Toshiba FDX3543RP Gebrauchsanweisung

X-Ray FLAT PANEL IMAGER

FDX3543RP

Active Area: 35(H)×43(V)cm

(14″×17″)

★The information contained herein is presented only as a guide for the applications of our products.

No responsibility is assumed by TOSHIBA ELECTRON TUBES & DEVICES CO., LTD. (TETD) for any infringements of patents or other rights of the

third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TETD or others.

★The information contained herein may be changed without prior notice. It is therefore advisable to contact TETD before proceeding with the design of

equipment incorporating this product.

Technical Data

No.TE-FDX3543RP 2012-08-16

FEATURING:

●Excellent Sensitivity & Resolution

●Excellent Image Quality

●Excellent Reliability

– Excellent Sensitivity & Resolution –

●Toshiba’s advanced and proven fine structured CsI:Tl and direct vapor deposition

technology deliver higher sensitivity and better resolution.

●Reflection coating on CsI:Tl screen enables excellent Detective Quantum Efficiency (DQE)

and low noise.

●A high Modulation Transfer Function (MTF) FPD is the result of these outstanding

technologies diagnostic images, while delivering the benefits of lower radiation dose to the

patient. The FDX3543RP achieves a new level of functionality and reliability in developing

functional FPD’s for system manufacturers.

– Excellent Image Quality –

●Achieves a raw image with a low-noise through the use of Toshiba’s own circuit technology.

●Images have a shorter lag time with an improved refresh function, suitable for radiographic

double exposure.

●Driver software (attached to the product) provides excellent, clear raw images, adopting

ghost image correction , offset correction, gain correction and defect corrections.

– Excellent Reliability –

●Excellent durability by using CsI:Tl screen direct vapor deposition method.

●The structure is highly reliable and protected from degradation due to the use of a unique

moisture-proof sealing method for the CsI:Tl screen

FDX3543RP

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COMPONENTS AND CHARACTERISTICS

Flat Panel Sensor Unit:

Sensor Protection Plate....................................................................................... Carbon Fiber Plate

Cooling ................................................................................................................ Natural Air Cooling

Input....................................................................................................... DC15V (from Interface Box)

Power Consumption .................................................................................................. Maximum 10W

Overall Dimensions................................................................ 384×460×15mm (W(H)×D(V)×(H))

Weight ......................................................................................................................... 3 kg (approx.)

Interface Box:

Input........................................................................................................... AC100 to 240V, 50/60Hz

Output.................................................................................................................. DC15V 2.6A 30VA

Overall Dimensions................................................................ 115×185×85mm (W(H)×D(V)×(H))

Weight ......................................................................................................................... 1 kg (approx.)

Dimensional Outline:

Refer to pages 24 to 25.

Environmental:

Under delivery and stock

Temperature ............................................................................................................ -15 ～55 ℃

Humidity........................................................................................ 10 ～90 %(Non-Condensing)

Pressure ................................................................................................................ 50 ～106 kPa

Under operating

Temperature ........................................................................................................... +10 ～35 ℃

Humidity....................................................................................... 10 ～85 % (Non-Condensing)

Pressure ................................................................................................................ 70 ～106 kPa

ACCESSORIES

Cables:

AC Cable ............................................................................................................................ 1.8 m×1

GND Cable ............................................................................................................................ 3 m×1

CD:

CD（Defect map, SDK）............................................................................................................. 1 pcs

OPTION ACCESSORIES

Sensor Unite Cable (Sensor Unit - Interface Unit)

ECB-F035A-09/G......................................................................................................................... 9 m

ECB-F035A-14/G....................................................................................................................... 14 m

FDX3543RP

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MAIN CHARACTERISTICS

Image Format:

X-ray Conversion Layer ................... Cesium Iodide (Csl) with Amorphous Silicon (a-Si) Photodiode

Active Area ........................................................................................ 35(H)×43(V)cm (14×17 inch)

Pixel Matrix ........................................................................................................... 2448(H)×2984(V)

Pixel Pitch............................................................................................................................ 143 μm

Cycle Time............................................................................................................. Shot to Shot 6sec

Performance:

Limiting Resolution .................................................................................................... 3.7 Lp/mm typ.

MTF (2.0 Lp/mm, 70 kVp, 1×1) ......................................................................................... 36 % typ.

DQE (DQE (0), Quantum - Limited)........................................................................................ > 70 %

A/D Conversion......................................................................................................................... 16 bit

Ratings:

Energy Range............................................................................................................... 40～150 kVp

Maximum Entrance Dose (low Gain)（Linear Output Range）....................................... 4 mR / frame

Interface (Interface Box):

Sensor Unit

UNIT Interface ............................................................................................. Connect to InterfaceBox

Interface Box

Unit Interface ................................................................................................Connect to Sensor Unit

Data Output ................................................................. 16 bit Digital Output Ethernet (1000BASE-T)

Command Control.......................................................................................... Ethernet (1000BASE-T)

X-ray Synchronization Control .............................................................................................. External

Power Input .............................................................................................. AC100 to 240V, 50/60 Hz

Image Acquisition Exposure period:

X-ray period (ms)........................................................Standard: 500 (Variable between 500 to 2000)

FDX3543RP

-4-

Product Components and Interface:

NOTE:

Do not disconnect Ethernet connection while DC15V is operating and supplying to Sensor Unit.

LED Display Mode:

Name Status

POWER Turn on when power on

ETHERNET Turn on when Connect Ethernet

Detector

PC (User)

TFT Panel

Gate Drive

ROIC Unit

Control Board

Ethernet

Interface

Box

DC15V

Image Data

&Control

X-ray

Control Unit (User)

X-ray Sync

FDX3543RP

-5-

Image Acquisition Communication Block Diagram:

Communication Availability:

Signal Name Type Ethernet Command Control

(PC)

D-Sub Signal Control

(X-ray Controller)

EXP_REQ INPUT OK OK

EXP_OK OUTPUT N.A OK

＊EXP_REQ Command Response

ital Unit

Interface Box

Generator Panel Unit

Sensor unit

Power Unit

PC Image Data

Image Data

DC Power DC Power

DC Power

X-ra

FDX3543RP

-6-

FPI Drive

EXP_RE <IN>

EXP_OK <OUT>

EXPOSURE

DATA_STRAGE

Ready

Data

Ref Ready RefExposure Read

FPI ENABLED

1st 1st

②

①

BCD

Image Acquisition Control Interface:

D-Sub Signal Control Interface Operation Sequence

Description of the sequence

1. By receiving “EXP_REQ” during “Refresh” status proceeds to “Exposure” after completion of

“Refresh”.

2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition

mode table.

3. Proceeds to “Data Read” after completion of Exposure.

(1) Single Exposure

A: EXP_REQ width

Minimum 1ms

B: Refresh period

For line drive (2984 Line scan), 80 ms

C: EXP period

Set value: see the Image acquisition mode table (500 to 2000 ms (by 500 ms step),

standard 500 ms).

D: Read period

For line drive (2984 Line Scan) 240 ms

①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms

②：EXP_REQ－DATA STORAGE period ...........Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP

-7-

FPI Drive

EXP_RE <IN>

EXP_O

<OUT>

EXPOSURE

DATA_STRAGE

Ready

1st image data 2nd image data

Exposure Read Exposure ReadRef Ref

FPI ENABLED

1st 1st

②

①

2nd 2nd

(2) Double Exposure

A: EXP_REQ width

Minimum 1ms

B: Refresh period

For line drive (2984 Line scan) 80 ms

C: EXP period

Set value: see the Image Acquisition mode table (500 to 2000 ms (by 500 ms step),

standard 500 ms).

D: Read period

For line drive (2984 Line Scan) 240 ms

①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms

②：Double EXPOSURE cycle period...................Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP

-8-

FPI Drive Ref Re

EXP_RE <IN>

EXP_OK <OUT>

EXPOSURE

DATA_STRAGE

Ready

Data

ReadyExposure Read

FPI ENABLED

1st 1st

②

①

Image Acquisition Control Interface:

Ethernet Interface Command Control Operation Sequence

Description of the sequence

1. By receiving “EXP_REQ” request command during “Refresh” status proceeds to “Exposure”

after completion of “Refresh”.

2. Continues “EXP_OK” signal ON during “Exposure”. ON period is defined by Image Acquisition

mode table.

3. Proceeds to “Data Read” after completion of Exposure.

(1) Single Exposure

①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms

②：EXP_REQ－DATA STORAGE period ...........Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP

-9-

FPI Drive Ref Ref

EXP_RE <IN>

EXP_OK <OUT>

EXPOSURE

DATA_STRAGE

Ready Exposure Read Exposure Read

FPI ENABLED

1st 1st

②

①

2nd 2nd

(2) Double Exposure

①：EXP_REQ－EXP_OK period ........................................................................Maximum 150 ms

②：Double EXPOSURE cycle period...................Maximum 1700 ms (case EXPOSURE 500 ms)

FDX3543RP

-10-

2-M2.6×0.45

1 5

6 9

FPI Side

User System Side

Pin 2

Pin 7

D-Sub 9 Pin

Connector

Image Acquisition Control Interface of Interface Box:

1. Pins assign

Pin No Signal name I/O Contents

1 NC - Not connected

2 EXP_REQ+ Input

Image acquisition (X-ray exposure)

Request signal +

3 0_TEXP_OK+ Output

Image acquisition (X-ray exposure)

Period signal +

4 0_EXP_OK+ (OC) Output Open Collector +

5 NC - Not connected

6 NC - Not connected

7 EXP_REQ- Input

Image acquisition (X-ray exposure)

Request signal -

8 0_TEXP_OK- Output

Image acquisition (X-ray exposure)

Period signal -

9 0_EXP_OK- (OC) Output Open Collector-

*1 Please put the protective resistance more than 1.4 kΩin the series.

*2 Maximum sink current is 20 mA.

2. External Interface (EXT-INF)

D-Sub 9pin female (Front View)

3. Input Circuit

Symbol Min. Typ. Max. Unit

Input Voltage Vih 5 - 28 V

Vil 0 - 1 V

2- №4-40UNC

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