Shuttle HOT-661Z Bedienungsanleitung
47
HOT-661/P
Pentium™IIprocessor
Based AGP MAINBOARD
User's Manual
FCC Notice:
ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice,pursuanttoPart15ofFCC
Rules. Theselimitsaredesigned to provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy. If not installed and used properly, in strict accor-
dancewith the manufacturer’s instructions, may causeharmfulinterference to radio communications. However, thereisno
guarantee that interference will not occur in a particular installation. If this equipment does cause interference to radio or
televisionreception,which can be determined by turning the equipment off and on, the user is encouraged to try to correct
theinterference by one or more of the following measures :
Reorientorrelocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consultthe dealer or an experiencedradio/television technician for help andforadditional suggestions.
Theuser may find the following booklet prepared by the FederalCommunicationsCommission helpful “How to Identify
andResolveRadio-TV Interference Problems.” This booklet is available from the U.S. Government Printing Office.
Washington,DC20402, Stock 004-000-00345-4
FCC Warning
Theuser is cautioned thatchangesor modifications not expresslyapprovedby the manufacturer couldvoidthe user’s
authoritytooperate this equipment.
Note : In order for an installation of this product to maintain compliance with the limits for a Class B device, shielded
cablesand powercordmust beused.
CE Notice:
Following standards were applied to this product, in order to achieve compliance with the electromagnetic
compatibility :
- Immunity in accordance with EN 50082-1: 1992
- Emissions in accordance with EN 55022: 1987 Class B.
NOTICE
Copyright 1998.
All Right Reserved
Manual Ver 1.0
All information, documentation, and specifications contained in this manual are subject to change without prior
notification by the manufacturer.
The author assumes no responsibility for any errors or omissions which may appear in this document nor does
it make a commitment to update the information contained herein.
TRADEMARKS
Intel is a registered trademark of Intel Corporation
PentiumII Processor is a registered trademark of Intel Corporation
PC/AT is a registered trademark of International Business Machine Corporation.
PS/2 is a registered trademark of IBM Corporation.
All other brand and product names referred to in this manual are trademarks or registered trademarks of their
respective holders.
2
TABLEOFCONTENTS
T
T
PREFACE ............................................................................................................ 3
CHAPTER 1 INTRODUCTION ..................................................................................... 4
Specification...............................................................................................................................4
Accessories of HOT-661/P..........................................................................................................6
CHAPTER 2 HARDWARE CONFIGURATION ................................................................... 7
The Pentium II & Celeron Processor...........................................................................................7
What does the RM (Retention Mechanism) consist of.................................................................8
Install the Retention Mechanism and Heat Sink Support.............................................................9
Install Pentium II Processor......................................................................................................11
Celeron Processor S.E.P.P only RM Assembly Procedure.........................................................12
What does Celeron Processor RM consist of.............................................................................13
Install Celeron Processor..........................................................................................................13
Jumpers ....................................................................................................................................14
Clear CMOS - J19....................................................................................................................18
Flash EEPROM Vpp - J17........................................................................................................18
Keyboard PS/2 Mouse Power-on setting - J44, JP8...................................................................18
Connectors & Sockets...............................................................................................................19
CHAPTER 3 MEMORY CONFIGURATION .................................................................... 22
CHAPTER 4 FLASH UTILITY................................................................................... 23
CHAPTER 5AWARD BIOS SETUP ......................................................................... 26
The Main Menu........................................................................................................................27
Standard CMOS Setup..............................................................................................................29
BIOS Features Setup.................................................................................................................31
Chipset Features Setup..............................................................................................................34
Power Management Setup.........................................................................................................38
PCI Configuration Setup...........................................................................................................41
Integrated Peripherals...............................................................................................................43
Password Setting.......................................................................................................................46
3
HOT-661/P mainboard is a highly integrated IBM PC/AT compatible system board. The
design will accept Intel Pentium II processors which features high-performance pipelined
burst secondary cache memory support with size of 512KB or 256KB. The memory
subsystem is designed to support up to 1024MB SDRAM in standard 168-pin DIMM
socket.
HOT-661/P provides a new level of I/O integration. Intel's 82440BX AGPset chipset
provides increased integration and improved performance over other chipset designs.
HOT-661/P main board provides an AGP slot to support a new generation of graphics
cards with ultra-high memory bandwidth.
The 82440BX AGPset chipset provides an integrated Bus Mastering IDE controller with
two high performance IDE interfaces for up to four IDE devices.
The onboard Giga I/O controller provides the standard PC I/O functions: floppy inter-
face, two FIFO serial ports, an IrDA device port and a SPP/EPP/ECP capable parallel
port.
Up to four PCI local bus slots provide a high bandwidth data path for data-movement
intensive functions such as graphics, and up to three ISA slots complete the I/O function.
The HOT-661/P provides the foundation for cost effective, high performance, highly
expandable platforms, which deliver the latest in Pentium processor and I/O standard.
PREFACE
P
P
4
SPECFICATION
1
1
The HOT-661/P mainboard is carefully designed for the demanding PC user who wants high perfor-
mance and many intelligent features in a compact package:
Intel Chipset:
Features Intel 440BX AGPset with I/O subsystems.
CPU Support:
Celeron™ processors 233/66 ~ 333/66 MHz
Pentium II™ processors 233/66 ~ 333/66 MHz and 350/100 ~ 500/100 MHz
Versatile Memory Supports:
Supports four banks of normal or PC/100 SDRAM maximum memory size up to 1024MB
Configurable support for EC(Error Checking) and ECC (Error Checking and Correcting)
PCIandISA Expansion Slots:
Provides four 32-bit PCI slots and three 16-bit ISA slots.
AGP Slot:
Supports Accelerated Graphics Port cards for high performance, component level interconnect
targeted at 3D graphical display applications.
Onboard GiGA-I/O:
Provides one Floppy port; One PS/2 mouse port and one PS/2 Keyboard port; Two 16C550
compatible UARTS serial ports support Infra-red communication and One parallel port supports
SPP, EPPand ECP. Serial Port 2 can also be directed from COM2 to the Infrared Module for
wireless connections.
Onboard PCI Bus Master IDE Controller:
TwoUltra DMA/33 Bus Master IDEPorts supports four IDE devices up to 33 MB/sec IDE trans-
fers and supports Enhanced PIO Modes 3 and 4 and Bus Master IDE DMA Mode 2 devices.
Onboard20-pinATX Power Supply:
Provides ATX power connector onboard supports soft-on/off function.
System BIOS:
Provides licensed Award V4.51PG BIOS on Flash EEPROM.
Supports Green PC, DMI and Bundled with NCR SCSI BIOS.
5
ACPI:
SupportACPI (Advanced Configuration and Power Interface)function. ACPI provide more
Energy Saving Features for the future operating system supporting OS Direct Power Management
(OSPM) functionality.
Board Size:
ATX form factor, dimension 305mm x 170mm
Advanced Features:
Low EMI -- Spread Spectrum built in - ±1.5% modulation and automatic clock shut-off of unused
PCI/SDRAMS slots to reduce the EMI.
Dual Function Power Button -- The system can be one of two states, one is Suspend mode and
the other is the Soft-off mode. Pushing the power button for less than 4 seconds will place the
system into Suspend mode. When push the power button for more than 4 seconds, the system
enters the Soft-off mode.
Modem Ring Power-on -- The system will power-on automatically by activating of modem ring.
More Advanced Features (HOT-661P):
Voltages Monitoring -- System voltages levels are monitored to ensure stable current to main
board components.
System voltages include VCORE and VL2 for CPU, and +5V, +12V, -5V, -12V for system.
FAN Status Monitoring -- To prevent CPU overheat, CPU fan is monitored for RPM and failure.
(CPU Cooling FAN with RPM sensor is required)
6
ACCESSORIESOFHOT-661/P
7
ThePentiumIIProcessor
HARDWARECONFIGURATION
2
2
The Pentium II and Celeron processor is the next member of the P6 processor family. It
combines the architectural advances in the Pentium Pro processor with the instruction set
extensions of MMX technology. It is fully compatible with the huge base of Intel architec-
ture-based PC software. Additional, the Pentium II processor delivers new levels of perfor-
mance for advance media and communications software including powerful, realistic
graphics and imaging capabilities, video conference, and the ability to run full-screen, full-
motion video. The combination of these advanced technologies makes the Pentium II
processor the ideal choice foe executing modem 32-bit compute-intensive and multimedia-
enhanced application work loads using advanced 32-bit operating systems.
The Pentium II and Celeron processor both have a separate, 32KB, on-chip, non-blocking L1
cache which run at the processor frequency, Pentium II processor also has a 512KB or
256KB on-board L2 non-blocking cache runs at half the processor speed.
The Pentium II processor using Single Edge Contact (S.E.C.) cartridge packaging technol-
ogy which enables high volume availability, improved handling protection.
The Celeron processor using Single Edge Processor Package. ( S.E.P.P.)
Figure 2-1 shows the front, rear and top views of Pentium II processor (without heat sink
mounted).
Figure 2-2 shows the primary and non-primary side of Celeron processor without heat sink
mounted and with heat sink mounted.
Figure 2-2
Figure 2-1
8
WhatdoestheRM(RetentionMechanism)consist of
PPentium II processor requires the Retention Mechanism (RM) and optional Heat Sink
Support (HSS) to hold the base processor in the S.E.C. cartridge.
Following installation procedure will display how to install these mechanism.
Retention Mechanism package consists of 2 separate parts and optional Heat Sink Support
consists of 3 separate parts.
Normally, depend on the type of heat sink, Heat Sink Support is not always available. For
some heat sink attached on pentium II processor might not fit to install the Heat Sink
Support which introduced on this manual. The Heat Sink Support installation just your
reference only.
Retention Mechanism (RM) -
Plastic Guide with captive nuts that hold the
S.E.C. Cartridge in the Slot1 connector.
(Refer to Figure 2-3)
RM Attach Mount (RMAM) -
Bolt/Bridge assemblies inserted up through
the bottom of the mainboard. Then secures the
RM to RMAM (two RMAM required per RM).
(Refer to Figure 2-4)
Heat Sink Support Base (HSSBASE) -
Plastic support bar mounted to the mainboard
under the ATX heat sink.
(Refer to Figure 2-5)
HSS Pin (HSSPIN) -
Plastic pins inserted through the HSSBASE to secure
it to the mainboard (two required per Assembly).
(Refer to Figure 2-6)
HSS Top Bar (HSSTOP) -
Plastic bar that clips onto the HSSBASE
through the fins on the ATX heat sink.
(Refer to Figure 2-7)
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Figure 2-7
9
Installthe Retention MechanismandHeatSink Support
Place the mainboard on a workbench (not in a chassis). Be sure that the mainboard is bare
(that is, no SIMMs, cables, or cards are installed).
Figure 2-8
Figure 2-9
InstalltheRetentionMechanism :
1. Finds out the Retention Mechanism (RM)
Mounting Holes and "Pin 1" mark of Slot 1
on HOT-661/P main board. (Refer to Figure
2-8)
2. Install two Retention Mechanism Attach
Mounts (RMAM) with Bolt/Bridge assem-
blies inserted up through the bottom of the
mainboard. (Notice the RMAM's bridge
orientation as Figure 2-9)
3. Insert the Retention Mechanism (RM)
around the Slot 1. Be sure theSquareCut
Markof RM (Refer to Figure 2-10) have the
same orientation of Slot 1 pin 1.(Refer to
Figure 2-9)
4. Screw thefour captive nuts(Refer to
Figure 2-10) on the RM by a screw drive to
secure RM to two RMANs.
Figure 2-10
Dieses Handbuch passt für folgende Modelle
1
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