Panasonic Schottky Barrier Diodes MA24D70 Bedienungsanleitung

Schottky Barrier Diodes (SBD)

Publication date: July 2008 SKH00225AED 1

This product complies with the RoHS Directive (EU 2002/95/EC).

MA24D70

Silicon epitaxial planar type

For rectiﬁcation

Overview

MA24D70 is optimal for general circuit supplies.

Features

Forward current (Average) IF(AV) = 5.0 A rectiﬁcation is possible5.0 A rectiﬁcation is possible5.0 A rectiﬁcation is possible

Low forward voltage VFand good rectiﬁcation efﬁciency

Absolute Maximum Ratings Ta= 25°C

Parameter Symbol Rating Unit

Reverse voltage VR35 V

Maximum peak reverse voltage VRM 35 V

Forward current (Average) *1IF(AV) 5.0 A

Non-repetitive peak forward surge current

*2IFSM 60 A

Junction temperature Tj150 °C

Storage temperature Tstg -40 to +150 °C

Note) *1: Lead temperature: Tl = 80°C, DC wave on

*2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)

Electrical Characteristics Ta= 25°C±3°C

Parameter Symbol Conditions Min Typ Max Unit

Forward voltage VF

IF= 3.0 A 0.43 0.48 V

IF= 5.0 A 0.49 0.55

Reverse current IRVR= 35 V 0.3 mA

Terminal capacitance CtVR= 10 V, f = 1 MHz 110 pF

Reverse recovery time *1trr

IF= IR= 100 mA, Irr = 10 mA,

RL= 100 W32 ns

Thermal resistance (j-a) Rth(j-a)

Mounted on an alumina PC board *260

°C/W

Mounted on a glass epoxy PC board *3220

Thermal resistance (j-l) Rth(j-l) 10 °C/W

Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.

2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of current

from the operating equipment.

3. *1: trr measurement circuit

Bias Application Unit (N-50BU)

90%

Pulse Generator

(PG-10N)

Rs= 50 Ω

Wave Form Analyzer

(SAS-8130)

Ri= 50 Ω

tp= 2 µs

tr= 0.35 ns

δ = 0.05

IF= IR= 100 mA

RL= 100 Ω

10%

Input Pulse Output Pulse

Irr = 10 mA

trtp

trr

*2: Mounted on an alumina PC board (Board: 50 mm ×50 mm ×0.8 mm, Soldering land:1.4 mm ×2.1 mm)

*3: Mounted on an alumina PC board (Board: 50 mm ×20 mm ×1.0 mm, Soldering land: 2.0 mm ×2.0 mm + 20 mm ×0.8 mm)

Package

Code

TMinP2-F1

Pin Name

1: Anode

2: Cathode

Marking Symbol: 5M

MA24D70

2SKH00225AED

This product complies with the RoHS Directive (EU 2002/95/EC).

PR(AV) VRPF(AV) IF(AV) Rth t

10−3

10−2

0 0.2 0.4 0.6

10−1

104

103

102

MA24D70_ IF-VF

Forward current IF(mA)

Forward voltage VF(V)

Ta= 150°C

125°C

25°C

75°C

−20°C

0 10 20 30 40

10−4

10−3

10−2

10−1

102

Reverse voltage VR(V)

Reverse current IR(mA)

MA24D70_IR-VR

Ta= 150°C

75°C

125°C

25°C

−20°C

100

200

300

400

500

0 10 40

MA24D70_Ct-VR

Ta= 25°C

f= 1 MHz

Reverse voltage VR(V)

Terminal capacitance Ct(pF)

0 10 20 30 40

MA24D70_ PR(AV)-VR

Reverse voltage VR(V)

Reverse power dissipation (Average) PR(AV) (mW)

0.5

0.8

0.9

0.8

1.6

2.4

0 2 4 6 8

MA24D70_PF(AV)-IF(AV)

Forward current (Average) IF(AV) (A)

Forward power dissipation (Average) PF(AV) (W)

0.5

0.2

0.1

10−3110−1

10−210 102103

MA24D70_Rth-t

Time t (s)

Thermal resistance Rth (°C/W)

10−1

103

102

Alumina board

50 mm ×50 mm, t = 0.8 mm,

land

1.4 mm ×2.1 mm

Glass epoxy board

50 mm ×20 mm, t = 1 mm,

land

2.0 mm ×2.0 mm + 2.0 mm ×0.8 mm

0 40

160120

Ambient temperature Ta(°C)

Forward current (Average) IF(AV) (A)

tp/ T

0.5

0.2

0.1

MA24D70_IF(AV)-Ta

Tj= 150°C

VR= 20 V

Mounted on an alumina PC board

Copper foil: 2.0 mm ×2.0 mm

IF(AV) Ta

IFVFIRVRCtVR

MA24D70

SKH00225AED 3

This product complies with the RoHS Directive (EU 2002/95/EC).

TMiniP2-F1 Unit: mm

2.40 ±0.10 0.15 ±0.05

1.75 ±0.05

3.80 ±0.050.45 ±0.05

4.70 ±0.10

0 to 0.40

0to0.03

0.9max.

5°

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products, and no license is granted under any intellectual property right or other right owned by our company or any other

company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other

company which may arise as a result of the use of technical information described in this book.

(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office

equipment, communications equipment, measuring instruments and household appliances).

Consult our sales staff in advance for information on the following applications:

–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-

ucts may directly jeopardize life or harm the human body.

–Any applications other than the standard applications intended.

(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita

Electric Industrial Co., Ltd.

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