWARE CONFIGURATION

The Pentium™ II Processor

Figure 2-1

Figure 2-2 Figure 2-3

The Pentium™ II and Celeron™ processor is the next member of the P6 processor family.

It combines the architectural advances in the Pentium Pro processor with the instruction set

extensions of MMX technology. It is fully compatible with the huge base of Intel architec-

ture-based PC software. Additional, the Pentium™ II processor delivers new levels of

performance for advance media and communications software including powerful, realistic

graphics and imaging capabilities, video conference, and the ability to run full-screen, full-

motion video. The combination of these advanced technologies makes the Pentium™ II

processor the ideal choice foe executing modem 32-bit compute-intensive and multimedia-

enhanced application work loads using advanced 32-bit operating systems.

The Pentium™ II and Celeron processor both have a separate, 32KB, on-chip, non-blocking

L1 cache which run at the processor frequency, Pentium™ II processor also has a 512KB or

256KB on-board L2 non-blocking cache runs at half the processor speed.

The Pentium™ II processor using Single Edge Contact Cartridge (S.E.C.C.) and S.E.C.C.2

packaging technology which enables high volume availability, improved handling protec-

tion.

The Celeron™ processor using Single Edge Processor Package. ( S.E.P.P.)

Figure 2-1 shows the front, rear and top views of Pentium™ II processor (without heat sink

mounted).

Figure 2-2 shows the S.E.C.C.2 package of Pentium™ II processor.

Figure 2-3 shows the primary and non-primary side of Celeron™ processor without heat

sink mounted and with heat sink mounted.

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What does the URM (Universal Retention Mechanism) consist of

Pentium II processor requires the Retention Mechanism (RM) and optional Heat Sink

Support (HSS) to hold the base processor in the S.E.C. cartridge.(or SECC 2)

Following installation procedure will display how to install these mechanism.

Retention Mechanism package consists of 2 separate parts and optional Heat Sink Support

consists of 3 separate parts.

Normally, depend on the type of heat sink, Heat Sink Support is not always available. For

some heat sink attached on pentium II processor might not fit to install the Heat Sink

Support. The introduction of Heat Sink Support installation on this manual only for your

reference.

Universal Retention Mechanism (URM) -

Plastic Guide with captive nuts that hold the

S.E.C. Cartridge in the Slot1 connector.

(Refer to Figure 2-4)

URM Attach Mount (URMAM) -

Bolt/Bridge assemblies inserted up through

the bottom of the mainboard. Then secures the

URM to URMAM (two URMAM required per URM).

(Refer to Figure 2-5)

Figure 2-4

Figure 2-5

Installthe UniversalRetentionMechanism andHeatSink Support

Place the mainboard on a workbench (not in a chassis). Be sure that the mainboard is bare

(that is, no DIMMs, cables, or cards are installed).

Install the Retention Mechanism :

1. Finds out the Universal Retention

Mechanism (URM) Mounting Holes

of Slot1 on HOT-661/P main board.

(Refer to Figure 2-6)

2. Install two Universal Retention

Mechanism Attach Mounts (URMAM)

with Bolt/Bridge assemblies inserted

up through the bottom of the

mainboard. (Notice the URMAM's

bridge orientation as Figure 2-7)

Figure 2-7

Figure 2-6

- 9 -

Figure 2-8 Figure 2-9

Install the Heat Sink Support: (optional)

If your Heat Sink comes with the Heat Sink suport then install it according to the instruction

comes with your Heat Sink.

Figure 2-8 and Figure 2-9 shows some Heat Sink examples.

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