EPOX EP-BX3 Bedienungsanleitung

TRADEMARK

All products and company names are trademarks or

registered trademarks of their respective holders.

These specifications are subject to change without

notice.

Manual Revision 1.0

November 18, 1998

EP-BX3EP-BX3

EP-BX3

A PentiumA Pentium

A Pentium®®

®®

®II or DeschutesII or Deschutes

II or DeschutesII or Deschutes

II or Deschutes

Slot1 Processor based AGPSlot1 Processor based AGP

Slot1 Processor based AGP

mainboard (100/66MHz)mainboard (100/66MHz)

mainboard (100/66MHz)

EP-BX3

Technical Support Services

If you need additional information, help during installation or normal use of this

product, please contact your retailer. If your retailer can not help, you may E-Mail us

with any questions at the following address [email protected]

Record your serial number before installing your EP-BX3 mainboard. (the serial

number is located near the ISA slots at the edge of the board)

EP-BX3 serial number:

__________________________

BIOS Upgrades

Please use either our Web Site or BBS for current BIOS Upgrades.

Internet Access

http://www.epox.com

http://www.epox.com.tw

[email protected]

Modem Access

31-182-618451 (The Netherlands)

You can access this number via a Hayes-compatible modem with a 2,400 to

28,800 baud rate. The following setup format is required:

8 Data Bits, No Parity, 1 Stop Bit.

If your modem is unable to connect at higher baud rates, try connecting at

2,400 baud before contacting Technical Support.

Thank you for using EPoX mainboards!

EP-BX3

User Notice

No part of this product, including the product and software may be reproduced,

transmitted, transcribed, stored in a retrieval system, or translated into any language

in any form by any means without the express written permission of EPoX Computer

Company (hereinafter referred to as EPoX) except documentation kept by the

purchaser for backup purposes.

EPoX provides this manual “as is” without warranty of any kind, either express or

implied, including but not limited to the implied warranties or conditions of merchant-

ability or fitness for a particular purpose. In no event shall EPoX be liable for any

loss or profits, loss of business, loss of use or data, interruption of business or for

indirect, special incidental, or consequential damages of any kind, even if EPoX has

been advised of the possibility of such damages arising from any defect or error in

the manual or product. EPoX may review this manual from time to time without

notice. For updated BIOS, drivers, or product release information you may visit

EPoX’s home page at: http://www.epox.com

Products mentioned in this manual are mentioned for identification purposes only.

Product names appearing in this manual may or may not be registered trademarks or

copyrights of their respective companies.

The product name and revision number are both printed on the mainboard

itself.

Handling Procedures

Static electricity can severely damage your equipment. Handle the EP-BX3

and any other device in your system with care and avoid unneccessary contact with

system components on the mainboard.

Always work on an antistatic surface to avoid possible damage to the motherboard

from static discharge.

We assume no responsibility for any damage to the EP-BX3 mainboard that results

from failure to follow installation instructions or failure to observe safety precautions.

CAUTION

TheEP-BX3mainboardissubjectto

damagebystaticelectricity. Always

observethehandlingprocedures.

EP-BX3

Table of Contents

Section 1 Introduction

ComponentsChecklist .................................... 1-1

Overview

PentiumIIorDeschutesProcessor.................. 1-2

S.E.C.CartridgeTerminology ......................... 1-3

AcceleratedGraphicsPort .............................. 1-4

HardwareMonitoring ..................................... 1-4

EP-BX3 Form-Factor .................................... 1-6

I/OShieldConnector...................................... 1-7

Power-On/Off(Remote)................................. 1-7

SystemBlockDiagram ................................... 1-8

Section 2 Features

EP-BX3 Features ........................................... 2-1

Section 3 Installation

EP-BX3DetailedLayout ................................ 3-2

Easy Installation Procedure

ConfigureJumpers .......................................... 3-3

SystemMemoryConfiguration ........................ 3-5

InstallingaPentium®IIProcessor .................... 3-9

DeviceConnectors ......................................... 3-10

ExternalModemRing-inPower ON and

Keyboard Power ON Function (KBPO) ........ 3-12

Section 4 Award BIOS Setup

BIOSInstructions ........................................... 4-1

Standard CMOS Setup .................................. 4-2

BIOS Features Setup ..................................... 4-3

ChipsetFeaturesSetup ................................... 4-8

EP-BX3

PowerManagement Setup .............................. 4-12

PNP/PCIConfiguration .................................. 4-16

LoadSetupDefaults ....................................... 4-18

IntegratedPeripherals ..................................... 4-18

Change Supervisor or User Password ............. 4-23

IDEHDDAutoDetection............................... 4-24

HDDLowLevelFormat................................. 4-26

Save&ExitSetup .......................................... 4-26

ExitWithoutSaving......................................... 4-26

Appendix

Appendix A

MemoryMap ................................................. A-1

I/O Map......................................................... A-1

Timer&DMAChannelsMap......................... A-2

InterruptMap ................................................. A-2

RTC & CMOS RAM Map ............................ A-3

Appendix B

POST Codes ................................................. A-5

UnexpectedErrors ......................................... A-8

Appendix C

LoadSetupDefaults ....................................... A-9

Appendix D

CPU Clock Frequency Selection In BIOS Setting

...................................................................... A-10

IntroductionEP-BX3

Page 1-1

Section 1

INTRODUCTION

Components Checklist

üü

üA. (1) EP-BX3 mainboard

üü

üB. (1) EP-BX3 user’s manual

üü

üC. (1) Floppy ribbon cable

üü

üD. (1) Hard drive ribbon cables

üü

üE. (1) Foldable Retention Module

F. (1) Heatsink Support Unit (Optional)

G. (1) PS/2 to AT keyboard connector adapter (optional)

üü

üH. (1) Bus master drivers

(1) USDM

USERS

MANUAL

EP-BX3

Top Half

Bottom Half

25 26

Introduction EP-BX3

Page 1-2

Overview

Pentium II or Deschutes Processor

The Pentium®II or Deschutes Processor (The Deschutes Processor as 300/

100MHz, 350/100MHz, 400/100MHz and 450/100MHz speed with 512K-L2 cache

Versions.) is the follow-on to the Pentium®Processor. The Pentium®II or

Deschutes Processor, like the Pentium®Pro processor, implements a Dynamic

Execution micro-architecture -- a unique combination of multiple branch prediction,

data flow analysis, and speculative execution. This enables the Pentium®II Proces-

sor to deliver higher performance than the Pentium®processor, while maintaining

binary compatibility with all previous Intel architecture processors.

A significant feature of the Pentium®II or Deschutes Processor, from a system

perspective, is the built-in direct multiprocessing support. In order to achieve

multiprocessing, and maintain the memory and I/O bandwidth to support it, new

system designs are needed. For systems with dual processors, it is important to

consider the additional power burdens and signal integrity issues of supporting

multiple loads on a high speed bus. The Pentium®II or Deschutes Processor card

supports both uni-processor and dual processor implementations.

The Pentium®II or Deschutes Processor utilizes Single Edge Contact (S.E.C.)

(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2 cache

to remain tightly coupled to the processor, while maintaining flexibility when imple-

menting high performance processors into OEM systems. The second level cache is

performance optimized and tested at the cartridge level. The S.E.C. cartridge utilizes

surface mounted core components and a printed circuit board with an edge finger

connection. The S.E.C. cartridge package introduced on the Pentium®II Processor

will also be used in future Slot 1 processors.

The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB

with an edge finger connection. The thermal plate allows standardized heatsink

attachment or customized thermal solutions. The thermal plate enables a reusable

heatsink to minimize fit issues for serviceability, upgradeability and replacement. The

full enclosure also protects the surface mount components. The edge finger connec-

tion maintains socketabilty for system configuration. The edge finger connector is

denoted as ‘Slot 1 connector’ in this and other documentation.

The entire enclosed product is called the Pentium®II or Deschutes Processor. The

IntroductionEP-BX3

Page 1-3

packaging technology and each of the physical elements of the product are referred

to using accurate technical descriptions. This allows clear reference to the products

as just a processor. This is the model used in past packaging technologies like PGA,

TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

• Pentium®II or Deschutes Processor

The new enclosed card packaging technology is called a “Single Edge

Contact cartridge.” This is similar to previous names for packaging

technology such as PGA or TCP.

• Processor card

The green PCB (with or without components on it)

• Processor core

The silicon on the PLGA package on the PCB

• Cover

The plastic cover on the opposite side from the thermal plate.

• Slot 1

The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro

processor uses Socket 8.

• Retention mechanism

Formerly ‘retention module’ the dual posts, etc. that holds the cartridge

in place.

• Thermal plate

The heatsink attachment plate.

• Heat sink supports

Figure 1: Pentium®II or Deschutes

Processor CPU with S.E.C. Cartridge

Processor

Printed Circuit Board

Thermal Plate

Cover

The support pieces that are

mounted on the mainboard

to provide added support for

heatsinks.

The L2 cache (TagRAM, PBSRAM)

components keep standard industry

names.

The Pentium®II or Deschutes Processor

is the first product to utilize the S.E.C.

cartridge technology and Slot 1

connector. Unless otherwise noted, any

references to “Pentium®II Processor,”

Introduction EP-BX3

Page 1-4

“Pentium®II or Deschutes Processor/Slot 1 processor” or “Deschutes Processor”

will apply to both the Pentium®II Processor desktop processors.

Accelerated Graphics Port

(AGP or A.G.P.)

Typically, 3D graphics rendering requires a tremendous amount of memory, and

demands ever increasing throughput speed as well. As 3D products for the personal

computer become more and more popular, these demands will only increase. This

will cause a rise in costs for both end users and manufacturers. Lowering these

costs as well as improving performance is the primary motivation behind AGP. By

providing a massive increase in the bandwidth available between the video card and

the processor, it will assist in relieving some of these pressures for quite sometime.

Hardware Monitoring

Hardware monitoring allows you to monitor various aspects of your systems opera-

tions and status. The features include CPU temperature, voltage and RPM of fan.

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