EPOX EP-6ZXM Bedienungsanleitung

TRADEMARK

All products and company names are trademarks or registered

trademarks of their respective holders.

These specifications are subject to change without notice.

Manual Revision 2.0

June 10, 1999

EP-6ZXMEP-6ZXM

EP-6ZXM

A PA P

A Pentiumentium

entiumentium

entium®®

®®

®II or PII or P

II or PII or P

II or Pentiumentium

entiumentium

entium®®

®®

®IIIIII

IIIIII

III

Slot1 Processor based AGPSlot1 Processor based AGP

Slot1 Processor based AGP

mainboard (100/66MHz)mainboard (100/66MHz)

mainboard (100/66MHz)

EP-6ZXM

User Notice

No part of this product, including the product and software may be reproduced,

transmitted, transcribed, stored in a retrieval system, or translated into any

language in any form without the express written permission of EPoX Computer

Company (hereinafter referred to as EPoX) except for documentation kept by the

purchaser for backup purposes.

We provide this manual “as is” without warranty of any kind, either expressed or

implied, including but not limited to the implied warranties or conditions of

merchantability or fitness for a particular purpose. In no event shall EPoX be

liable for any loss of profits, loss of business, loss of use or data, interruption of

business or for indirect, special incidental, or consequential damages of any kind,

even if EPoX has been advised of the possibility of such damages arising from any

defect or error in the manual or product. EPoX may revise this manual from time

to time without notice. For updated BIOS, drivers, or product release information

you may visit our websites at http://www.epox.com or http://www.epox.com.tw.

Products mentioned in this manual are mentioned for identification purposes only.

Product names appearing in this manual may or may not be registered trademarks

or copyrights of their respective companies. The product name and revision

number are both printed on the mainboard itself.

Handling Procedures

Static electricity can severely damage your equipment. Handle the EP-6ZXM and

any other device in your system with extreme care and avoid unnecessary contact

with system components on the mainboard. Always work on an antistatic surface

to avoid possible damage to the mainboard from static discharge. Always have the

power supply unplugged and powered off when inserting and removing devices

within the computer chassis. EPoX assumes no responsibility for any damage to

the EP-6ZXM mainboard that results from failure to follow instruction or failure

to observe safety precautions.

CAUTION

The EP-6ZXM mainboard is subject to

damage by static electricity. Always

observe the handling procedures.

EP-6ZXM

Technical Support Services

If you need additional information, help during installation or normal use of this

product, please contact your retailer. Your retailer will have the most current

information about your configuration. If your retailer cannot help, you may visit

our online technical support website and/or contact our support technicians at the

locations listed below.

Record your serial number before installing your EP-6ZXM mainboard. (The

serial number is located near the ISA slots at the edge of the board.)

EP-6ZXM serial number: _________________________________

Contacting Technical Support

EPoX technical support is working hard to answer all of your questions online.

From our website you can find answers to many common questions, drivers, BIOS

updates, tech notes, and important technical bulletins. If you are still unable to

locate the solution you are seeking, you always have the option to contact our

support technicians directly.

North American website (English language)

http://www.epox.com

[email protected]

European website (Multi-language)

http://www.epox.nl

[email protected]

Taiwan website (Chinese language)

http://www.epox.com.tw

[email protected]

Thank you for using EPoX mainboards!

EP-6ZXM

Table of Contents

Section 1 Introduction

Components Checklist ................................... 1-1

Overview

Pentium®II or Pentium®III Processor.......... 1-2

S.E.C. Cartridge Terminology ........................1-3

Accelerated Graphics Port............................. 1-4

Hardware Monitoring ..................................... 1-4

EP-6ZXM Form-Factor ................................. 1-5

I/O Shield Connector .....................................1-6

Power-On/Off (Remote)................................ 1-6

System Block Diagram...................................1-7

Section 2 Features

EP-6ZXM Features ........................................ 2-1

Section 3 Installation

EP-6ZXM Detailed Layout............................ 3-2

Easy Installation Procedure

Configure Jumpers ......................................... 3-3

System Memory Configuration ..................... 3-5

Installing a Pentium®II/III Processor............3-8

Device Connectors ......................................... 3-10

External Modem Ring-in Power ON and

Keyboard Power ON Function (KBPO) ........ 3-12

Section 4 Award BIOS Setup

BIOS Instructions ........................................... 4-1

Standard CMOS Setup ....................................4-2

BIOS Features Setup ...................................... 4-3

Chipset Features Setup................................... 4-9

Power Management Setup.............................. 4-13

PNP/PCI Configuration ................................. 4-18

Load Setup Defaults .......................................4-20

Integrated Peripherals .................................... 4-20

Change Supervisor or User Password ...........4-26

Page

EP-6ZXM

IDE HDD Auto Detection ..............................4-27

HDD Low Level Format.................................4-29

Save & Exit Setup ........................................... 4-29

Exit Without Saving........................................4-29

Section 5 PCI Sound

Driver Installation ..........................................5-1

Section 6 Appendix

Appendix A

Memory Map ..................................................A-1

I/O Map ........................................................... A-1

Timer & DMA Channels Map ........................A-2

Interrupt Map .................................................. A-2

RTC & CMOS RAM Map ...............................A-3

Appendix B

POST Codes.................................................... A-5

Unexpected Errors ......................................... A-8

Appendix C

Load Setup Defaults .......................................A-9

Appendix D

CPU Clock Frequency Selection In BIOS

Setting .............................................................A-11

EP-6ZXM

Page Left Blank

IntroductionEP-6ZXM

Page 1-1

Section 1

INTRODUCTION

Components Checklist

üü

üA. (1) EP-6ZXM mainboard

üü

üB. (1) EP-6ZXM user’s manual

üü

üC. (1) Floppy ribbon cable

üü

üD. (1) Hard driver ribbon cables

üü

üE. (1) Foldable Retention Module

F. (1) Heatsink Support Unit (Optional)

G. (1) PS/2 to AT keyboard connector adapter (optional)

üü

üH. (1) Bus master drivers

(1) USDM

USER’S

MANUAL

EP-6ZXM

Top Half

Bottom Half

Introduction EP-6ZXM

Page 1-2

Overview

Pentium®II or Pentium®III Processor

The Pentium®II or Pentium®III Processor (The Pentium®III Processor as 300/

100MHz, 350/100MHz, 400/100MHz and 450/100MHz speed with 512K-L2

cache Versions.) is the follow-on to the Pentium®Processor. The Pentium®II or

Pentium®III Processor, like the Pentium®Pro processor, implements a Dynamic

Execution micro-architecture -- a unique combination of multiple branch

prediction, data flow analysis, and speculative execution. This enables the

Pentium®II Processor to deliver higher performance than the Pentium®

processor, while maintaining binary compatibility with all previous Intel architec-

ture processors.

A significant feature of the Pentium®II or Pentium®III Processor, from a system

perspective, is the built-in direct multiprocessing support. In order to achieve

multiprocessing, and maintain the memory and I/O bandwidth to support it, new

system designs are needed. For systems with dual processors, it is important to

consider the additional power burdens and signal integrity issues of supporting

multiple loads on a high speed bus. The Pentium®II or Pentium®III Processor

card supports both uni-processor and dual processor implementations.

The Pentium®II or Pentium®III Processor utilizes Single Edge Contact (S.E.C.)

(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2

cache to remain tightly coupled to the processor, while maintaining flexibility

when implementing high performance processors into OEM systems. The second

level cache is performance optimized and tested at the cartridge level. The S.E.C.

cartridge utilizes surface mounted core components and a printed circuit board

with an edge finger connection. The S.E.C. cartridge package introduced on the

Pentium®II Processor will also be used in future Slot 1 processors.

The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB

with an edge finger connection. The thermal plate allows standardized heatsink

attachment or customized thermal solutions. The thermal plate enables a reusable

heatsink to minimize fit issues for serviceability, upgradeability and replacement.

The full enclosure also protects the surface mount components. The edge finger

connection maintains socketabilty for system configuration. The edge finger

connector is denoted as ‘Slot 1 connector’ in this and other documentation.

IntroductionEP-6ZXM

Page 1-3

The entire enclosed product is called the Pentium®II or Pentium®III Processor.

The packaging technology and each of the physical elements of the product are

referred to using accurate technical descriptions. This allows clear reference to

the products as just a processor. This is the model used in past packaging tech-

nologies like PGA, TCP, PQFP, DIP, etc.

S.E.C. Cartridge Terminology

• Pentium®II or Pentium®III Processor

The new enclosed card packaging technology is called a “Single Edge

Contact cartridge.” This is similar to previous names for packaging

technology such as PGA or TCP.

• Processor card

The green PCB (with or without components on it)

• Processor core

The silicon on the PLGA package on the PCB

• Cover

The plastic cover on the opposite side from the thermal plate.

• Slot 1

The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro

processor uses Socket 8.

• Retention mechanism

Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in

place.

• Thermal plate

The heatsink attach-

ment plate.

• Heat sink supports

The support pieces that

are mounted on the

mainboard to provide

added support for

heatsinks. Figure 1: Pentium®II/III Processor CPU

with S.E.C.C. or S.E.C.C.2 Package

Pentium®II Processor

in an S.E.C.C. Package Pentium®III Processor

in an S.E.C.C.2 Package

Introduction EP-6ZXM

Page 1-4

The L2 cache (TagRAM, PBSRAM) components keep standard industry names.

The Pentium®II or Pentium®III Processor is the first product to utilize the S.E.C.

cartridge technology and Slot 1 connector. Unless otherwise noted, any refer-

ences to “Pentium®II Processor,” “Pentium®II or Pentium®III Processor/Slot 1

processor” or “Pentium III Processor” will apply to both the Pentium®II Proces-

sor desktop processors.

Accelerated Graphics Port

(AGP or A.G.P.)

Typically, 3D graphics rendering requires a tremendous amount of memory, and

demands ever increasing throughput speed as well. As 3D products for the

personal computer become more and more popular, these demands will only

increase. This will cause a rise in costs for both end users and manufacturers.

Lowering these costs as well as improving performance is the primary motivation

behind AGP. By providing a massive increase in the bandwidth available between

the video card and the processor, it will assist in relieving some of these pres-

sures for quite sometime.

Hardware Monitoring

Hardware monitoring allows you to monitor various aspects of your systems

operations and status. The features include CPU temperature, voltage and RPM

of fan.

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