ST EVAL-RHRPMPOL01 Bedienungsanleitung

Introduction

This user manual provides an overview of the use of the EVAL-RHRPMPOL01 evaluation board. It has been developed and

optimized for a typical application of the RHRPMPOL01 device, a single phase, step-down monolithic switching regulator with

high precision internal voltage reference and integrated power MOSFETs for synchronous conversion. The regulator

RHRPMPOL01 converts 3 V - 12 V input voltage to 0.8 V - (0.85xVIN) output voltage. The controller is based on a peak current

mode architecture, which ensures a fast load transient response and very stable switching frequency. An embedded integrator

compensates the DC voltage error due to the output voltage ripple.

General features:

• Input operating voltage: 5.0 V

• Output voltage: 1.2 V

• Output current: up to 5 A

• Enable input voltage: 2.5 V

• Switching frequency: 500 kHz

• Output overcurrent protection: 10 A

• Easy synchronization with 180 ° out-of-phase (up to 2 ICs) management

Figure 1. EVAL-RHRPMPOL01

• Orderable part number: EVAL-RHRPMPOL01

• Description: evaluation board of RHRPMPOL01

EVAL-RHRPMPOL01 evaluation board of radiation hardened 7 A monolithic

synchronous switching regulator

UM2706

User manual

UM2706 - Rev 1 - April 2020

For further information contact your local STMicroelectronics sales office.

www.st.com

1Schematic diagram

Figure 2. Schematic diagram

GND

CN1

CN4

CN3

GND

CN 2

330uF

GND GND

GND

8.2K

1uF

C11

VIN

5.0V

S+

S-

GND

VOUT

S+

S-

GND

4.7uHL1 VOUT

100nF

C13

100nF C14

GND

1uF

GND

100nF

GND

1uF

C10

GND

1uF

C12

GND

27K

GND

4.7K

R12 4.7nF

SSDEL/SDA

SYNC/SCL

GND

SSDEL

CN6

GND

SYNC

VIN

VDD

VCC

PGOOD

VDRIVE

REF

COMP

FSW

ILIM

SLOPE

I2C

SSDEL

SYNC

BOOST

GND

4.7

VIN

GND

VIN

GND

VOUT

GND

100pF-NC

C15

VDRIVE 14

BOOT 28

VDD 2

VCC

VIN4

PGND1

ILIM 19

SYNC

LX2 22

LX3 23

VIN2

VIN3

VIN1

PGND2

LX1 21

LX4 24

SLOPE 26

SSDEL

PGND3

PGOOD

AL 13

AGND 1

FSW 18

COMP 17

FB 16

REF 15

RHRPMPOL01

CN5

1uF

C16

GND

3.9k

270pF

GND

GNDGND

15pF

GND

150uF

0.1uF

0-NC

50K

0-NC

1.2V

5 A

GND

0-NC

R10

12K

R11

VDDVDDVDD

CN7 PGOOD

GND

TP_COMP

COMP

GND

CN8

VDD

GND

VDD

GND

CN9

GND

AL.

GND

Table 1. List of external components

Component Manufacturer Part number / description Value Size

C1 Kemet T530X337M010ATE006 330 µF 7343

C2,C3 Kemet T530D157M010ATE006 150 µF 7343

C4,C5,C13, C14 Murata GRM188R71H104KA93D 100 nF 0603

C9,C10, C11,C12, C16 Murata GRM188R61E105KA12D 1 µF 0603

C15 Murata GRM1885C1H101JA01 NC 0603

C6 Murata GRM1885C1H271JA01 270 pF 0603

C8 Murata GRM1885C1H150JA01 15 pF 0603

C7 Murata GRM188R71H472KA01 4.7 nF 0603

R4 Any Resistor 27 kΩ 0603

R1 Any Resistor 0 Ω 0603

R2 Any Resistor 3.9 kΩ 0603

R3 Any Resistor 8.2 kΩ 0603

R5 Any Resistor 4.7 Ω 0603

R12 Any Resistor 4.7 kΩ 0603

R6, R8,R10 Any Resistor NC 0603

R7 Any Resistor 50 kΩ 0603

R9 Any Resistor 1 kΩ 0603

R11 Any Resistor 12 kΩ 0603

UM2706

Schematic diagram

UM2706 - Rev 1 page 2/19

Component Manufacturer Part number / description Value Size

J1 Any 2-pin male strip line 2.54 mm pitch

CN1, CN3 Phoenix Contact 2-way PCB terminal 5.08 mm pitch

CN6 Any 3-pin male strip line 2.54 mm pitch

CN2, CN4,CN5, CN7, CN8, CN9 Any 2-pin male strip line 2.54 mm pitch

Coilcraft XAL8080-472MEB

4.7 µH

8.60x8.10 mm

Wurth 7443330470 10.9x10.0 mm

TP Any Test point 0.9 hole size

U1 ST RH-PMPOL01KPX FLAT28

UM2706

Schematic diagram

UM2706 - Rev 1 page 3/19

2Input and output connections

Table 2. Input and output connections

Reference/Designator Name Description

CN1 VIN CN1_1: VIN power

CN1_2: GND power

CN2 VIN_SENSE CN2_1: VIN sense (s+)

CN2_2: GND sense (s-)

CN3 VOUT CN3_1: VOUT power

CN3_2: GND power

CN4 VOUT_SENSE CN4_1: VOUT sense (s+)

CN4_2: GND sense (s-)

CN5 EN CN5_1: EN pin

CN5_2: GND

CN6 SSDEL/SYNC

CN6_1: SSDEL/SDA pin

-J1: through a capacitor to GND

CN6_2: SYNC/SCL pin

CN6_3:GND

CN7 PGOOD CN7_1: PGOOD pin

CN7_2: GND

CN8 VDD CN8_1: VDD pin

CN8_2: GND

CN9 AL CN9_1: AL pin

CN9_2: GND

UM2706

Input and output connections

UM2706 - Rev 1 page 4/19

3Connectors

Figure 3. In/out connectors

1. Connect a power supply between VIN power (CN1_1) and GND power (CN1_2) and a power supply

between EN (CN5_1) and GND (CN5_2). The output voltage is present on VOUT pin at the voltage value

set by R1 and R2

2. Connect a multimeter between VIN (S+) (CN2_1) and GND (S-) (CN2_2) for a precise input voltage sensing

3. Connect a multimeter between VOUT (S+) (CN3_1) and GND (S-) (CN3_2) for a precise output voltage

sensing

4. Connect a multimeter between VDD (CN8_1) and GND (CN8_2) for a precise VDD voltage sensing. This pin

outputs a 2.7 V regulated voltage

5. R10 and R11 – SLOPE: the slope compensation ramp is programmed by connecting an external RSLOPE

resistor (R11) between the SLOPE pin and GND. The default internal slope compensation is also

implemented and it can be enabled by pulling up the voltage on SLOPE pin higher then 2 V or, better, up to

VDD by a resistor (R10) or simply by a short. If the SLOPE pin is directly shorted to GND, both ramps,

default current slope and programmed external current slope, are disabled

6. R8 and R9 – ILIM: the default value for the overcurrent threshold is 10 A, with a second level OCP of 13 A

(ILIM pin pulled up to VDD through R8). If a resistor (R9) is connected between ILIM pin and GND the ILIM1

threshold can be set to a lower value, and the ILIM2 will be consequently set at 1.3 x ILIM1

7. R6 and R7 – FSW: the regulator switching frequency can be programmed by connecting an external resistor

(R7) between FSW pin and GND. A voltage of 1 V is present on the FSW pin, so a current of 1 V/RFSW is

set on the resistor. This current is used to charge an internal capacitor (~20 pF). The switching frequency

can range from 100 kHz to 1 MHz. If the FSW pin is connected to a voltage higher than 2 V, (better if it is

shorted to VDD through R6), the external programmability is turned off and the internal default frequency,

tuned at 500 kHz, is enabled. To set “slave mode” configuration, FSW pin must be forced to a voltage lower

than 0.1 V or better shorted to ground. The internal clock is normally present to the SYNC pin with 180 °

phase shifting.

8. CN6 – SSDEL/SYNC: the device can also use the connectors on the demonstration board to directly control

the features through an I²C interface. In order to enable the serial interface the EN pin must be set to -2 V

and J1 has to be left open. Take care about capacitive load on pin SYNC: max. allowed capacitive load

(equivalent) for SLAVE devices is 150 pF

UM2706

Connectors

UM2706 - Rev 1 page 5/19

4Board layout guidelines

4.1 Guidelines

The DC-DC converter area is very sensitive, and it is necessary to pay attention to the layout of this part. This is

because the DC-DC converter generates GND noise that can get coupled with surrounding ground reducing the

sensitivity and high-frequency components can disturb the RF part of the system. To ensure a correct layout it is

necessary to provide efficient filtering by placing capacitors as close as possible to the device pins. To reduce

parasitic inductance and resistance, it is recommended to use connections as wide and short as possible.

Figure 4. Demo boards

4.2 Four-layer board

A four-layer board is strongly recommended, with top and bottom layers connected to ground (0 V). Use a ground

plane internally (mid layer) to reduce the coupling among the traces. Put this ground layer very close to the top

layer to obtain a good ground plane reference. A thickness between the top layer and ground layer of 0.2 mm or

0.3 mm is suggested.

If it is not possible to use a four-layer board, it is recommended to shield the area under the RF part (mainly

traces of LX and ground-current return paths) of the board with ground metal to reduce or eliminate radiation

emissions. Board routing and wiring should not be placed in this region to prevent coupling effects and to ensure

a good ground reference plane to the RF parts.

UM2706

Board layout guidelines

UM2706 - Rev 1 page 6/19

Figure 5. 4-layer board

4.3 Ground plane

Any switch mode power supply requires a good PCB layout in order to achieve the maximum performance.

Component placement, GND trace routing and width are the major issues. Basic rules commonly used for DC-DC

converters for good PCB layout should be followed. All traces carrying current should be drawn on the PCB as

short and thick as possible. This should minimize resistive and inductive parasitic effects, and increase system

efficiency. Suggested PCB (ring) ground plane avoids spikes on the output voltage. Good soldering of the

exposed pad helps on this issue.

Connect all the ground metallization and/or layers with as many vias as possible. Ground vias among layers

should be added liberally throughout the RF portion of the PCB. This helps prevent accrual of parasitic ground

inductance due to ground-current return paths. The vias also help to prevent cross- coupling from RF and other

signal lines across the PCB.

Figure 6. Ground plane

The layers assigned to system bias (DC supply) and ground must be considered in terms of the return current for

the components. The general guidance is not to have signals routed on layers between the bias layer and the

ground layer.

UM2706

Ground plane

UM2706 - Rev 1 page 7/19

Figure 7. Ground plane assignment

Figure 8. Ground plane assignment 2

4.4 Capacitor placing

Particular care has to be taken in the placement of the supply voltage filtering capacitors. It is, in fact, important to

ensure efficient filtering by placing these capacitors as close as possible to their dedicated pins on the

VIN,VREF,VFB,VDD and VDRIVE.

Figure 9. Capacitor placing

The layout of decoupling capacitors is extremely important to minimize the induction loop formed between the

capacitor and the IC power and ground. The vias should be placed on the side of the capacitor lands (at the

ends). The vias should be located at minimum keep-out distance and connected to the capacitor lands with a

wide trace, at least as wide as the via pad. Vias of opposite polarity should be placed as close together as

possible (minimum keep-out distance) and vias of the same polarity should be kept separated as much as

possible. If space allows, a second pair of vias on the opposite side of the capacitor may be added to further

reduce the inductance.

UM2706

Capacitor placing

UM2706 - Rev 1 page 8/19

4.5 Inductor placing

The DC-DC converter inductor has to be placed as close as possible to the LX pin, with short and thick traces.

This should minimize resistive parasitic effects, and increase system efficiency.

Figure 10. Inductor placing

4.6 Vias placing

It is crucial to connect very well the ground of the exposed pad of the FLAT28 to the ground on the application

board. This may be accomplished by placing many vias to be sure that the parasitic inductance introduced from

each via is negligible.

Figure 11. Vias placing

UM2706

Inductor placing

UM2706 - Rev 1 page 9/19

Connect all the ground metallization and/or layers with as many vias as possible. The vias should be located at

minimum keepout distance, in order to minimize resistive and inductive parasitic effects.

Figure 12. Vias placing 2

4.7 Feedback voltage

VFB is generated by a precision voltage divider (use of low tolerance resistors is recommended). Place a

decoupling capacitor very close to the VFB pin. Use good capacitor layout techniques. Place the voltage divider

resistors close to the VFB pin to minimize trace length, but not so close that they interfere with other critical signal

or power routing. Do not route the VFB trace near noisy traces or planes. Do not place a decoupling capacitor at

the junction of the resistors – only at the VFB pin.

UM2706

Feedback voltage

UM2706 - Rev 1 page 10/19

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