Panasonic DMRE100HP Bedienungsanleitung

ORDERNO.DSD0307011C7

B24

DVDVideoRecorder

DMR-E100HP/ DMR-E100HPC/ DMR-E100HPL

Colour

(S).......................SilverType

SPECIFICATIONS

Specifications

Powersupply: AC120 V, 60 Hz

Powerconsumption: 42 W

Recording system: DVDvideo recording

standards(DVD-RAM),

DVDvideo standards(DVD-

Optical pick-up: System with 1lens, 2

integration units(662 nm

wavelength forDVDs, 790

nmwavelength forCDs)

Recordablediscs: 12 cm 4.7GBDVD-RAM

discs

12 cm 9.4GBDVD-RAM

discs

8cm 2.8GBDVD-RAMdiscs

12 cm 4.7GBDVD-Rdiscs

(forGeneral Ver. 2.0)

8cm 1.4GBDVD-Rdiscs

(forGeneral Ver. 2.0)

Recording time: Max. 6hours

(Using 4.7GBdisc): XP:60 minutes

SP:120 minutes

LP:240 minutes

EP:360 minutes

(Using built-in HDD): Max. 160 hours

XP:26 hours

SP:52 hours

LP:104 hours

EP:160 hours

(HDD capacity120GB)

Region number: Region No.1

Discs played: 12 cm 4.7GBDVD-RAM

discs

12 cm 9.4GBDVD-RAM

discs

8cm 2.8GBDVD-RAMdiscs

12 cm 4.7GBDVD-Rdiscs

(forGeneral Ver. 2.0)

8cm 1.4GBDVD-Rdiscs

(forGeneral Ver. 2.0)

DVD-VIDEOdiscs

CD-Audio discs (CD-DA)

Video CDdiscs

DVD-Audio discs

CD-R/ CD-RW discs

(CD-DA, Video CD, MP3

formatted discs)

Video system

TVsystem: NTSCsystem, 525 lines, 60

fields

Recording system: MPEG2(Hybrid VBR)/

MPEG4

Input: LINE(pin jack)x3, 1.0Vp-p;

Sconnectorx3

Y:1.0Vp-p;75

C:0.286 Vp-p;75

Output: LINE(pin jack)x2, 1.0Vp-p;

Sconnectorx2

Y:1.0Vp-p;75

C:0.286 Vp-p;75

Componentvideo output(480p/

480i): Y:1.0Vp-p;75

PB:0.7Vp-p;75

PR:0.7Vp-p;75

D-connectoroutput: Notprovided

Antennareception input: TVChannel:2ch-69ch, 75

CATVChannel:1ch-125ch,

RF converteroutput: Notprovided

Audio system

Recording system: DolbyDigital (XP/SP/LP/EP)

LINEARPCM(XPmodeonly)

Input: LINE(pin jack)x3

Reference input: 309 mVrms

FS: 2Vrms (1kHz, 0dB)

Inputimpedance:47 k

Output: LINE(pin jack)x2

Reference output: 309

mVrms

FS: 2Vrms (1kHz, 0dB)

Outputimpedance:1k

(Load impedance:10 k )

Numberofchannels: Recording:2channels

Playback:2channels

Otherinput/outputconnectors: Digital audio optical output

connector(PCM, Dolby

Digital, DTS)

Driveunit: High Speed Drive

Card unit:

@JPEG

Card Slot: SDmemorycard/ PCCard

Type U

CompatibleMedia: SDmemorycard, APCCard

adaptorconforming to PC

Card StandardsATAFlash

PCCard, PCCard Adaptor

(SDmemoryCard,

MultiMediaCard, Compact

Flash, SmartMedia, Memory

Stick, XDpicturecard, Micro

drive),MobileHDD

Format: FAT12, FAT16

ImageFormat: JPEGDCF (Design rulefor

camerafileSystem)

(subsampling:4:2:2or4:2:0)

TIFF (Uncompressed RGB

chunky)

DPOF CompatibleNumberof

Pixels320x240-6144x4196

Thawing Time: Approx. 7sec (2Mpixels)

ASDVideo (MPEG4)

Card Slot: SDmemorycard/ PCCard

Type U

CompatibleMedia: SDmemorycard, Multi

mediacard, (SDslotonly)

MobileHDD (PCslotonly,

read only)

Video recording system: MPEG4conforming

Numberofpixels: superfine/ fine320x240

(QVGA)normal/ economy

176x144 (QCIF)

Video transferrate: superfine1050kbps, fine

430kbps, normal 300kbps,

economy100kbps

Audio recording system: G.726 conforming

Audio transferrate: 32kbps

BSDVideo (MPEG2) *AfterVRconversion and

transferto HDD, the

playback ispossible.

Card Slot: SDmemorycard

CompatibleMedia: SDmemorycard, Multi

mediacard, (SDslotonly),

MobileHDD (PCslotonly

read only)

Format: MPEG2(SD-Video

EntertainmentVideo Profile)

(VRconversion and transfer

to HDD only)

DVInput: IEEE1394 Standard, 4pin

Dimensions: Approx.

430 (W)×79 (H)×296 (D)mm

[Approx. 1615 /16 “(W)×31/8

”(H)×1111 /16 ”(D)]

(excludingprotrusions)

Mass: Approx. 5.5kg (12.13 lbs)

Operating temperaturerange: 5 °C-40°C(41 °F-104 °F)

Operating humidityrange: 10 %-80 %RH(no

condensation)

Clock unit: Quartz-controlled 12-hour

digital display

LASERSpecification

Class I LASERProduct

Wavelength: 775-815 nm655-666 nm

Laserpower: No hazardousradiation is

emitted with thesafety

protection.

Powerconsumption in standbymode:

approx. 3.5W

Solder:

Thismodel uses lead free solder(PbF).

Notes:

Mass and dimensionsareapproximate.

Specificationsaresubjectto changewithoutnotice.

Notes:

ThepartofDVDRAMDrive(VXY1789)islisted separately.

Please referto ORDERNO. RAM0307003C0.

Unauthorizedcopying and distribution isaviolation oflaw.

1. SAFETYPRECAUTIONS

1.1. GENERALGUIDELINES

1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit

isfound, replace all parts whichhavebeenoverheatedor

damagedbytheshortcircuit.

2. Afterservicing, see toitthat all theprotectivedevices suchas

insulation barriers, insulation papersshieldsareproperlyinstalled.

3. Afterservicing, make thefollowing leakagecurrentchecks to

preventthecustomerfrombeing exposedtoshock hazards.

1.1.1. LEAKAGE CURRENTCOLDCHECK

1. Unplug theACcordand connect ajumperbetweenthetwoprongs

on theplug.

2. Measuretheresistance value, withanohmmeter, betweenthe

jumperedACplug and eachexposedmetalliccabinet parton the

equipmentsuchas screwheads, connectors, control shafts, etc.

Whentheexposedmetallicparthas areturnpathtothechassis,

thereading shouldbebetween1M and 5.2M . / Whenthe

exposedmetal does nothaveareturnpathtothechassis, the

reading must be . Figure1

1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)

1. Plug theACcorddirectlyintotheACoutlet. Donotuse an

isolation transformerforthischeck.

2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F

capacitors, betweeneachexposedmetallicparton theset and a

good earthground suchas awaterpipe, as shownin Figure 1.

3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to

measurethepotential across theresistor.

4. Check eachexposedmetallicpart, and measurethevoltageat

eachpoint.

5. Reverse theACplug intheACoutlet and repeat eachoftheabove

measurements.

6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A

leakagecurrenttester(Simpson Model 229 orequivalent) maybe

usedtomake thehotchecks, leakagecurrentmu3st notexceed1/

2milliamp. Incase ameasurementisoutsideofthelimits

specified, thereisapossibilityofashock hazard, and the

equipmentshouldberepairedand recheckedbeforeitisreturned

tothecustomer.

2. PREVENTIONOFELECTRO STATICDISCHARGE

(ESD) TO ELECTROSTATICALLYSENSITIVE (ES)

DEVICES

Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical

ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"

components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of

componentdamagecausedbyelectro staticdischarge(ESD).

1. Immediatelybeforehandling anysemiconductorcomponentor

semiconductor-equippedassembly, drainoff anyESDon your

bodybytouching aknownearthground. Alternatively, obtainand

wearacommerciallyavailabledischarging ESDwrist strap,

whichshouldberemovedforpotential shock reasonspriorto

applying powertotheunitundertest.

2. Afterremoving anelectrical assemblyequippedwithES devices,

place theassemblyon aconductivesurface suchas alminumfoil,

topreventelectrostaticchargebuildup orexposureofthe

assembly.

3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES

devices.

4. Use onlyananti-staticsolderremoval device. Somesolder

removal devices notclassifiedas "anti-static(ESDprotected)"can

generate electrical chargesufficienttodamageES devices.

5. Donotuse freon-propelledchemicals. These cangenerate

electrical charges sufficienttodamageES devices.

6. DonotremoveareplacementES device fromits protective

packageuntil immediatelybeforeyou arereadytoinstall it. (Most

replacementES devices arepackagedwithleadselectrically

shortedtogetherbyconductivefoam, alminumfoil or

comparableconductivematerial).

7. Immediatelybeforeremoving theprotectivematerial fromthe

leadsofareplacementES device, touchtheprotectivematerial to

thechassisorcircuitassemblyintowhichthedevice will be

installed.

Caution

Besureno powerisappliedtothechassisorcircuit, and observe

all othersafetyprecautions.

8. Minimizebodilymotionswhenhandling unpackagedreplacement

ES devices. (Otherwise hamless motion suchas thebrushing

togetherofyourclothes fabricorthelifting ofyourfootfroma

carpetedfloorcangenerate staticelectricity(ESD)sufficient

todamageanES device).

3. Precaution of LaserDiode

4. Howtoreplace the LithiumBattery

REPLACEMENTPROCEDURE

1. RemovetheTop coverand DVD-RAMdriveunitwithMainP.C.B.

byreferring theDisassembling Procedure.

2. UnsoldertheLithiumBatteries:B7501 and thenreplace itintonew

one.

(Asshownin15.2.1. TheMainP.C.B. )

NOTE:

Thelithium batteryisacritical component. (TypeNo.:CR2032-1GUFManufacturedby

Panasonic. )

Itmustneverbesubjectedtoexcessive heator discharge.

Itmustthereforeonlybefittedinequipmentdesignedspecificallyfor itsuse.

Replacementbatteries mustbeofthesametypeand manufacture.

They mustbefittedinthesamemannerand location as theoriginal battery, withthecorrect

polaritycontactsobserved.

Donotattempttore-chargetheoldbatteryor re-use itfor anyotherpurpose.

Itshouldbedisposedofinwasteproductsdestinedfor burial ratherthanincineration.

5. Handling the Lead-free Solder

5.1. Aboutleadfree solder(PbF)

Distinction ofPbF P.C.B.:

P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.

Caution:

-Pbfree solderhas ahighermelting pointthanstandardsolder;

Typicallythemelting pointis50 -70°F(30 -40°C)higher. Please

use ahigh temperaturesoldering iron. Incase ofthesoldering iron

withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).

-Pbfree solderwill tend tosplashwhenheatedtoo high (about

1100°F/600°C).

-Whensoldering orunsoldering, please completelyremoveall ofthe

solderon thepinsorsolderarea, and besuretoheat thesoldering

points withthePbfree solderuntil itmelts enough.

6. Service Explorer

TheService Explorerprovides information aboutall possiblecauses basedon thesymptomsand

gives stepbystepinstructionsmaking parts. Itconsistsoftwoparts, basedon applications:the

firstisthe“Service ExplorerExpress”andthesecond is“Service ExplorerinDetail”.

1. Fordetailsabouttheservice / test modesetting mentionedinthe

description, refertothe“List ofvariousmodes”.

-Service modesetting:Whilethepowerisoff, press TIMESLIP,

STOP, and OPEN/ CLOSE simultaneouslyforfiveseconds.

-Process mode1setting:Whilethepowerisoff, press SKIP(R),

TIMESLIP, and OPEN/ CLOSE simultaneouslyforfive

seconds.

2. Fordisassemblyand replacementprocedures, refertothe

“Assembling and Disassemling”.

6.1. Service ExplorerExpress

Thefollowing stepsallowyou tocheck eachblock separately(HDD, UARTP.C.B., Digital P.C.B.,

RAMdrive, Main/ PowerSupply/ FrontP.C.B.).

Itemsneeded:RAMdrive, Digital P.C.B., Digital extension cable, Remotecontrol HDD, UART

P.C.B..

Conditions:Nothing special.

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