NXP Semiconductors LPC1769 Bedienungsanleitung

UM10360

LPC176x/5x User manual

Rev. 3 — 20 December 2013 User manual

Document information

Info Content

Keywords LPC1769, LPC1768, LPC1767, LPC1766, LPC1765, LPC1764, LPC1763,

LPC1759, LPC1758, LPC1756, LPC1754, LPC1752, LPC1751, ARM, ARM

Cortex-M3, 32-bit, USB, Ethernet, CAN, I2S, Microcontroller

Abstract LPC176x/5x user manual

User manual Rev. 3 — 20 December 2013 2 of 841

NXP Semiconductors UM10360

LPC17xx user manual

Revision history

Rev Date Description

3 20131220 LPC176x/5x user manual

Modifications:

•Part ID for part LPC1763 added.

•Changed title to “LPC176x/5x User manual”.

•Updated numbering for CAN interfaces: CAN1 uses SCC = 0, CAN2 uses SCC = 1. See

Section 16.13 “ID look-up table RAM”and Section 16.15 “Configuration and search algorithm”.

•Updated Serial Wire Output description (Table 609).

•Clarified burst mode information for ADGINTEN (Table 531 and Table 533).

•Condition CCLK > 18 MHz for USB operation is not applicable for this USB peripheral and was

removed (see Section 4.7.1, Section 11.13, and Section 13.11).

•Description of CAN interrupt request updated. One common CAN interrupt is triggered. See

Section 16.8.3.

•Condition on minimum frequency of CAP input clock added in Section 21.5.1.

•Description of RIMASK register corrected. See Table 433.

•Condition for maximum allowable STCLK frequency added. See Section 23.4.

•Delete statement “All PWM related Match registers are configured for toggle on match.” in

Figure 120.

•Description of INXCNT register updated. See Section 26.6.3.6.

•Reset value of the RTC_AUX register corrected. See Table 507.

•DAC power-down mode removed in Section 30.2.

•Added: The DAC output is disabled in deep-sleep, power-down, or deep power-down modes.

See Table 537.

•Boot loader SRAM use explained. See Section 33.5.

•SYSRESETREQ supported. See Table 659.

•Figure 18 “Ethernet packet fields”corrected.

•Bit description in the SPI test control register corrected. Bit 0 indicates test mode. All other bits

are reserved. See Section 17.7.5 “SPI Test Control Register (SPTCR - 0x4002 0010)”.

•Figure 117 “RI timer block diagram”updated.

2 20100819 LPC176x/5x user manual revision.

Modifications:

•UART0/1/2/3: FIFOLVL register removed.

•ADC: reset value of the ADCTRM register changed to 0xF00 (Table 500).

•Timer0/1/2/3: Description of DMA operation updated.

•USB Device: Corrected error in the USBCmdCode register (0x01 = write, 0x02 = read)

(Table 184).

•Clocking and power control: add bit 15 (PCGPIO) to PCONP register (Table 46).

•Part LPC1763 added.

•Update register bit description of USBIntStat register in Host and Device mode (Table 155 and

Table 221).

•Motor control PWM: update description of match and limit registers.

•GPIO: update register bit description of the FIOPIN register (Table 73).

•Numerous editorial updates throughout the user manual.

User manual Rev. 3 — 20 December 2013 3 of 841

Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

NXP Semiconductors UM10360

LPC17xx user manual

1 20100104 LPC176x/5x user manual revision.

Revision history …continued

Rev Date Description

User manual Rev. 3 — 19 December 2013 4 of 841

1.1 Introduction

The LPC176x/5x is an ARM Cortex-M3 based microcontroller for embedded applications

requiring a high level of integration and low power dissipation. The ARM Cortex-M3 is a

next generation core that offers system enhancements such as modernized debug

features and a higher level of support block integration.

High speed versions (LPC1769 and LPC1759) operate at up to a 120 MHz CPU

frequency. Other versions operate at up to an 100 MHz CPU frequency. The ARM

Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with

separate local instruction and data buses as well as a third bus for peripherals. The ARM

Cortex-M3 CPU also includes an internal prefetch unit that supports speculative

branches.

The peripheral complement of the LPC176x/5x includes up to 512 kB of flash memory, up

to 64 kB of data memory, Ethernet MAC, a USB interface that can be configured as either

Host, Device, or OTG, 8 channel general purpose DMA controller, 4 UARTs, 2 CAN

channels, 2 SSP controllers, SPI interface, 3 I2C interfaces, 2-input plus 2-output I2S

interface, 8 channel 12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder

interface, 4 general purpose timers, 6-output general purpose PWM, ultra-low power RTC

with separate battery supply, and up to 70 general purpose I/O pins.

UM10360

Chapter 1: LPC176x/5x Introductory information

Rev. 3 — 19 December 2013 User manual

User manual Rev. 3 — 19 December 2013 5 of 841

NXP Semiconductors UM10360

Chapter 1: LPC176x/5x Introductory information

1.2 Features

Refer to Section 1.4.1 for details of features on specific part numbers.

•ARM Cortex-M3 processor, running at frequencies of up to 120 MHz on high speed

versions (LPC1769 and LPC1759), up to 100 MHz on other versions. A Memory

Protection Unit (MPU) supporting eight regions is included.

•ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).

•Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and

In-Application Programming (IAP) capabilities. The combination of an enhanced flash

memory accelerator and location of the flash memory on the CPU local code/data bus

provides high code performance from flash.

•Up to 64 kB on-chip SRAM includes:

–Up to 32 kB of SRAM on the CPU with local code/data bus for high-performance

CPU access.

–Up to two 16 kB SRAM blocks with separate access paths for higher throughput.

These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as

for general purpose instruction and data storage.

•Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer

matrix that can be used with the SSP, I2S, UART, the Analog-to-Digital and

Digital-to-Analog converter peripherals, timer match signals, GPIO, and for

memory-to-memory transfers.

•Multilayer AHB matrix interconnect provides a separate bus for each AHB master.

AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and

the USB interface. This interconnect provides communication with no arbitration

delays unless two masters attempt to access the same slave at the same time.

•Split APB bus allows for higher throughput with fewer stalls between the CPU and

DMA. A single level of write buffering allows the CPU to continue without waiting for

completion of APB writes if the APB was not already busy.

•Serial interfaces:

–Ethernet MAC with RMII interface and dedicated DMA controller.

–USB 2.0 full-speed controller that can be configured for either device, Host, or

OTG operation with an on-chip PHY for device and Host functions and a dedicated

DMA controller.

–Four UARTs with fractional baud rate generation, internal FIFO, IrDA, and DMA

support. One UART has modem control I/O and RS-485/EIA-485 support.

–Two-channel CAN controller.

–Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces

can be used with the GPDMA controller.

–SPI controller with synchronous, serial, full duplex communication and

programmable data length. SPI is included as a legacy peripheral and can be used

instead of SSP0.

–Three enhanced I2C-bus interfaces, one with an open-drain output supporting the

full I2C specification and Fast mode plus with data rates of 1Mbit/s, two with

standard port pins. Enhancements include multiple address recognition and

monitor mode.

User manual Rev. 3 — 19 December 2013 6 of 841

NXP Semiconductors UM10360

Chapter 1: LPC176x/5x Introductory information

–I2S (Inter-IC Sound) interface for digital audio input or output, with fractional rate

control. The I2S interface can be used with the GPDMA. The I2S interface supports

3-wire data transmit and receive or 4-wire combined transmit and receive

connections, as well as master clock output.

•Other peripherals:

–70 (100 pin package) or 52 (80-pin package) General Purpose I/O (GPIO) pins with

configurable pull-up/down resistors, open drain mode, and repeater mode. All

GPIOs are located on an AHB bus for fast access, and support Cortex-M3

bit-banding. GPIOs can be accessed by the General Purpose DMA Controller. Any

pin of ports 0 and 2 can be used to generate an interrupt.

–12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,

conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can

be used with the GPDMA controller.

–10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA

support.

–Four general purpose timers/counters, with a total of eight capture inputs and ten

compare outputs. Each timer block has an external count input. Specific timer

events can be selected to generate DMA requests.

–One motor control PWM with support for three-phase motor control.

–Quadrature encoder interface that can monitor one external quadrature encoder.

–One standard PWM/timer block with external count input.

–Real-Time Clock (RTC) with a separate power domain. The RTC is clocked by a

dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered

backup registers, allowing system status to be stored when the rest of the chip is

powered off. Battery power can be supplied from a standard 3 V Lithium button

cell. The RTC will continue working when the battery voltage drops to as low as

2.1 V. An RTC interrupt can wake up the CPU from any reduced power mode.

–Watchdog Timer (WDT). The WDT can be clocked from the internal RC oscillator,

the RTC oscillator, or the APB clock.

–Cortex-M3 system tick timer, including an external clock input option.

–Repetitive interrupt timer provides programmable and repeating timed interrupts.

•Standard JTAG test/debug interface as well as Serial Wire Debug and Serial Wire

Trace Port options.

•Emulation trace module supports real-time trace.

•Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep

power-down.

•Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of -40 °C to 85 °C.

•Four external interrupt inputs configurable as edge/level sensitive. All pins on PORT0

and PORT2 can be used as edge sensitive interrupt sources.

•Non-maskable Interrupt (NMI) input.

•Clock output function that can reflect the main oscillator clock, IRC clock, RTC clock,

CPU clock, or the USB clock.

•The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up

from any priority interrupt that can occur while the clocks are stopped in deep sleep,

Power-down, and Deep power-down modes.

User manual Rev. 3 — 19 December 2013 7 of 841

NXP Semiconductors UM10360

Chapter 1: LPC176x/5x Introductory information

•Processor wake-up from Power-down mode via any interrupt able to operate during

Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet

wake-up interrupt, CAN bus activity, PORT0/2 pin interrupt, and NMI).

•Each peripheral has its own clock divider for further power savings.

•Brownout detect with separate threshold for interrupt and forced reset.

•On-chip Power-On Reset (POR).

•On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.

•4 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used as a

system clock.

•An on-chip PLL allows CPU operation up to the maximum CPU rate without the need

for a high-frequency crystal. May be run from the main oscillator, the internal RC

oscillator, or the RTC oscillator.

•A second, dedicated PLL may be used for the USB interface in order to allow added

flexibility for the Main PLL settings.

•Versatile pin function selection feature allows many possibilities for using on-chip

peripheral functions.

•Available as 100-pin LQFP (14 x 14 x 1.4 mm) and 80-pin LQFP (12 x 12 x 1.4 mm)

packages.

1.3 Applications

•eMetering

•Lighting

•Industrial networking

•Alarm systems

•White goods

•Motor control

User manual Rev. 3 — 19 December 2013 8 of 841

NXP Semiconductors UM10360

Chapter 1: LPC176x/5x Introductory information

1.4 Ordering information

1.4.1 Part options summary

Table 1. Ordering information

Type number Package

Name Description Version

LPC1769FBD100

LQFP100 plastic low profile quad flat package; 100 leads; body 14 14 1.4 mm SOT407-1

LPC1768FBD100

LPC1767FBD100

LPC1766FBD100

LPC1765FBD100

LPC1764FBD100

LPC1763FBD100

LPC1768FET100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm SOT926-1

LPC1759FBD80

LQFP80 plastic low profile quad flat package; 80 leads; body 12 12 1.4 mm SOT315-1

LPC1758FBD80

LPC1756FBD80

LPC1754FBD80

LPC1752FBD80

LPC1751FBD80

Table 2. Ordering options for LPC176x/5x parts

Type number Max. CPU

speed Flash Total

SRAM Ethernet USB CAN I2SDAC Package

LPC1769FBD100 120 MHz 512 kB 64 kB yes Device/Host/OTG 2 yes yes 100 pin

LPC1768FBD100 100 MHz 512 kB 64 kB yes Device/Host/OTG 2 yes yes 100 pin

LPC1768FET100 100 MHz 512 kB 64 kB yes Device/Host/OTG 2 yes yes 100 pin

LPC1767FBD100 100 MHz 512 kB 64 kB yes no no yes yes 100 pin

LPC1766FBD100 100 MHz 256 kB 64 kB yes Device/Host/OTG 2 yes yes 100 pin

LPC1765FBD100 100 MHz 256 kB 64 kB no Device/Host/OTG 2 yes yes 100 pin

LPC1764FBD100 100 MHz 128 kB 32 kB yes Device 2 no no 100 pin

LPC1763FBD100 100 MHz 256 kB 64 kB no no no yes yes 100 pin

LPC1759FBD80 120 MHz 512 kB 64 kB no Device/Host/OTG 2 yes yes 80 pin

LPC1758FBD80 100 MHz 512 kB 64 kB yes Device/Host/OTG 2 yes yes 80 pin

LPC1756FBD80 100 MHz 256 kB 32 kB no Device/Host/OTG 2 yes yes 80 pin

LPC1754FBD80 100 MHz 128 kB 32 kB no Device/Host/OTG 1 no yes 80 pin

LPC1752FBD80 100 MHz 64 kB 16 kB no Device 1 no no 80 pin

LPC1751FBD80 100 MHz 32 kB 8 kB no Device 1 no no 80 pin

User manual Rev. 3 — 19 December 2013 9 of 841

NXP Semiconductors UM10360

Chapter 1: LPC176x/5x Introductory information

1.5 Simplified block diagram

Fig 1. LPC1768 simplified block diagram

AHB to

APB bridge AHB to

APB bridge

APB slave group 1APB slave group 0

Note: shaded peripheral blocks

support General Purpose DMA

RTC Power Domain

Multilayer AHB Matrix

I2C2

I2S

UARTs 2 & 3

SSP0

Real Time Clock

20 bytes of backup

registers

SSP1

UARTs 0 & 1

CAN 1 & 2

I2C 0 & 1

SPI0

Capture/Compare

Timers 0 & 1

Watchdog Timer

PWM1

12-bit ADC

Pin Connect Block

GPIO Interrupt Ctl

32 kHz

oscillator

DMA

controller

Clock Generation,

Power Control,

Brownout Detect,

and other

system functions

RST

Xtalin

Xtalout

Clocks

and

Controls

Ethernet

PHY

interface

Ethernet

10/100

MAC

USB

device,

host,

OTG

USB

interface

JTAG

interface

ARM Cortex-M3

Test/Debug Interface

System

bus

D-code

bus

I-code

bus

ROM

8 kB

SRAM

64 kB

Trace

Port

Trace Module

High Speed GPIO

Capture/Compare

Timers 2 & 3

External Interrupts

DAC

System Control

Motor Control PWM

Quadrature Encoder

Repetitive Interrupt

Timer

Flash

512 kB

Flash

Accelerator

User manual Rev. 3 — 19 December 2013 10 of 841

NXP Semiconductors UM10360

Chapter 1: LPC176x/5x Introductory information

1.6 Architectural overview

The ARM Cortex-M3 includes three AHB-Lite buses, one system bus and the I-code and

D-code buses which are faster and are used similarly to TCM interfaces: one bus

dedicated for instruction fetch (I-code) and one bus for data access (D-code). The use of

two core buses allows for simultaneous operations if concurrent operations target different

devices.

The LPC176x/5x uses a multi-layer AHB matrix to connect the Cortex-M3 buses and other

bus masters to peripherals in a flexible manner that optimizes performance by allowing

peripherals on different slaves ports of the matrix to be accessed simultaneously by

different bus masters. Details of the multilayer matrix connections are shown in Figure 2.

APB peripherals are connected to the CPU via two APB busses using separate slave

ports from the multilayer AHB matrix. This allows for better performance by reducing

collisions between the CPU and the DMA controller. The APB bus bridges are configured

to buffer writes so that the CPU or DMA controller can write to APB devices without

always waiting for APB write completion.

1.7 ARM Cortex-M3 processor

The ARM Cortex-M3 is a general purpose 32-bit microprocessor, which offers high

performance and very low power consumption. The Cortex-M3 offers many new features,

including a Thumb-2 instruction set, low interrupt latency, hardware divide,

interruptible/continuable multiple load and store instructions, automatic state save and

restore for interrupts, tightly integrated interrupt controller with Wake-up Interrupt

Controller, and multiple core buses capable of simultaneous accesses.

Pipeline techniques are employed so that all parts of the processing and memory systems

can operate continuously. Typically, while one instruction is being executed, its successor

is being decoded, and a third instruction is being fetched from memory.

The ARM Cortex-M3 processor is described in detail in the Cortex-M3 User Guide that is

appended to this manual.

1.7.1 Cortex-M3 Configuration Options

The LPC176x/5x uses the r2p0 version of the Cortex-M3 CPU, which includes a number

of configurable options, as noted below.

System options:

•The Nested Vectored Interrupt Controller (NVIC) is included. The NVIC includes the

SYSTICK timer.

•The Wake-up Interrupt Controller (WIC) is included. The WIC allows more powerful

options for waking up the CPU from reduced power modes.

•A Memory Protection Unit (MPU) is included.

•A ROM Table in included. The ROM Table provides addresses of debug components

to external debug systems.

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