Texas Instruments DAC8574 Bedienungsanleitung

DAC8574 Evaluation Module

June 2003 Data Acquisition - Digital/Analog Converters

User’s Guide

SLAU109

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

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Mailing Address: Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

EVM IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION

PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided

may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective

considerations, including product safety measures typically found in the end product incorporating the goods.

As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic

compatibility and therefore may not meet the technical requirements of the directive.

Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned

within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE

WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,

IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY

PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user

indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products

received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction

of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic

discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE

TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not

exclusive.

TI assumes no liability for applications assistance, customer product design, software performance, or

infringement of patents or services described herein.

Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM

User’s Guide prior to handling the product. This notice contains important safety information about temperatures

and voltages. For further safety concerns, please contact the TI application engineer.

Persons handling the product must have electronics training and observe good laboratory practice standards.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any

machine, process, or combination in which such TI products or services might be or are used.

Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input and output voltage ranges described in the

EVM user’s guide.

Exceeding the specified input range may cause unexpected operation and/or irreversible

damage to the EVM. If there are questions concerning the input range, please contact a TI

field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or

possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to

connecting any load to the EVM output. If there is uncertainty as to the load specification,

please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than

60°C. The EVM is designed to operate properly with certain components above 60°C as long

as the input and output ranges are maintained. These components include but are not limited

to linear regulators, switching transistors, pass transistors, and current sense resistors. These

types of devices can be identified using the EVM schematic located in the EVM User’s Guide.

When placing measurement probes near these devices during operation, please be aware

that these devices may be very warm to the touch.

Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265

Information About Cautions and Warnings

iii

Preface

Read This First

About This Manual

This user’s guide describes the characteristics, operation, and the use of the

DAC8574 evaluation module. It covers all pertinent areas involved to properly

use this EVM board along with the devices that it supports. The physical PCB

layout, schematic diagram and circuit descriptions are included.

How to Use This Manual

This document contains the following chapters:

Chapter 1 —EVM Overview

Chapter 2—PCB Design and Performance

Chapter 3—EVM Operation

Information About Cautions and Warnings

This book may contain cautions and warnings.

The information in a caution or a warning is provided for your protection. Read

each caution and warning carefully.

This is an example of a caution statement.

A caution statement describes a situation that could potentially

damage your software or equipment.

This is an example of a warning statement.

A warning statement describes a situation that could potentially

cause harm to you.

Trademarks

Related Documentation From Texas Instruments

To obtain a copy of any of the following TI documents, call the Texas

Instruments Literature Response Center (PIC) at (800) 477-8924 or the

Product Information Center (PIC) at (972) 644-5580. When ordering, identify

this manual by its title and literature number. Updated documents can also be

obtained through our website at www.ti.com.

Data Sheets: Literature Number:

DAC8574 SLAS377A

REF02 SBVS-003A

OPA627 PDS-998H

OPA2132 PDS-1309B

Questions about this or other Data Converter EVM’s?

If you have questions about this or other Texas Instruments Data Converter

evaluation modules, feel free to e-mail the Data Converter Application Team

at [email protected]. Inlcude in the subject heading the product you

have questions or concerns with.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It

generates, uses, and can radiate radio frequency energy and has not been

tested for compliance with the limits of computing devices pursuant to subpart

J of part 15 of FCC rules, which are designed to provide reasonable protection

against radio frequency interference. Operation of this equipment in other

environments may cause interference with radio communications, in which

case the user at his own expense will be required to take whatever measures

may be required to correct this interference.

Trademarks

TI Logo is a trademark of Texdas Instruments Incorporated.

I2C is a trademark of Phillips Corporation.

Contents

1 EVM Overview 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Power Requirements 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.1 Supply Voltage 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2.2 Reference Voltage 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 EVM Basic Functions 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 PCB Design and Performance 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 PCB Layout 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 EVM Performance 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 Bill of Materials 2-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 EVM Operation 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1 Factory Default Setting 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 Host Processor Interface 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3 EVM Stacking 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4 The Output Op-Amp 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.1 Unity Gain Output 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.2 Output Gain of Two 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4.3 Capacitive Load Drive 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5 Optional Signal Conditioning Op-Amp (U8B) 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.6 Jumper Setting 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.7 Schematic 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contents

Figures

1-1 EVM Block Diagram 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-1 Top Silkscreen 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-2 Layer 1 (Top Signal Plane) 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-3 Layer 2 (Ground Plane) 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-4 Layer 3 (Power Plane) 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-5 Layer 4 (Bottom Signal Plane) 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-6 Bottom Silkscreen 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-7 Drill Drawing 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-8 DAC8574 EVM Test Parameters and Results 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-9 INL and DNL Characterization Graph of DAC A 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-10 INL and DNL Characterization Graph of DAC B 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-11 INL and DNL Characterization Graph of DAC C 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2-12 INL and DNL Characterization Graph of DAC D 2-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

2-1 Parts List 2-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1 Factory Default Jumper Setting 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-2 DAC Output Channel Mapping 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-3 Unity Gain Output Jumper Settings 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-4 Gain of Two Output Jumper Settings 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-5 Capacitive Load Drive Output Jumper Settings 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-6 Jumper Setting Functions 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1

EVM Overview

This chapter gives a general overview of the DAC8574 evaluation module

(EVM), and describes some of the factors that must be considered in using this

module.

Topic Page

1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 Power Requirements 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 EVM Basic Functions 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1

Features

1-2

1.1 Features

This EVM features the DAC8574 digital-to-analog converter (DAC). The

DAC8574 EVM is a simple evaluation module designed for a quick and easy

way to evaluate the functionality and performance of the high resolution,

quad-channel, and serial I2Cinput DAC. This EVM features a serial I2C

interface to communicate with any host microprocessor or TI DSP base

system.

1.2 Power Requirements

The following sections describe the power requirements of this EVM.

1.2.1 Supply Voltage

The dc power supply requirement for the digital section (VDD) of this EVM is

typically 5 V connected to the J5-1 or via J6-10 terminal (when plugged in with

another EVM board or interface card) and is referenced to ground through the

J5-2 and J6-5 terminal. The dc power supply requirements for the analog

section of this EVM are as follows; the VCC and VSS ranges from 15.75 V to

-15.75 V maximum and connects through J1-3 and J1-1 respectively, or

through J6-1 and J6-2 terminals. The 5 VA connects through J5-3 or J6-3

and the 3.3 VA connects through J6-8. All of the analog power supplies are

referenced to analog ground through J1-2 and J6-6 terminals.

The device under test, U1, analog power supply can be powered by either 5 VA

or 3.3 VA by selecting the proper position of jumper W1. This allows the

DAC8574 analog section to operate in either supply power while the I/O and

digital section is powered by 5 V, VDD.

The VCC supply source is mainly used to provide the positive rail of the external

output op-amp, U2, the reference chip, U3 and the reference buffer, U8. The

negative rail of the output op-amp, U2, can be selected between VSS and

AGND via W5 jumper. The external op-amp is installed as an option to provide

output signal conditioning or boost capacitive load drive and for other output

mode requirement desired.

Caution

To avoid potential damage to the EVM board, make sure that the

correct cables are connected to their respective terminals as

labeled on the EVM board.

Stresses above the maximum listed voltage ratings may cause

permanent damage to the device.

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