Fujitsu SPARC M12-2 Bedienungsanleitung

Fujitsu SPARC M12-2/M12-2S

Service Manual

Manual Code: C120-0019-15EN

January 2023

2017,

2023,

Fujitsu

Limited.

All

rig

reserved.

Ora le

and/or

its

affiliates

provided

te hni al

input

and

review

portions

this

material.

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ontrol

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de ompilation.

part

su h

produ t

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form

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ontain

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terms

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GPL

LGPL,

opy

the

sour e

ode

governed

the

GPL

LGPL,

appli able,

available

upon

request

the

End

User.

Please

onta t

Ora le

and/or

its

affiliates

Fujitsu

Limited.

This

distribution

may

in lude

materials

developed

third

parties.

Parts

the

produ t

may

derived

from

Berkeley

BSD

systems,

li ensed

from

the

University

California.

UNIX

registered

trademark

The

Open

Group.

Ora le

and

Java

are

registered

trademarks

Ora le

and/or

its

affiliates.

Fujitsu

and

the

Fujitsu

logo

are

registered

trademarks

Fujitsu

Limited.

SPARC

Enterprise,

SPARC64,

SPARC64

logo

and

all

SPARC

trademarks

are

trademarks

registered

trademarks

SPARC

International,

In .

the

United

States

and

other

ountries

and

used

under

li ense.

Other

names

may

trademarks

their

respe tive

owners.

this

software

do umentation

that

delivered

the

U.S.

Government

anyone

li ensing

behalf

the

U.S.

Government,

the

following

noti e

appli able:

U.S.

GOVERNMENT

END

USERS:

Ora le

programs,

in luding

any

operating

system,

integrated

software,

any

programs

installed

the

hardware,

and/or

do umentation,

delivered

U.S.

Government

end

users

are

" ommer ial

omputer

software"

pursuant

the

appli able

Federal

A quisition

Regulation

and

agen y-spe ifi

supplemental

regulations.

su h,

use,

dupli ation,

dis losure,

modifi ation,

and

adaptation

the

programs,

in luding

any

operating

system,

integrated

software,

any

programs

installed

the

hardware,

and/or

do umentation,

shall

subje t

li ense

terms

and

li ense

restri tions

appli able

the

programs.

other

rights

are

granted

the

U.S.

Government.

Dis laimer:

The

only

warranties

granted

Ora le

and

Fujitsu

Limited,

and/or

any

affiliate

onne tion

with

this

do ument

any

produ t

te hnology

des ribed

herein

are

those

expressly

set

forth

the

li ense

agreement

pursuant

whi h

the

produ t

te hnology

provided.

EXCEPT

EXPRESSLY

SET

FORTH

SUCH

AGREEMENT,

ORACLE

FUJITSU

LIMITED,

AND/OR

THEIR

AFFILIATES

MAKE

REPRESENTATIONS

WARRANTIES

ANY

KIND

(EXPRESS

IMPLIED)

REGARDING

SUCH

PRODUCT

TECHNOLOGY

THIS

DOCUMENT,

WHICH

ARE

ALL

PROVIDED

IS,

AND

ALL

EXPRESS

IMPLIED

CONDITIONS,

REPRESENTATIONS

AND

WARRANTIES,

INCLUDING

WITHOUT

LIMITATION

ANY

IMPLIED

WARRANTY

MERCHANTABILITY,

FITNESS

FOR

PARTICULAR

PURPOSE

NONINFRINGEMENT,

ARE

DISCLAIMED,

EXCEPT

THE

EXTENT

THAT

SUCH

DISCLAIMERS

ARE

HELD

LEGALLY

INVALID.

Unless

otherwise

expressly

set

forth

su h

agreement,

the

extent

allowed

appli able

law,

event

shall

Ora le

Fujitsu

Limited,

and/or

any

their

affiliates

have

any

liability

any

third

party

under

any

legal

theory

for

any

loss

revenues

profits,

loss

use

data,

business

interruptions,

for

any

indire t,

spe ial,

in idental

onsequential

damages,

even

advised

the

possibility

su h

damages.

DOCUMENTATION

PROVIDED

"AS

IS"

AND

ALL

EXPRESS

IMPLIED

CONDITIONS,

REPRESENTATIONS

AND

WARRANTIES,

INCLUDING

ANY

IMPLIED

WARRANTY

MERCHANTABILITY,

FITNESS

FOR

PARTICULAR

PURPOSE

NON-INFRINGEMENT,

ARE

DISCLAIMED,

EXCEPT

THE

EXTENT

THAT

SUCH

DISCLAIMERS

ARE

HELD

LEGALLY

INVALID.

2017,

2023,

Fujitsu

Limited.

Tous

droits

réservés.

Ora le

et/ou

ses

affiliés

ont

fourni

vérifié

des

données

te hniques

ertaines

parties

omposant.

Ora le

et/ou

ses

affiliés

Fujitsu

Limited

détiennent

ontrôlent

ha un

des

droits

propriété

intelle tuelle

relatifs

aux

produits

te hnologies

dé rits

dans

do ument.

même,

produits,

te hnologies

do ument

sont

protégés

par

des

lois

sur

droit

d’auteur,

des

brevets,

d'autres

lois

sur

propriété

intelle tuelle

des

traités

internationaux.

do ument,

produit

les

te hnologies

afférents

sont

ex lusivement

distribués

ave

des

li en es

qui

restreignent

l'utilisation,

opie,

distribution

dé ompilation.

Au une

partie

produit,

te hnologies

do ument

peut

être

reproduite

sous

quelque

forme

que

soit,

par

quelque

moyen

que

soit,

sans

l'autorisation

é rite

préalable

d'Ora le

et/ou

ses

affiliés

Fujitsu

Limited,

leurs

éventuels

on édants

li en e.

do ument,

bien

qu'il

vous

ait

été

fourni,

vous

onfère

au un

droit

au une

li en e,

exprès

ta ites,

on ernant

produit

te hnologie

auxquels

rapporte.

Par

ailleurs,

ontient

représente

au un

engagement,

quelque

type

que

soit,

part

d'Ora le

Fujitsu

Limited,

des

so iétés

affiliées

l'une

l'autre

entité.

do ument,

ainsi

que

les

produits

te hnologies

qu'il

dé rit,

peuvent

in lure

des

droits

propriété

intelle tuelle

parties

tier es

protégés

par

droit

d’auteur

et/ou

édés

sous

li en e

par

des

fournisseurs

Ora le

et/ou

ses

so iétés

affiliées

Fujitsu

Limited,

ompris

des

logi iels

des

te hnologies

relatives

aux

poli es

ara tères.

Conformément

aux

onditions

li en e

GPL

LGPL,

une

opie

ode

sour e

régi

par

li en e

GPL

LGPL,

selon

as,

est

disponible

sur

demande

par

l'Utilisateur

Final.

Veuillez

onta ter

Ora le

et/ou

ses

affiliés

Fujitsu

Limited.

Cette

distribution

peut

omprendre

des

omposants

développés

par

des

parties

tier es.

Des

parties

produit

pourront

être

dérivées

des

systèmes

Berkeley

BSD

li en iés

par

l'Université

Californie.

UNIX

est

une

marque

déposée

The

OpenGroup.

Ora le

Java

sont

des

marques

déposées

d'Ora le

Corporation

et/ou

ses

affiliés.

Fujitsu

logo

Fujitsu

sont

des

marques

déposées

Fujitsu

Limited.

SPARC

Enterprise,

SPARC64,

logo

SPARC64

toutes

les

marques

SPARC

sont

utilisées

sous

li en e

sont

des

marques

déposées

SPARC

International,

In .,

aux

Etats-Unis

dans

d'autres

pays.

Tout

autre

nom

mentionné

peut

orrespondre

des

marques

appartenant

leurs

propriétaires

respe tifs.

logi iel,

do umentation

qui

l'a ompagne,

est

on édé

sous

li en e

Gouvernement

des

Etats-Unis,

toute

entité

qui

délivre

li en e

logi iel

l'utilise

pour

ompte

Gouvernement

des

Etats-Unis,

noti e

s'applique

U.S.

GOVERNMENT

END

USERS:

Ora le

programs,

in luding

any

operating

system,

integrated

software,

any

programs

installed

the

hardware,

and/or

do umentation,

delivered

U.S.

Government

end

users

are

" ommer ial

omputer

software"

pursuant

the

appli able

Federal

A quisition

Regulation

and

agen y-spe ifi

supplemental

regulations.

su h,

use,

dupli ation,

dis losure,

modifi ation,

and

adaptation

the

programs,

in luding

any

operating

system,

integrated

software,

any

programs

installed

the

hardware,

and/or

do umentation,

shall

subje t

li ense

terms

and

li ense

restri tions

appli able

the

programs.

other

rights

are

granted

the

U.S.

Government.

Avis

non-responsabilité

les

seules

garanties

o troyées

par

Ora le

Fujitsu

Limited

et/ou

toute

so iété

affiliée

l'une

l'autre

entité

rapport

ave

do ument

tout

produit

toute

te hnologie

dé rits

dans

les

présentes

orrespondent

aux

garanties

expressément

stipulées

dans

ontrat

li en e

régissant

produit

te hnologie

fournis.

SAUF

MENTION

CONTRAIRE

EXPRESSEMENT

STIPULEE

DIT

CONTRAT,

ORACLE

FUJITSU

LIMITED

ET/OU

LES

SOCIETES

AFFILIEES

L'UNE

L'AUTRE

ENTITE

DECLINENT

TOUT

ENGAGEMENT

GARANTIE,

QUELLE

QU'EN

SOIT

NATURE

(EXPRESSE

IMPLICITE)

CONCERNANT

PRODUIT,

CETTE

TECHNOLOGIE

DOCUMENT,

LESQUELS

SONT

FOURNIS

L'ETAT.

OUTRE,

TOUTES

LES

CONDITIONS,

DECLARATIONS

GARANTIES

EXPRESSES

TACITES,

COMPRIS

NOTAMMENT

TOUTE

GARANTIE

IMPLICITE

RELATIVE

QUALITE

MARCHANDE,

L'APTITUDE

UNE

UTILISATION

PARTICULIERE

L'ABSENCE

CONTREFACON,

SONT

EXCLUES,

DANS

MESURE

AUTORISEE

PAR

LOI

APPLICABLE.

Sauf

mention

ontraire

expressément

stipulée

dans

ontrat,

dans

mesure

autorisée

par

loi

appli able,

au un

Ora le

Fujitsu

Limited

et/ou

l'une

l'autre

leurs

so iétés

affiliées

sauraient

être

tenues

responsables

envers

une

quel onque

partie

tier e,

sous

quelque

théorie

juridique

que

soit,

tout

manque

gagner

perte

profit,

problèmes

d'utilisation

perte

données,

d'interruptions

d'a tivités,

tout

dommage

indire t,

spé ial,

se ondaire

onsé utif,

même

entités

ont

été

préalablement

informées

d'une

telle

éventualité.

DOCUMENTATION

EST

FOURNIE

"EN

L'ETAT"

TOUTE

AUTRE

CONDITION,

DECLARATION

GARANTIE,

EXPRESSE

TACITE,

EST

FORMELLEMENT

EXCLUE,

DANS

MESURE

AUTORISEE

PAR

LOI

VIGUEUR,

COMPRIS

NOTAMMENT

TOUTE

GARANTIE

IMPLICITE

RELATIVE

QUALITE

MARCHANDE,

L'APTITUDE

UNE

UTILISATION

PARTICULIERE OU

L'ABSENCE

CONTREFACON.

Contents

Preface　xix

Chapter

1　Before

Starting

Maintenance

Work　1

1.1 　Warning/Caution

Indications 　1

1.2 　Labels 　2

1.2.1 　Warning

Labels 　2

1.2.2 　Standard

Label 　3

1.2.3 　System

Nameplate

Label 　4

1.3 　R ID Tag 　5

1.4 　Safety

Precautions 　5

1.5 　Precautions

Static

Electricity 　6

1.6 　Other Precautions 　8

1.7 　Emergency

Power-Off 　9

1.8 　Tools Required

for

Maintenance 　10

Chapter

2　Understanding

the

System

Units　11

2.1 　Understanding

the

Names

and

Locations

the

Units 　11

2.1.1 　Units Accessible

rom

the

ront 　12

2.1.2 　Units Accessible

rom

the

Rear 　13

2.1.3 　Internal

Units 　14

2.2 　Checking

the

Memory

Configuration

Rules 　15

2.2.1 　Memory

Installation

Rules 　16

2.2.2 　Checking

Memory

Information 　21

iii

2.3 　Understanding

the

OPNL

unctions 　22

2.3.1 　OPNL Display

unction 　24

2.3.2 　OPNL Control

unction 　24

2.4 　Understanding

the

LED

Indications 　26

2.4.1 　OPNL LEDs 　26

2.4.2 　System

Locator 　28

2.4.3 　LEDs of

Each

Unit 　29

2.5 　Understanding

the

Types

Cable 　36

2.5.1 　Types of

Cable 　36

2.5.2 　Ports for

Cable

Connections 　36

Chapter

3　Understanding

the

Types

Maintenance　39

3.1 　Types of

Maintenance 　40

3.2 　Types of

Maintenance

Applicable

the

SPARC

M12-2 　43

3.2.1 　Types of

Maintenance

for

Replacement

(SPARC

M12-2) 　

3.2.2 　Types of

Maintenance

for

Addition

(SPARC

M12-2) 　45

3.2.3 　Types of

Maintenance

for

Removal

(SPARC

M12-2) 　46

3.3 　Types of

Maintenance

Applicable

the

SPARC

M12-2S

(1BB

Configuration) 　48

3.3.1 　Types of

Maintenance

for

Replacement

(SPARC

M12-2S

the

1BB

Configuration) 　48

3.3.2 　Types of

Maintenance

for

Addition

(SPARC

M12-2S

the

1BB

Configuration) 　50

3.3.3 　Types of

Maintenance

for

Removal

(SPARC

M12-2S

the

1BB

Configuration) 　53

3.4 　Types of

Maintenance

Applicable

the

SPARC

M12-2S

(Multiple-BB

Configuration) 　55

3.4.1 　Types of

Maintenance

for

Replacement

(SPARC

M12-2S

Multiple-BB

Configuration) 　55

3.4.2 　Types of

Maintenance

for

Addition

(SPARC

M12-2S

the

Multiple-BB

Configuration) 　60

Fujitsu

SPARC

M12-2/M12-2S

Service

Manual

･

January

2023iv

3.4.3 　Types of

Maintenance

for

Removal

(SPARC

M12-2S

the

Multiple-BB

Configuration) 　64

Chapter

　FRU

Replacement

Workflows　69

4.1 　Active/Hot

Replacement

Workflows 　69

4.1.1 　Active/Hot

Replacement

Workflow

the

XSC U 　70

4.1.2 　Active/Hot

Replacement

Workflow

PCIe

Card 　71

4.1.3 　Active/Hot

Replacement

Workflow

the

Power

Supply

Unit

(PSU) 　72

4.1.4 　Active/Hot

Replacement

Workflow

the

ANU 　72

4.1.5 　Active/Hot

Replacement

Workflow

the

HDD/SSD 　73

4.1.6 　Active/Hot

Replacement

Workflow

the

PCI

Expansion

Unit 　

4.2 　Active/Cold

Replacement

Workflows 　76

4.2.1 　Active/Cold

Replacement

Workflow

the

XSC U 　76

4.2.2 　Active/Cold

Replacement

Workflow

PCIe

Card 　78

4.2.3 　Active/Cold

Replacement

Workflow

the

PSU 　79

4.2.4 　Active/Cold

Replacement

Workflow

the

ANU 　81

4.2.5 　Active/Cold

Replacement

Workflow

the

ANBPU 　82

4.2.6 　Active/Cold

Replacement

Workflow

the

HDD/SSD 　83

4.2.7 　Active/Cold

Replacement

Workflow

the

HDDBPU 　85

4.2.8 　Active/Cold

Replacement

Workflow

the

OPNL 　86

4.2.9 　Active/Cold

Replacement

Workflow

the

CMU 　87

4.2.10 　Active/Cold

Replacement

Workflow

Memory 　89

4.2.11 　Active/Cold

Replacement

Workflow

the

BPU 　90

4.2.12 　Active/Cold

Replacement

Workflow

the

PSUBP 　91

4.2.13 　Active/Cold

Replacement

Workflow

the

PCI

Expansion

Unit

4.2.14 　Active/Cold

Replacement

Workflow

the

XSC

DUAL

Control

Cable 　94

4.2.15 　Active/Cold

Replacement

Workflow

the

XSC

Control

Cable 　96

Contents v

4.3 　Inactive/Hot

Replacement

Workflows 　97

4.3.1 　Inactive/Hot

Replacement

Workflow

the

XSC U 　97

4.3.2 　Inactive/Hot

Replacement

Workflow

PCIe

Card 　98

4.3.3 　Inactive/Hot

Replacement

Workflow

the

PSU 　99

4.3.4 　Inactive/Hot

Replacement

Workflow

the

ANU 　100

4.3.5 　Inactive/Hot

Replacement

Workflow

the

HDD/SSD 　101

4.3.6 　Inactive/Hot

Replacement

Workflow

the

PCI

Expansion

Unit

102

4.4 　Inactive/Cold

Replacement

Workflows 　103

4.4.1 　Inactive/Cold

Replacement

Workflow

the

XSC U 　104

4.4.2 　Inactive/Cold

Replacement

Workflow

PCIe

Card 　106

4.4.3 　Inactive/Cold

Replacement

Workflow

the

PSU 　107

4.4.4 　Inactive/Cold

Replacement

Workflow

the

ANU 　108

4.4.5 　Inactive/Cold

Replacement

Workflow

the

ANBPU 　109

4.4.6 　Inactive/Cold

Replacement

Workflow

the

HDD/SSD 　110

4.4.7 　Inactive/Cold

Replacement

Workflow

the

HDDBPU 　112

4.4.8 　Inactive/Cold

Replacement

Workflow

the

OPNL 　113

4.4.9 　Inactive/Cold

Replacement

Workflow

the

CMU 　114

4.4.10 　Inactive/Cold

Replacement

Workflow

Memory 　115

4.4.11 　Inactive/Cold

Replacement

Workflow

the

BPU 　116

4.4.12 　Inactive/Cold

Replacement

Workflow

the

PSUBP 　117

4.4.13 　Inactive/Cold

Replacement

Workflow

the

Crossbar

Cable 　

119

4.4.14 　Inactive/Cold

Replacement

Workflow

the

XBU 　120

4.4.15 　Inactive/Cold

Replacement

Workflow

the

PCI

Expansion

Unit 　121

4.4.16 　Inactive/Cold

Replacement

Workflow

the

XSC

DUAL

Control

Cable 　122

4.4.17 　Inactive/Cold

Replacement

Workflow

the

XSC

Control

Cable 　123

4.5 　System-Stopped/Hot

Replacement

Workflows 　125

Fujitsu

SPARC

M12-2/M12-2S

Service

Manual

･

January

2023vi

4.5.1 　System-Stopped/Hot

Replacement

Workflow

the

XSC U 　125

4.5.2 　System-Stopped/Hot

Replacement

Workflow

PCIe

Card 　

126

4.5.3 　System-Stopped/Hot

Replacement

Workflow

the

PSU 　127

4.5.4 　System-Stopped/Hot

Replacement

Workflow

the

ANU 　128

4.5.5 　System-Stopped/Hot

Replacement

Workflow

the

HDD/SSD 　

129

4.5.6 　System-Stopped/Hot

Replacement

Workflow

the

PCI

Expansion

Unit 　130

4.6 　System-Stopped/Cold

Replacement

Workflows 　131

4.6.1

System-Stopped/Cold

Replacement

Workflow

the

XSCFU

1 2

4.6.2 　System-Stopped/Cold

Replacement

Workflow

PCIe

Card 　

133

4.6.3 　System-Stopped/Cold

Replacement

Workflow

the

PSU 　134

4.6.4

System-Stopped/Cold

Replacement

Workflow

the

FANU

1 5

4.6.5 　System-Stopped/Cold

Replacement

Workflow

the

ANBPU 　

136

4.6.6 　System-Stopped/Cold

Replacement

Workflow

the

HDD/SSD

137

4.6.7 　System-Stopped/Cold

Replacement

Workflow

the

HDDBPU 　

138

4.6.8 　System-Stopped/Cold

Replacement

Workflow

the

OPNL 　139

4.6.9 　System-Stopped/Cold

Replacement

Workflow

the

CMU 　140

4.6.10 　System-Stopped/Cold

Replacement

Workflow

Memory 　141

4.6.11 　System-Stopped/Cold

Replacement

Workflow

the

BPU 　142

4.6.12 　System-Stopped/Cold

Replacement

Workflow

the

PSUBP 　

143

4.6.13 　System-Stopped/Cold

Replacement

Workflow

the

Crossbar

Cable 　144

4.6.14 　System-Stopped/Cold

Replacement

Workflow

the

XBU 　145

Contents vii

4.6.15 　System-Stopped/Cold

Replacement

Workflow

the

XSC

DUAL

Control

Cable 　146

4.6.16 　System-Stopped/Cold

Replacement

Workflow

the

XSC

Control

Cable 　147

4.6.17 　System-Stopped/Cold

Replacement

Workflow

the

PCI

Expansion

Unit 　148

Chapter

5　FRU

Addition

Workflows　151

5.1 　Active/Hot

Addition

Workflows 　151

5.1.1 　Active/Hot

Addition

Workflow

PCIe

Card 　152

5.1.2 　Active/Hot

Addition

Workflow

the

HDD/SSD 　152

5.1.3 　Active/Hot

Addition

Workflow

the

PCI

Expansion

Unit 　153

5.2 　Active/Cold

Addition

Workflows 　154

5.2.1 　Active/Cold

Addition

Workflow

PCIe

Card 　155

5.2.2 　Active/Cold

Addition

Workflow

the

HDD/SSD 　156

5.2.3 　Active/Cold

Addition

Workflow

the

CMUU 　158

5.2.4 　Active/Cold

Addition

Workflow

Memory 　159

5.2.5 　Active/Cold

Addition

Workflow

the

PCI

Expansion

Unit 　161

5.2.6 　Active/Cold

Addition

Workflow

the

SPARC

M12-2S 　162

5.3 　Inactive/Hot

Addition

Workflows 　164

5.3.1 　Inactive/Hot

Addition

Workflow

PCIe

Card 　164

5.3.2 　Inactive/Hot

Addition

Workflow

the

HDD/SSD 　165

5.3.3 　Inactive/Hot

Addition

Workflow

the

PCI

Expansion

Unit 　

166

5.4 　Inactive/Cold

Addition

Workflows 　167

5.4.1 　Inactive/Cold

Addition

Workflow

PCIe

Card 　168

5.4.2 　Inactive/Cold

Addition

Workflow

the

HDD/SSD 　169

5.4.3 　Inactive/Cold

Addition

Workflow

the

CMUU 　170

5.4.4 　Inactive/Cold

Addition

Workflow

Memory 　172

5.4.5 　Inactive/Cold

Addition

Workflow

the

PCI

Expansion

Unit 　

174

5.4.6 　Inactive/Cold

Addition

Workflow

the

SPARC

M12-2S 　175

Fujitsu

SPARC

M12-2/M12-2S

Service

Manual

･

January

2023viii

5.5 　System-Stopped/Hot

Addition

Workflows 　176

5.5.1 　System-Stopped/Hot

Addition

Workflow

PCIe

Card 　177

5.5.2 　System-Stopped/Hot

Addition

Workflow

the

HDD/SSD 　177

5.5.3 　System-Stopped/Hot

Addition

Workflow

the

PCI

Expansion

Unit 　178

5.6 　System-Stopped/Cold

Addition

Workflows 　180

5.6.1 　System-Stopped/Cold

Addition

Workflow

PCIe

Card 　180

5.6.2 　System-Stopped/Cold

Addition

Workflow

the

HDD/SSD 　181

5.6.3 　System-Stopped/Cold

Addition

Workflow

the

CMUU 　182

5.6.4 　System-Stopped/Cold

Addition

Workflow

Memory 　183

5.6.5 　System-Stopped/Cold

Addition

Workflow

the

PCI

Expansion

Unit 　184

5.6.6 　System-Stopped/Cold

Addition

Workflow

the

SPARC

M12-2S

186

Chapter

6　FRU

Removal

Workflows　189

6.1 　Active/Hot

Removal

Workflows 　189

6.1.1 　Active/Hot

Removal

Workflow

PCIe

Card 　190

6.1.2 　Active/Hot

Removal

Workflow

the

HDD/SSD 　191

6.1.3 　Active/Hot

Removal

Workflow

the

PCI

Expansion

Unit 　191

6.2 　Active/Cold

Removal

Workflows 　192

6.2.1 　Active/Cold

Removal

Workflow

PCIe

Card 　193

6.2.2 　Active/Cold

Removal

Workflow

the

HDD/SSD 　195

6.2.3 　Active/Cold

Removal

Workflow

the

CMUU 　196

6.2.4 　Active/Cold

Removal

Workflow

Memory 　198

6.2.5 　Active/Cold

Removal

Workflow

the

PCI

Expansion

Unit 　199

6.2.6 　Active/Cold

Removal

Workflow

the

SPARC

M12-2S 　201

6.3 　Inactive/Hot

Removal

Workflows 　202

6.3.1 　Inactive/Hot

Removal

Workflow

PCIe

Card 　203

6.3.2 　Inactive/Hot

Removal

Workflow

the

HDD/SSD 　204

6.3.3 　Inactive/Hot

Removal

Workflow

the

PCI

Expansion

Unit 　205

6.4 　Inactive/Cold

Removal

Workflows 　206

Contents ix

6.4.1 　Inactive/Cold

Removal

Workflow

PCIe

Card 　207

6.4.2 　Inactive/Cold

Removal

Workflow

the

HDD/SSD 　208

6.4.3 　Inactive/Cold

Removal

Workflow

the

CMUU 　209

6.4.4 　Inactive/Cold

Removal

Workflow

Memory 　211

6.4.5 　Inactive/Cold

Removal

Workflow

the

PCI

Expansion

Unit 　

212

6.4.6 　Inactive/Cold

Removal

Workflow

the

SPARC

M12-2S 　214

6.5 　System-Stopped/Hot

Removal

Workflows 　215

6.5.1 　System-Stopped/Hot

Removal

Workflow

PCIe

Card 　215

6.5.2 　System-Stopped/Hot

Removal

Workflow

the

HDD/SSD 　216

6.5.3 　System-Stopped/Hot

Removal

Workflow

the

PCI

Expansion

Unit 　217

6.6 　System-Stopped/Cold

Removal

Workflows 　219

6.6.1 　System-Stopped/Cold

Removal

Workflow

PCIe

Card 　219

6.6.2 　System-Stopped/Cold

Removal

Workflow

the

HDD/SSD 　221

6.6.3 　System-Stopped/Cold

Removal

Workflow

the

CMUU 　222

6.6.4 　System-Stopped/Cold

Removal

Workflow

Memory 　223

6.6.5 　System-Stopped/Cold

Removal

Workflow

the

PCI

Expansion

Unit 　224

6.6.6 　System-Stopped/Cold

Removal

Workflow

the

SPARC

M12-2S

226

Chapter

7　FRU

Maintenance

Precautions　227

7.1 　Precautions

for

Replacement 　227

7.2 　Precautions

for

Expansion 　230

7.3 　Precautions

for

Reduction 　232

Chapter

8　Preparation

for

Maintenance　235

8.1 　Checking

the

System

Configuration 　235

8.1.1 　Checking

Logical

Domain

Configuration

Information 　235

8.1.2 　Checking

Hardware 　236

8.1.3 　Checking

the

XCP

irmware

Version 　241

8.1.4 　Checking

the

Software

Version 　243

Fujitsu

SPARC

M12-2/M12-2S

Service

Manual

･

January

2023x

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