HRS Hirose IT3 Kurzanleitung

IT3/IT5

Connector System

SSEMBLY

OTES

Document Number:

ETAD-F0458

Revision 3.10

Hirose IT3/IT5 ™

Connector System

ENERAL

NFORMATION

ESIGN

OTES

PWB

SSEMBLY

OTES

IPS FOR

SMT

SSEMBLY

YSTEM

SSEMBLY

YSTEM

ISASSEMBLY

Winner of 2009 SMT V

ision

Award

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IT3/IT5

Connector System

ABLE OF

ONTENTS

Document Number:

ETAD-F0458

Revision 3.10

Page i

Section Title Page

1.0 Introduction 1

1.1

Purpose 1

1.2

Scope 1

1.3

Applica tion and nterpreta tion 2

2.0 General Information 3

2.1

Component Weights 4

2.2

Differences between T3 and T5 Connector Pa rts 8

2.3

Pa rt Number Designation 9

2.4

Manufacturing Lot Number 10

2.5

Receptacle General Dimensions 11

3.0 PWB Design Information 12

3.1

Component Footprint 13

3.2

Multi -Connector Sys tems 18

3.3

Spacers 19

3.4

Clea rance Between Connectors 20

3.5

nterposer Di rection 22

3.6

Alignment Tolerances 23

4.0 Introduction to Assembly 24

5.0 Stencil Printing 24

5.1

Solder Pas te Selection 24

5.2

Stencil Design 25

5.3

Effect of Alignment 25

5.4

Pas te Print Quality 26

6.0 Pick and Place 27

6.1

Pa ckaging 27

6.2

Media Tra ys 28

6.3

Pre-bake 29

6.4

Pi ck Point 29

6.5

Component Weight 30

6.6

Vision a nd Alignment 30

6.7

Pla cement Force 31

6.8

Orienta tion ndicator 31

7.0 Reflow Processing 32

7.1

nstrumentation 32

7.2

Thermocouple Atta chment 32

7.3

Reflow Profile Considera tions 33

7.4

Suggested Thermal Profile Ranges 33

7.5

Other mportant Fa ctors 33

7.6

Nitrogen Envi ronment 34

7.7

Double Sided Reflow 34

7.8

Mi xing Tin-Lead and Lead-Free 34

Nov.1.2022Copyright2022HIROSEELECTRICCO.,LTD.AllRightsReserved.

IT3/IT5

Connector System

ABLE OF

ONTENTS

Document Number:

ETAD-F0458

Revision 3.10

Page ii

7.9

Al ternati ve Alloys 35

7.10

Metal Cap Removal 35

8.0 Cleaning 37

8.1

Water Washable Solder Process 37

8.2

Saponi fiers 38

8.3

No-Clean Solder Process 38

8.4

Cleanliness Testing 39

9.0 Inspection 40

9.1

Sampling Frequency 40

9.2

X-Ra y La minography 40

9.3

Visual nspection 40

9.4

X-Ra y Analysis and Voiding 41

9.5

Trans mission 2-Dimensional X-Ra y 41

9.6

Automa tic nspection Optimization 42

10.0 Rework 43

10.1

Equipment and Supplies 43

10.2

Profiling 43

10.3

Reflow Profile Considera tions 44

10.4

Suggested Thermal Profiles 44

10.5

Special Profiling Considera tions 45

10.6

Receptacle Removal 45

10.7

Site Redressing 46

10.8

Solder Replenishment 48

10.9

Receptacle Repla cement 48

10.10

Reflow Soldering 49

10.11

nspection 49

10.12

Rework Solder Paste Selection 49

11.0 Tips for SMT Assembly 51

11.1

Stencil Printing 51

11.2

Pi ck and Place 55

11.3

Reflow 56

11.4

X-Ra y nspection 58

11.5

Rework 59

12.0 System Level Assembly 62

12.1

nterposer nstallation 62

12.2

Manual Assembly 64

12.3

nstallation Cap 65

12.4

Assembly Fi xturing 66

13.0 System Level Disassembly 70

13.1

Daughter ca rd removal 70

13.2

nterposer Assembly removal 71

Nov.1.2022Copyright2022HIROSEELECTRICCO.,LTD.AllRightsReserved.

IT3/IT5

Connector System D

OCUMENT

ISTORY

Document Number:

ETAD-F0458

Revision 3.10

Page iii

Revision

No. Description (Major changes) Date

1.0 nitial release April 6, 2009

1.1 Revised spacer and nut ti ghteni ng information May 18, 2009

1.2 Revised information on 300 positi on receptacles to

include metal stiffening ca p

August 26, 2009

1.5 Revised sta ck height cha rts , press force informa tion and

other informa tion wi th respect to design note release

November 30,

2009

1.55 Updated the front page and revised information on

footprint

December 30,

2009

1.56 Updated rework a nd packaging information December 13,

2010

1.6 Updated height va ria tion chart and interposer

installation cap

February 24,

2011

2.0 ncluded information on plugs and an interposer removal

tool

May 1, 2011

3.0 ntegra ted T5 information July 15, 2011

3.10 ncluded T5H informati on May 21, 2012

Nov.1.2022Copyright2022HIROSEELECTRICCO.,LTD.AllRightsReserved.

IT3/IT5

Connector System G

ENERAL

NFORMATION

Document Number:

ETAD-F0458

Revision 3.10

Page 1 of 73

Hirose IT3 connector assembly Hirose IT5 connector assembly

The Hirose IT3/IT5 connector system is a three-piece mezzanine connector. Process-friendly BGA

receptacles are assembled onto P Bs, and separate, configurable interposers complete the

connections between circuit boards. It is available in 100, 200 and 300 signal model. IT3 is

available with tin-lead or lead-free alloy solder balls and IT5 is available in lead-free alloy solder

balls.

1.1 Purpose

This technical bulletin is intended to provide basic information and product features of the

irose IT3/IT5 BGA connector system. By providing this information, irose believes it can help

its customers to speed product development, improve quality and reliability, and limit overall

system costs.

1.2 Scope

This guideline provides information useful for applications using the IT3/IT5 BGA connector

system. It provides information pertaining to:

a) General overview of the connector system

b) Configuration and part numbering

c) PWB design

d) Assembly processing, inspection and repair

This document will be updated by irose as required to reflect current technologies and

manufacturing capabilities.

Section 1 Introduction

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IT3/IT5

Connector System G

ENERAL

NFORMATION

Document Number:

ETAD-F0458

Revision 3.10

Page 2 of 73

1.3 Application and Interpretation

This technical bulletin is intended to offer only general guidance and design concepts to

customers. Therefore, it does not limit customer designs nor guarantee results under all

situations. Development of actual designs is the responsibility of each customer. Customers

should consult with irose regarding their specification, when, or if, any questions arise relating

to these guidelines. Use of this technical bulletin is at customer’s sole risk. This bulletin is

provided

“AS IS”

and without warranty of any kind and irose

EXPRESSLY DISCLAIMS ALL

ARRANTIES, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO THE IMPLIED ARRANTIES OF

MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. HIROSE DOES NOT ARRANT THAT THE

GUIDELINES CONTAINED IN THIS BULLETIN ILL MEET ANY CUSTOMER’S REQUIREMENTS.

FURTHERMORE, HIROSE DOES NOT ARRANT OR MAKE ANY REPRESENTATIONS REGARDING THE USE

OR THE RESULTS OF THE USE OF INFORMATION CONTAINED IN THIS BULLETIN IN TERMS OF

CORRECTNESS, ACCURACY, RELIABILITY, OR OTHER ISE. UNDER NO CIRCUMSTANCE SHALL HIROSE OR

ITS DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INCIDENTAL, SPECIAL OR

CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF BUSINESS, LOSS OF PROFITS, BUSINESS

INTERRUPTION, LOSS OF BUSINESS INFORMATION AND THE LIKE) ARISING OUT OF THE USE OF THE

INFORMATION CONTAINED IN THIS BULLETIN.

Nov.1.2022Copyright2022HIROSEELECTRICCO.,LTD.AllRightsReserved.

IT3/IT5

Connector System G

ENERAL

NFORMATION

Document Number:

ETAD-F0458

Revision 3.10

Page 3 of 73

Hirose’s IT3/IT5 connector system is designed to provide modular high-speed differential,

single-ended and power connections between two parallel boards. The interconnection to the

P Bs utilizes process-friendly Ball Grid Array receptacles, while the stacking height of 15 to

40mm for IT3 and 18 to 40mm for IT5 is set by an impedance-controlled interposer that is added

at the system level.

The IT3/IT5 connector system consists of two receptacles and one interposer. The receptacles

have low profiles and open bodies. The BGA balls are mounted on compliant pins and are set on

a staggered grid of 1.5 and 1.75 mm pitch. Both the mating and mounting receptacles’

footprints are compatible with popular mezzanine connectors. Receptacles are available in tin-

lead and lead-free configurations for IT3 and lead-free for IT5. They can be used in no-clean or

water-wash assembly processes.

The interposer is an assembly consisting of individual wafers, each carrying 10 signal and 9

ground connections for IT3, and 10 signal and 11 ground connections for IT5. The interposer is

mounted to the receptacles and locked in with mechanical latches to create highly reliable and

stable mechanical and electrical connections. IT3 and IT5 interposers and receptacles are

interchangeable.

Section

2 General Information

Mating

receptacle

Interposer

assembly

Mating Side

Mounting

receptacle

Mounting Side

Interposer for

IT5

Signal

Ground

Signal / Ground Configuration

Interposer for

IT3

Signal

Ground

Signal / Ground Configuration

IT3D

***S

BGA(**)

IT3M

***S

BGA(**)

IT5

***S

BGA(**)

IT5*

***S

BGA(**)

Polarity

Nov.1.2022Copyright2022HIROSEELECTRICCO.,LTD.AllRightsReserved.

IT3/IT5

Connector System G

ENERAL

NFORMATION

Document Number:

ETAD-F0458

Revision 3.10

Page 4 of 73

2.1 Component Weights

IT3 D-300S-BGAIT3 D-100S-BGA

Contact Positions Part Number eight

100

(100 signals/90 grounds)

IT3D-100S-BGA(**)

2.5 g

200

(200 signals/180 grounds)

IT3D-200S-BGA(**)

4.7 g

300

(300 signals/270 grounds)

IT3D-300S-BGA(**)

9.0 g

IT3 M-100S-BGA IT3 M-300S-BGA

Contact Positions Part Number eight

100

(100 signals/90 grounds)

IT3M-100S-BGA(**)

2.5 g

200

(200 signals/180 grounds)

IT3M-200S-BGA(**)

4.7 g

300

(300 signals/270 grounds)

IT3M-300S-BGA(**)

9.1 g

Contact Positions Part Number eight

100

(100 signals/110 grounds)

IT5D-100S-BGA(**)

2.7 g

200

(200 signals/220 grounds)

IT5D-200S-BGA(**)

5.2 g

300

(300 signals/330 grounds)

IT5D-300S-BGA(**)

9.9 g

* Receptacle will accept any available stacking height

IT3 Mating

eceptacle

IT3

Mounting

eceptacle

* Receptacle will

accept any available

stacking height

* Receptacle will

accept any available

stacking height

IT5 Mating

eceptacle

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IT3/IT5

Connector System G

ENERAL

NFORMATION

Document Number:

ETAD-F0458

Revision 3.10

Page 5 of 73

Contact Positions Part Number eight

100

(100 signals/110 grounds)

IT5HD-100S-BGA(**)

3.5 g

200

(200 signals/220 grounds)

IT5HD-200S-BGA(**)

6.7 g

300

(300 signals/330 grounds)

IT5HD-300S-BGA(**)

12.8 g

* Receptacle will accept any available stacking height

Contact Positions Part Number eight

100

(100 signals/110 grounds)

IT5M-100S-BGA(**)

2.7 g

200

(200 signals/220 grounds)

IT5M-200S-BGA(**)

5.2 g

300

(300 signals/330 grounds)

IT5M-300S-BGA(**)

9.9 g

* Receptacle will accept any available stacking height

Contact Positions Part Number eight

100

(100 signals/110 grounds)

IT5HM-100S-BGA(**)

3.5 g

200

(200 signals/220 grounds)

IT5HM-200S-BGA(**)

6.7 g

300

(300 signals/330 grounds)

IT5HM-300S-BGA(**)

12.8 g

* Receptacle will accept any available stacking height

IT5

Mounting

eceptacle

IT5 +1mm

Mating

eceptacle

IT5 +1mm

Mounting

eceptacle

IT3/IT5

Connector System G

ENERAL

NFORMATION

Document Number:

ETAD-F0458

Revision 3.10

Page 6 of 73

* Components listed in gray letters are under development

IT3/IT5

Interposer

IT3

/IT5

100P

IT3

/IT5

200

IT3

/IT5

300P

IT3/IT5

100P

IT3/IT5

200P

IT3/IT5

300P

IT3 Interposer Height Variation

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