EPOX EP-4B2AE Bedienungsanleitung

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 1.2

September 20, 2001

User’User’

User’ss

ManualManual

Manual

A PA P

A Pentium 4 Prentium 4 Pr

entium 4 Prentium 4 Pr

entium 4 Processor basedocessor based

ocessor basedocessor based

ocessor based AA

AGPGP

GPGP

(4X) mainboar(4X) mainboar

(4X) mainboard (100MHz)d (100MHz)

d (100MHz)d (100MHz)

d (100MHz)

600024E12

Table of Contents

Section 1 Introduction

Components Checklist..............................................1-1

Overview

System Overview .......................................................1-2

Chipset Components .................................................1-3

Intel Pentium 4 Processors ......................................1-4

Accelerated Graphics Port .......................................1-5

Utlra ATA66/100 .......................................................1-5

Hardware Monitoring................................................1-6

Bandiwdth Overview .................................................. 1-6

Mainboard Form-Factor............................................1-7

I/O Shield Connector ................................................ 1-8

Power-On/Off (Remote) .......................................... 1-8

System Block Diagram ............................................. 1-9

Section 2 Features

Mainboard Features...................................................2-1

Section 3 Installation

Mainboard Detailed Layout ......................................3-2

Easy Installation Procedure

CPU Installation ........................................................3-3

Jumper Settings ......................................................... 3-5

System Memory Configuration ................................3-6

Device Connectors....................................................3-8

External Modem Ring-in Power ON and

Keyboard Power ON Function (KBPO)...................3-12

STR Function .............................................................3-14

Page

Section 4 Award BIOS Setup

Main Menu ................................................................ 4-1

Standard CMOS Setup............................................... 4-3

Advanced BIOS Features...........................................4-7

Advanced Chipset Features .......................................4-10

Integrated Peripherals ............................................... 4-13

Power Management Setup ........................................4-18

PNP/PCI Configuration Setup .................................. 4-21

PC Health Status........................................................4-23

Frequency/Voltage Control....................................... 4-25

Defaults Menu ........................................................... 4-27

Supervisor/User Password Setting ........................... 4-28

Exit Selecting ............................................................ 4-29

Section 5 Driver Installation

845 and Sound Driver Installation ............................ 5-1

Appendix Appendix A

Avance Media Player User’s Guide..........................A-1

Appendix B

GHOST 5.1/6.03 Quick User’s Guide ..................... B-1

Appendix C

EEPROM BOIS Remover ......................................... C-1

Appendix D

Update Your System BIOS ........................................ D-1

Introduction

Page 1-1

Section 1

INTRODUCTION

Components Checklist

USER’S

MANUAL

Package Contents

A. (1)Mainboard

B. (1)User’s manual

C. (1)Floppy ribbon cable

D.(1)ATA-66/100 Hard drive ribbon

cable

E. (1)Driver and utility

Optional Item

F. (1)ATA-33 Hard drive ribbon

cable

G.(1)USB Cable

Introduction

Page 1-2

System Overview

This board is designed with Intel®845 chipset. The Intel®845 chipset includes

MCH(FW82845), ICH2(FW82801BA) and FWH three chips. This board is

designed for Intel’s FC-PGA socket 423 package architecture and support the 4X

capability of the AGP 2.0 Interface Specification. A new chipset component

interconnect, the hub interface, is designed into the Intel®845 chipset to provide

more efficient communication between chipset components.

Support of AGP 4X, 133MHz SDRAM and the hub interface provides a balanced

system architecture for the Pentium®4 in the Socket 423 architecture processor

minimizing bottlenecks and increasing system performance. By increasing

memory bandwidth to 1.064GB/s through the use of AGP 4X, the Intel®845

chipset will deliver the data throughput necessary to take advantage of the high

performance provided by the powerful Pentium®4 in the Socket 423 architecture

processor.

The Intel®845 chipset architecture removes the requirement for the ISA expan-

sion bus that was traditionally integrated into the I/O subsystem of Intel chipsets.

This removes many of the conflicts experienced when installing hardware and

drivers into legacy ISA systems. The elimination of ISA will provide true plug-and

play for the Intel®845 platform.

Intel®845 chipset contains three core components: the Memory Controller Hub

(MCH), the I/O Controller Hub (ICH) and the Firmware Hub (FWH). The MCH

integrates the data transfer rate of 400MHz, Pentium®4 processor bus controller,

AGP 2.0 controller, 133MHz SDRAM controller and a high-speed hub interface

for communication with the ICH2. The ICH2 integrates an UltraATA/66/100

controller, USB host controller, LPC interface controller, FWH interface

controller, PCI interface controller, and a hub interface for communication with

the MCH. The Intel®845 chipset will provide the data buffering and interface

arbitration required to ensure that system interfaces operate efficiently and

provide the system bandwidth necessary to obtain peak performance the Pentium®

4 in the Socket 423 architecture.

Introduction

Page 1-3

Chipset Components

The Intel®845 chipset consists of the Memory Controller Hub (MCH), the I/O

Controller Hub (ICH2) and the Firmware Hub (FWH).



Memory Controller Hub (MCH)

The MCH provides the interconnect between the SDRAM and the system

logic. It integrates:

- Support for single processor with a data transfer rate of 400MHz.

- 133MHz SDRAM interface supporting 3GB of SDRAM.

- 2X, 4X, 1.5V AGP interface (Only support 1.5V on AGP interface).

- Downstream hub link for access to the ICH2.



I/O Controller Hub (ICH2)

The I/O controller Hub provides the I/O subsystem with access to the rest of

the system. Additionally, it integrates may I/O functions. The ICH integrates:

- Upstream hub link for access to the MCH

- 2 Channel Ultra ATA/33/66/100 Bus Master IDE controller

- USB controller

- SMBus controller

- FWH interface

- LPC interface

- PCI 2.2 interface

- Integrated System Management Controller

- Integrated LAN Controller



Firmware Hub (FWH)

The FWH component is a key element to enabling a new security and manage-

ability infrastructure for the PC platform. The device operates under the FWH

interface and protocol. The hardware features of this device include a unique a

Random Number Generator (RNG), register-based locking, and hardware-

based locking.

Introduction

Page 1-4

Intel Pentium 4 processors

Formally known as the Willamette, the PentiumTM 4 is the next generation IA-32

processor from Intel. This next generation design is based upon a new micro-

architecture that brings higher clock speeds and performance than previous

processors could deliver. Among other advanced features the Pentium 4 offers

Streaming SIMD extensions 2, Advanced Dynamic Execution, Hyper Pipelined

Technology, and a data transfer rate of 400MHz system bus.

Streaming SIMD Extensions 2

Building upon the foundations of core features of their previous line of proces-

sors the Pentium III, this new version introduces Streaming SIMD Extensions 2

technology commonly referred to as SSE2. But what does this mean? SIMD stands

for Single Instruction Multiple Data. Usually, processors process one data

element in one instruction, called Single Instruction Single Data, or SISD. In

contrast, with Single Instruction Single Data (SISD), SIMD has the ability to

process more than one piece of data element during one instruction.

This technology is useful for 3D graphics applications that handle considerable

amounts of floating-point numbers. With SIMD applications such as 3D graphics

will be able to processor more data per instruction when equates to better

performance. This technology adds 144 new instructions to the CPU core that can

be used in a wide variety of applications. Software programmers can for example,

take advantage of these new instructions and write more optimized code that take

advantage of newer SIMD double-precision floating-point, integer, and cache

ability instructions. In theory this will enable better next generation services such

as Interactive Digital TV to be produced.

Advanced Dynamic Execution

Advanced Dynamic Execution describes the improved implementation and

abilities over the older P6 processor line’s out-of-order decoupled super scalar

execution. Dynamic execution allows instructions to the processor to be executed

without the need to do so in order. The ability to do this can add a significant

performance increase versus ordered execution.

Hyper Pipelined Technology & 400MHz System Bus

Hyper Pipelined Technology doubles the pipeline depth the Pentium 4 delivers to

20 stages. This significantly increases the performance and frequency capabilities.

Pentium 4 also introduces a 400MHz system bus as opposed to the 100 and

Introduction

Page 1-5

133MHz bus seen in previous Pentium III processors. This allows 3.2Gbytes per

second of throughput while the Pentium III had a limited 1.06Gbyte/s throughput.

Willamette will reportedly be introduced in the 0.18-micron using aluminum.

For more information about all the cool new features the Pentium 4 deliv-

ers check out the Intel website at http://www.intel.com

Accelerated Graphics Port

(AGP or A.G.P.)

Typically, 3D graphics rendering requires a tremendous amount of memory, and

demands ever increasing throughput speed as well. As 3D products for the

personal computer become more and more popular, these demands will only

increase. This will cause a rise in costs for both end users and manufacturers.

Lowering these costs as well as improving performance is the primary motivation

behind AGP. By providing a massive increase in the bandwidth available between

the video card and the processor, it will assist in relieving some of these pressures

for quite sometime.

The board provides the AGP 2.0 interface. The AGP Interface Specification

revision 2.0 enhances the functionality of the original AGP Interface Specifica-

tion (revision 1.0) by allowing 4X data transfers (4 data samples per clock) and

1.5 volt (power supply) operation. The AGP 2.0 interface, along with SDRAM

memory technology, allows graphics controllers to access main memory at over

1GB/s. In order to match the 2X and 4X AGP Card. The board used the Universal

AGP connector. (1.5 volt AGP Card supports only).

Ultra ATA/66/100

The ICH2 provides two channel Ultra ATA/66/100 Bus Master IDE controllers,

that support Ultra ATA/66/100 protocols, perfect for such demanding applications

as real-time video, multimedia, and high performance operating system. A new

IDE cable is required for Ultra ATA/66/100. This cable is an 80 conductor cable;

however the connectors are, of course, backwards compatible with ATA/33.

Introduction

Page 1-6

Hardware Monitoring

Hardware monitoring allows you to monitor various aspects of your systems

operations and status. The features include CPU temperature, voltage and RPM of

fan.

Bandwidth Overview

Table 1 provides a summary of the bandwidth requirements for the Intel®845 chipset.

Table 1: Intel®845 platform Bandwidth Summary

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Introduction

Page 1-7

Mainboard Form-Factor

The board is designed with ATX form factor - the latest industry standard of

chassis. The ATX form factor is essentially a Baby-AT baseboard rotated 90

degrees within the chassis enclosure and a new mounting configuration for the

power supply. With these changes the processor is relocated away from the

expansion slots, allowing them all to hold full length add-in cards. ATX defines

a double height aperture to the rear of the chassis which can be used to host a

wide range of onboard I/O. Only the size and position of this aperture is

defined, allowing PC manufacturers to add new I/O features (e.g.; TV input, TV

output, joystick, modem, LAN, audio, etc.) to systems. This will help systems

integrators differentiate their products in the marketplace, and better meet your

needs.

• By integrating more I/O down onto the board and better positioning the

hard drive and floppy connectors material cost of cables and add-in cards is

reduced.

• By reducing the number of cables and components in the system, manufac-

turing time and inventory holding costs are reduced and reliability will

increase.

• By using an optimized power supply, it's possible to reduce cooling costs

and lower acoustical noise. An ATX or ATX12V power supply, which has a

side-mounted fan, allows direct cooling of the processor and add-in cards

making a secondary fan or active heatsink unnecessary in most system

applications.

PCI slots

Expandable I/O

Figure 2: Summary of ATX or ATX12V chassis features

CPU located near

Power Supply

Single chassis fan

for system

ATX12V power

connector

Floppy / IDE

connectors 51/4"

Bay

31/2"

Bay

ATX or

ATX12V

Power

Supply

AGP slot

ATX power

connector

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