Panasonic Phototransistors PNZ154NC Bedienungsanleitung

Phototransistors

Publication date: October 2008 SHE00063AED 1

PNZ154NC

Silicon planar type

For optical control systems

Features

Fast response

Wide spectral sensitivity characteristics

Adoption of visible light cutoff resin

Absolute Maximum Ratings Ta= 25°C

Parameter Symbol Rating Unit

Collector-emitter voltage (Base open) VCEO 20 V

Emitter-collector voltage (Base open) VECO 5 V

Collector current IC20 mA

Collector power dissipation PC100 mW

Operating ambient temperature Topr –25 to +85 °C

Storage temperature Tstg –30 to +100 °C

Electrical Characteristics Ta= 25°C±3°C

Parameter Symbol Conditions Min Typ Max Unit

Photocurrent *1ILVCE = 10 V, L = 500 lx 0.7 2.0 mA

Collector-emitter cutoff current (Base open)

ICEO VCE = 10 V 0.01 0.20 mA

Collector-emitter saturation voltage *1VCE(sat) IL= 1 mA, L = 1

000 lx 0.2 0.5 V

Peak sensitivity wavelength λPD VCE = 10 V 850 nm

Half-power angle θThe angle from which photocurrent

becomes 50% 27 °

Rise time *2trVCC = 10 V, IL= 5 mA, RL= 100 W4 10 ms

Fall time *2tf4 10 ms

Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.

2. Spectral sensitivity characteristics: Sensitivity for wave length over 400 nm maximum sensitivity ratio is 100%.

3. This device is designed by disregarding radiation.

4 *1: Source: Tungsten (color temperature 2

856 K)

*2: Switching time measurement circuit

(Input pulse)

(Output pulse)

50 ΩRL

tr: Rise time

tf:Fall time

VCC

Sig. out 10%

90%

Sig. in

trtf

PNZ154NC

2SHE00063AED

Package (Unit: mm)

Pin name

1: Emitter

2: Collector

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any

other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any

other company which may arise as a result of the use of technical information described in this book.

(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office

equipment, communications equipment, measuring instruments and household appliances).

Consult our sales staff in advance for information on the following applications:

–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-

ucts may directly jeopardize life or harm the human body.

–Any applications other than the standard applications intended.

(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20080805

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