Panasonic Transistors 2SB1030A Bedienungsanleitung

Transistors

Publication date : October 2008 SJC00418AED 1

This product complies with the RoHS Directive (EU 2002/95/EC).

2SB1030A

Silicon PNP epitaxial planar type

For low-frequency ampliﬁcation

Complementary to 2SD1423A

Features

Optimum for high-density mounting

Allowing supply with the radial taping

Absolute Maximum Ratings Ta= 25°C

Parameter Symbol Rating Unit

Collector-base voltage (Emitter open) VCBO –60 V

Collector-emitter voltage (Base open) VCEO –50 V

Emitter-base voltage (Collector open) VEBO –7 V

Collector current IC– 0.5 A

Peak collector current ICP –1 A

Collector power dissipation PC300 mW

Junction temperature Tj150 °C

Storage temperature Tstg –55 to +150 °C

Electrical Characteristics Ta= 25°C±3°C

Parameter Symbol Conditions Min Typ Max Unit

Collector-base voltage (Emitter open) VCBO IC= –10 mA, IE= 0 –60 V

Collector-emitter voltage (Base open) VCEO IC= –2 mA, IB= 0 –50 V

Emitter-base voltage (Collector open) VEBO IE= –10 mA, IC= 0 –7 V

Collector-base cutoff current (Emitter open) ICBO VCB = –20 V, IE= 0 – 0.1 mA

Collector-Emitter cutoff current (Base open) ICEO VCE = –20 V, IB= 0 –1 mA

Forward current transfer ratio hFE1 *VCE = –10 V, IC= –150 mA 85 340



hFE2 VCE = –10 V, IC= –500 A 40

Collector-emitter saturation voltage VCE(sat) IC= –300 mA, IB= –30 mA – 0.35 – 0.60 V

Transition frequency fTVCB = –10 V, IE= 50 mA, f = 200 MHz 120 MHz

Collector output capacitance

(Common base, input open circuited)

Cob VCB = –10 V, IE= 0, f = 1 MHz 3.5 15.0 pF

Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.

2. *: Rank classiﬁcation

Rank Q R S

hFE1 85 to 170 120 to 240 170 to 340

Package

Code

NS-B1

Pin Name

1. Emitter

2. Collector

3. Base

2SB1030A

2SJC00418AED

This product complies with the RoHS Directive (EU 2002/95/EC).

PCTaICVCE VCE(sat) IC

VBE(sat) IC hFE IC fTIE

0 16040 12080

500

400

300

200

100

Collector power dissipation PC(mW)

Ambient temperature Ta(°C)

2SB1030_PC-Ta

0−12−10−8−2−6−4

−1.2

−1.0

−

0.8

−

0.6

−

0.4

−

0.2

Ta=25°C

−9 mA

−8 mA

−7 mA

−6 mA

−5 mA

−4 mA

−3 mA

−2 mA

−1 mA

IB=−10 mA

Collector current IC(A)

Collector-emitter voltage

VCE (V)

2SB1030_IC-VCE

−0.01

−0.1 −1−10

−0.01

−0.1

−1

−10

−100 IC/ IB=10

Ta=−25°C

75°C

25°C

Base-emitter saturation voltage VBE(sat) (V)

Collector current IC(A)

2SB1030_VBE(sat)-IC

−0.01

−0.1 −1−10

600

500

400

300

200

100

VCE =−10 V

Ta=75°C

25°C

−25°C

Forward current transfer ratio hFE

Collector current IC(A)

2SB1030_hFE-IC

0.1 1 10 100

160

120

VCB =−10 V

Ta=25°C

Transition frequency fT(MHz)

Emitter current IE(mA)

2SB1030_fT-IE

−1−100−10

IE=0

f =1 MHz

Ta=25°C

Collector-base voltage VCB (V)

2SB1030_Cob-VCB

Collector output capacitance

(Common base, input open circuited) Cob (pF)

−10 −100 −1000

240

200

160

120

VCE =−10 V

Ta=25°C

Function =FLAT

4.7 kΩ

Rg=100 kΩ

22 kΩ

Noise voltage NV (mV)

Collector current IC(µA)

2SB1030_NV-IC

−0.01

−0.1 −1−10

−0.01

−0.1

−1

−10

−100 IC/ IB=10

Ta=75°C

25°C

−25°C

Collector-emitter saturation voltage VCE(sat) (V)

Collector current IC(A)

2SB1030_VCE(sat)-IC

Cob VCB NV IC

2SB1030A

SJC00418AED 3

This product complies with the RoHS Directive (EU 2002/95/EC).

NS-B1 Unit: mm

(2.5) (2.5)

4.0 ±0.2

3.0 ±0.2

(0.8)

7.6

15.6 ±0.5

0.75 max.

0.45

123

0.45

2.0 ±0.2

0.7 ±0.1

+0.20

−0.10

+0.20

−0.10

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any

other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any

other company which may arise as a result of the use of technical information described in this book.

(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office

equipment, communications equipment, measuring instruments and household appliances).

Consult our sales staff in advance for information on the following applications:

–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support

systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-

ucts may directly jeopardize life or harm the human body.

–Any applications other than the standard applications intended.

(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20080805

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